ERS electronic GmbH

Happy #Thanksgiving! 🍁 We’re grateful for our amazing colleagues, partners, and followers in the US. Wishing you and your loved ones a joyful, safe and happy holiday ✨

In two weeks, we return #Tokyo for the final Semicon of the year! Meet our CEO Laurent Giai-Miniet and Regional Sales Manager Regine Beckmann together with our Japanese channel partner ONC Inc. in Booth 3035. See you soon! 👋

Fan-out Panel-Level Packaging (#FOPLP) is making waves in Advanced Packaging, offering cost savings, scalability, and simplified integration. 📈 This trend aligns perfectly with our longstanding experience in developing cutting-edge #debonding and #warpage handling equipment for FOPLP, from semi-automatic solutions for R&D and NPD to fully automated systems for high-volume production. Read the insightful article from Semiconductor Engineering to learn more about the growing momentum in FOPLP and contact us at info@ers-gmbh.de to learn more about our solutions!

🌟 Die nächste Generation für #Halbleiter begeistern! 🌟 Letzte Woche hatten Imre Kosa und das ERS Barbing-Team das Vergnügen, einen neugierigen Schüler für ein einwöchiges #Praktikum in unserer Produktionsstätte in Barbing zu empfangen, wo er aus erster Hand einen Einblick in den faszinierenden Prozess der Herstellung modernster Halbleiterausrüstung erhielt. Schulpraktika sind ideal, um jungen Menschen die vielfältigen Möglichkeiten in der #Halbleiterindustrie aufzuzeigen, und wir hoffen, noch viele weitere Schülerinnen und Schüler begrüßen zu dürfen!

Augustin, our Head of Production, was recognized as one of this year’s #20Under30 award winners during #SemiconEuropa this week! 🎉 Swipe through to learn more about his journey—what brought him to ERS, the achievements that shaped his #career, and his advice for aspiring young professionals. A big thank you to SEMI Europe for this fantastic initiative that spotlights young #talent and future leaders in our industry. Congratulations again to all the amazing winners! 🏆

A big thank you to 3D InCites for yet another fantastic #Stammtisch! 🍻 It was a great evening reconnecting with our colleagues in the community and getting into the Christmas spirit with some Eisstockschiessen. Despite strong competition, our ERS colleagues, together with Francesco Cattaneo and Richard Noack, took home the gold medal 💪 Looking forward to next year already!

Our VP and Head of #AdvancedPackaging Solutions, Debbie Claire Sanchez, presented at the International Symposium on Microelectronics and Packaging in Busan, Korea yesterday! She presented our #PhotoThermal debonding technology, which is featured in our #Luminex product line, consisting of semi-automatic and automatic machines for wafers and panels. 💡 Did you know that PhotoThermal debonding can save more than 30% in operating costs compared to traditional laser debonding?

We are absolutely thrilled to see our Head of Production, Augustin Detruit on the list of SEMI Europe's #20Under30 Winners 🎉 Congratulations to Augustin and all the other impressive young talents who are shaping the future of the #semiconductor industry!

Our VP and GM of ERS China Joshua Zhou has been invited to present on PhotoThermal Debonding with Glass Carrier at a Through Glass Via (#TGV) forum in Shenzhen, China, on November 6. Using a special glass carrier with a zero-transmittance light absorbing layer, ERS’s PhotoThermal Debonding technology is ideal for applications like #CoWoS, High Bandwidth Memory (#HBM), and Wafer Thinning (#SiC, #GaN). In his presentation, Joshua will explore this technology in-depth, along with our Luminex product line of automatic and semi-automatic machines for wafers and panels. 

We are thrilled to announce that Debbie Claire Sanchez is an invited speaker at next week's International Symposium on Microelectronics and Packaging (ISMP) in #Korea! Don't miss the chance to watch her presentation and learn about the advantages of our #PhotoThermal debonding technology and #Luminex product line.