Power Semiconductors Weekly

Infineon Technologies unveiled the next milestone in #semiconductor manufacturing technology. Infineon Technologies has reached a breakthrough in handling and processing the thinnest #silicon power wafers ever manufactured, with a thickness of only 20 micrometers and a diameter of 300 millimeters, in a high-scale semiconductor fab. The ultra-thin silicon wafers are only a quarter as thick as a human hair and half as thick as current state-of-the-art wafers of 40-60 micrometers.

Time to wish all and everyone a very lovely Christmas time! Enjoy this festive season with your family and friends, recharge your batteries and gear up for exciting year ahead! For me and my family this was quite a year full of new adventures and challenges, meeting new friends and colleagues, settling in a new wonderful place. For sure, more is yet to come. I love a Chinese saying 'when the winds of change blow, some people build walls, others build windmills'. So, in turbulent times, make a good use of every 'wind' blowing into your face! Happy holiday season to all! And a Happy New Year! PS: as always, stay up to date with #powersemiconductors industry by following Power Semiconductors Weekly! Latest recap of the past several weeks is here to entertain you during joyful holidays time. Next one is set to be delivered early February with new content to enjoy, so, don't miss it! Power Semiconductors Weekly Infineon Technologies STMicroelectronics Navitas Semiconductor Wolfspeed Vishay Intertechnology, Inc. Ideal Power Inc. Littelfuse Toshiba Electronic Devices & Storage Corporation Mitsubishi Electric onsemi Cambridge GaN Devices Ltd Texas Instruments Qorvo, Inc. X-FAB Nexperia Power Integrations EPC - Efficient Power Conversion Veeco Axcelis Technologies NXP Semiconductors Microchip Technology Inc. SemiQ Power Master Semiconductor ROHM Co., Ltd. CVD Equipment Corporation VisIC Technologies Ltd. EPC Space Analog Devices

Texas Instruments and the U.S. Department of Commerce announced an award agreement of up to $1.6 billion in direct funding through the U.S. CHIPS and Science Act, following the preliminary memorandum of terms announced in August 2024. The funding will help support three of TI’s new 300mm wafer fabs currently under construction in Texas and Utah. Support from the CHIPS Act, including the 25% investment tax credit, will help TI provide a geopolitically dependable supply of essential analog and embedded processing semiconductors.

Littelfuse announced the launch of its TPSMB Asymmetrical TVS Diode Series, the first-to-market asymmetrical transient voltage suppression (TVS) diode specifically designed for the protection of #SiC #MOSFET gate drivers in automotive applications.

GlobalFoundries has joined the LOT Network, the world’s largest patent licensing platform and non-profit community of global companies committed to protecting themselves against costly litigation from patent assertion entities (PAEs). With this move, GF joins a community of more than 4,500 companies that include half of the top 20 largest U.S. patent holders, and half of the S&P Global 100 and Fortune 100.

X-FAB Silicon Foundries has launched XSICM03, its next-generation XbloX platform, advancing #SiliconCarbide process technology for power #MOSFETs, delivering significantly reduced cell pitch, enabling increased die per wafer and improved on-state resistance without compromising reliability.

Ideal Power Inc. secured its first design win for solid-state circuit breakers (SSCBs) with one of the largest circuit protection equipment manufacturers in Asia serving the industrial and utility markets. In connection with this design win, the company entered into a joint development agreement for a SSCB product incorporating multiple B-TRAN® devices. The agreement includes the product design, prototype builds and testing of the SSCB which is targeted for completion in the second quarter of 2025 to be followed by commercial sales later in the year.

Bosch has signed a preliminary memorandum of terms (PMT) under the CHIPS and Science Act with the U.S. Department of Commerce (DoC). It includes up to $225 million in proposed direct funding to support the transformation of the Bosch production facility in Roseville, California. The proposed investment would support the development of #semiconductor manufacturing in the U.S. Bosch plans to invest up to $1.9 billion to transform the Roseville site into a facility that produces and tests #siliconcarbide #semiconductors. The Roseville site currently employs around 250 associates with potential to grow in the future.

Infineon Technologies and EVE Energy Co.,Ltd. signed a memorandum of understanding to enable comprehensive battery management system solutions for the automotive market. As part of the MoU, Infineon will supply a complete chipset, including microcontroller units, balancing and monitoring ICs, power management ICs, drivers, #MOSFETs, controller area networks and sensor products. Equipped with these solutions, EVE Energy’s battery management system can provide high safety, high reliability and optimized cost.

onsemi has unveiled plans to acquire Qorvo, Inc.’s #SiliconCarbide #JFET business, a strategic move that enhances its portfolio in high- and mid-voltage #powersemiconductors. The $115 million deal includes Qorvo’s United SiC subsidiary and is expected to close in Q1 2025. This acquisition is projected to expand onsemi’s market opportunity by $1.3 billion by 2030, focusing on #AI, #datacenters, #EVs, and industrial markets. By leveraging its vertically integrated #SiC supply chain, onsemi aims to boost efficiency, profitability, and innovation across key technology areas.