AEMtec GmbH

STRIVE FOR CO2 NEUTRALITY - AN IMPORTANT STEP As the AEMtec team, we believe that environmental protection is essential and have therefore adopted eco-friendly policies. We are taking significant steps toward environmental sustainability! Initiatives, like maintaining strict quality control and reducing emissions, using renewable electricity since 2022, heat bump for recovery energy from production to heat the building, local waste recycling system and many more. With the recent installation of charging stations, we not only empower our employees with affordable access to electric power but also make a meaningful contribution toward environmental sustainability.  We strive for CO2 neutrality. Our colleague Max explains the newest measurement in our roadmap to CO2 neutrality.

WRAPPING UP a successful week at electronica! Last week, we had the pleasure of exhibiting at electronica, where we engaged in lively discussions with our customers and many new potential partners. A highlight for us was the keen interest shown in our wide-ranging technology portfolio—a testament to our versatility and innovation in the field of opto and microelectronics. We’re proud to showcase our diverse manufacturing processes, and we’re excited about the new connections and opportunities that emerged during the event. And one that captured attention was our AU Stud Bumping process. Check out the attached video to see AU Stud Bumping in action! Thank you to everyone who visited our booth and made it an impressive experience! Here’s to shaping the future of electronics together.   #Electronica2024 #InnovationInElectronics #OptoElectronics #Microelectronics #AEMtec, #AdvancedElectronicMicrosystems

ELECTROLESS UBM PROCESS IN-HOUSE We are pleased that AEMtec has transferred the electroless UBM process, developed by Fraunhofer IZM, into our facility. This enables more flexibility in various aspects of the process: emerging problems can be overcome faster, the logistics and quality assurance can be optimized, the staff organization is facilitated and the equipment accessibility is enhanced. As part of several products, the UBM process is essential in the process chain of AEMtec. The new UBM equipment has been adapted to our requirements and optimized regarding process issues and safety for users. With in-house UBM equipment we are expecting huge advantages for our customers. Watch our video and listen to Robin, he explains the benefits.  

OUR TEAM WELCOMES YOU TO ELECTRONICA! electronica is in full swing and we are excited to connect with you! Find us at booth B1.119 in Hall B1. Our experts will answer questions all around cutting-edge microtechnology. Discover tailored solutions, developed, designed and manufactured for high demands on reliable microelectronics. Get first impressions here. #electronica #aemtec #microtechnology #reliability    

We Did It – 2000 Followers! A huge THANK YOU to each one of you for helping us reach this milestone! Hitting 2,000 followers is no small feat, and we couldn’t have done it without your support and trust. We’re thrilled to have you on this journey with us and are excited for what’s ahead. Let’s keep growing together! Help us spread the word – recommend us, follow us, and stay tuned for more insights into our exciting work. GREAT! #ThankYou #Milestone #2000Followers #FollowUs #AEMtec #OutstandingWork 

WIREBONDING BY AEMtec Wire bonding is a process used in semiconductor manufacturing and microelectronics to create electrical interconnections between 2 contact pads of typically a semiconductor device (such as a microchip) and its packaging (such as a pcb or ceramic). It involves bonding fine wires, usually made of gold, aluminum, silver or copper, enabling signal transmission from the chip to the circuit. Developed more than 60 years ago wire bonding is a well-known process and still one of the most flexible interconnection methods for electronic devices. It can be used for fast prototyping as well as for high volume production with one or hundreds of interconnections per device. AEMtec offers a range of fine wire bonding techniques, including ball bonding and stud bump bonding using gold wires and wedge bonding using gold or aluminum wires, as part of our "Chip on Board" (COB) technologies and also on wafer level up to 12 inch. We combine soldering, gluing, and specialized processes like potting (Gloptop, Dam & Fill) to meet precise requirements. COB's advantages include compact design, high-density packing, and fine placement accuracy, supporting both small-scale and large die bonding needs. Listen to Stefan, who is very familiar with the wire bonding process.

JUST A FEW DAYS TO GO! Just a few days to go! The electronica is about to open its doors, and we are looking forward to connect with you. Stop by our booth to discover the latest in tech innovation! Be convinced from our wide technology portfolio in the world of opto and microelectronics. Don’t miss it – see you there!  #microsystems, #AEMtec, #electronica, #innovations

READY TO GO! We are thrilled to announce that we will be showcasing at the electronica in Munich! Every two years, all electronic experts meet in Munich for the world-leading trade fair electronica. AEMtec has also been an integral part of this important meeting point and source of inspiration for the electronics industry for years. Initiate the dialogue with our team and discover more about our role as a leading global provider of Engineering & Electronic Manufacturing Services (E2MS), focusing on customized micro- and optoelectronic systems. AEMtec is specialises in product and process development, production of high-end opto-electronic modules, devices and systems. Customers worldwide appreciate the wide technology portfolio which includes Wafer Back-End Services, Chip on Board, Flip Chip, System Integration and Opto Packaging. Take also the opportunity to learn more about our new UBM line. Our new UBM line is fully installed, and we're gearing up for the first manufacturing processes, planned for November.  #electronica, #Microsystems, #UBM, #SolderBalling, #Events

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Wahlgruppentreffen - Ein spannender Tag in Berlin Adlershof! Am 14.10. fand das Wahlgruppentreffen der IHK in den Räumlichkeiten der AEMtec in Berlin Adlershof statt. Gastgeber, Jan Trommershausen, empfing Vertreter von Industrieunternehmen diverser Branchen sowie der IHK. Die Sitzung wurde von IHK-Präsidiumsmitglied, Herr Dr. Christian Matschke der Berlin Chemie, eröffnet. Vielfältige Themen wurden vorgetragen und diskutiert, großes Interesse galt dem CSRD-Reporting. Im Anschluss fand eine Werksführung in der modernen Produktionsstätte statt. Das breite Spektrum der AEMtec Leistungen im Bereich der Mikrotechnologie fand hohe Beachtung bei den Mitgliedern. Mit neuen Eindrücken und einer lebhaften Diskussionsrunde im Gepäck verließen die Teilnehmer das Treffen. AEMtec zählt zu den weltweit führenden Spezialisten im Bereich Entwicklung und Produktion von komplexen mikro- und optoelektronischen Modulen bis hin zu kompletten Systemen. Das breite Technologieportfolio ist nahezu einzigartig. #aemtec, #Mikrotechnologie, #Wahlgruppentreffen, #IHK