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Liang Yuan Dai
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2020 – today
- 2024
- [j1]Zhenguo Wu, Liang Yuan Dai, Yuyang Wang, Songli Wang, Keren Bergman:
Flexible silicon photonic architecture for accelerating distributed deep learning. J. Opt. Commun. Netw. 16(2): 157 (2024) - 2023
- [c8]George Michelogiannakis, Yehia Arafa, Brandon Cook, Liang Yuan Dai, Abdel-Hameed A. Badawy, Madeleine Glick, Yuyang Wang, Keren Bergman, John Shalf:
Efficient Intra-Rack Resource Disaggregation for HPC Using Co-Packaged DWDM Photonics. CLUSTER 2023: 158-172 - [c7]Zhenguo Wu, Liang Yuan Dai, Ziyi Zhu, Asher Novick, Madeleine Glick, Keren Bergman:
SiP Architecture For Accelerating Collective Communication in Distributed Deep Learning. OFC 2023: 1-3 - [i1]George Michelogiannakis, Yehia Arafa, Brandon Cook, Liang Yuan Dai, Abdel-Hameed A. Badawy, Madeleine Glick, Yuyang Wang, Keren Bergman, John Shalf:
Efficient Intra-Rack Resource Disaggregation for HPC Using Co-Packaged DWDM Photonics. CoRR abs/2301.03592 (2023) - 2022
- [c6]Maarten Hattink, Liang Yuan Dai, Ziyi Zhu, Keren Bergman:
Streamlined Architecture for Thermal Control and Stabilization of Cascaded DWDM Micro-Ring Filters Bus. OFC 2022: 1-3 - 2020
- [c5]Liang Yuan Dai, Yu-Han Hung, Qixiang Cheng, Keren Bergman:
Experimental Demonstration of PAM-4 Transmission through Microring Silicon Photonic Clos Switch Fabric. OFC 2020: 1-3
2010 – 2019
- 2019
- [c4]Yu-Han Hung, Qixiang Cheng, Meisam Bahadori, Madeleine Glick, Liang Yuan Dai, Keren Bergman:
Highly-Efficient Optical Equalization Using a Silicon Photonic Switch for Pulsewidth Distortion Mitigation. OECC/PSC 2019: 1-3 - 2018
- [c3]Qixiang Cheng, Liang Yuan Dai, Meisam Bahadori, Nathan C. Abrams, Padraic E. Morrissey, Madeleine Glick, Peter O'Brien, Keren Bergman:
Si/SiN Microring-Based Optical Router in Switch-and-Select Topology. ECOC 2018: 1-3 - [c2]Nathan C. Abrams, Robert P. Polster, Liang Yuan Dai, Keren Bergman:
High Throughput Bandwidth Characterization of Silicon Photonic Modulators using Offset Frequency Combs. OFC 2018: 1-3 - [c1]Robert Polster, Liang Yuan Dai, Oscar A. Jimenez, Qixiang Cheng, Michal Lipson, Keren Bergman:
Wafer-scale High-Density Edge Coupling for High Throughput Testing of Silicon Photonics. OFC 2018: 1-3
Coauthor Index
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last updated on 2024-08-05 20:24 CEST by the dblp team
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