IHP

If you're attending Electronica, make sure to stop by our booth at B4 140! Meet our experts, enjoy a great conversation, and this time, don’t miss the chance to try the VR glasses for a virtual walk through the FMD - Forschungsfabrik Mikroelektronik Deutschland Showroom. Looking forward to seeing you there!

𝐀𝐭𝐭𝐞𝐧𝐭𝐢𝐨𝐧 𝐨𝐩𝐞𝐧 𝐬𝐨𝐮𝐫𝐜𝐞 𝐞𝐧𝐭𝐡𝐮𝐬𝐢𝐚𝐬𝐭𝐬! The second 𝐈𝐇𝐏 𝐎𝐩𝐞𝐧𝐌𝐏𝐖 run is near—submit your open-source designs using the IHP 130nm BiCMOS Open Source PDK 𝐛𝐲 𝐍𝐨𝐯𝐞𝐦𝐛𝐞𝐫 11, 2024 on GitHub https://lnkd.in/eVR4iZPa Join us in advancing BiCMOS technology in the open-source community!

Dr. Krzysztof Piotrowski, Head of IHP’s Intelligent IoT Systems Group, has been appointed Professor for Distributed Measurement Systems and Sensor Networks at Brandenburgische Technische Universität Cottbus-Senftenberg (BTU). This appointment strengthens the collaborative research between BTU and IHP, addressing challenges in wireless sensor networks and advancing joint scientific achievements. His efforts also enhance IHP and BTU’s collaboration with the University of Zielona Góra, with which we have a joint lab. This is a great contribution to the scientific excellence and visibility of the region. Congratulations to Prof. Dr. Krzysztof Piotrowski! We are proud to have you on board! Read more in our press release: https://lnkd.in/eY4iASVZ

The 23𝐫𝐝 𝐈𝐇𝐏 𝐓𝐞𝐜𝐡𝐧𝐨𝐥𝐨𝐠𝐲 & 𝐒𝐞𝐫𝐯𝐢𝐜𝐞 𝐖𝐨𝐫𝐤𝐬𝐡𝐨𝐩 took place on October 8th, 2024, marking a continuation of our annual tradition. The workshop featured IHP's latest advancements in 𝐈𝐧𝐭𝐞𝐠𝐫𝐚𝐭𝐞𝐝 𝐂𝐢𝐫𝐜𝐮𝐢𝐭𝐬, 𝐒𝐲𝐬𝐭𝐞𝐦 𝐀𝐫𝐜𝐡𝐢𝐭𝐞𝐜𝐭𝐮𝐫𝐞𝐬, and 𝐓𝐞𝐜𝐡𝐧𝐨𝐥𝐨𝐠𝐢𝐞𝐬 𝐟𝐨𝐫 𝐒𝐦𝐚𝐫𝐭 𝐒𝐲𝐬𝐭𝐞𝐦𝐬.     This year's highlights included: 🔶 The SiGe-“x”CMOS representing the most complex technologies developed and provided by IHP, including the newest G3 and G2+ generations 🔶 The new H7EPIC is under development with more details on Early Access to be announced in the first quarter of 2025 🔶 The IHP PIC platform is being enhanced by two new device options (InP-Laser and PIC-SX) 🔶 Hetero-& chiplet integration offer is being optimized (e.g. SiGe-BiCMOS-on-Interposer) 🔶 Free MPW Runs as a support for open source PDK and open source designs 🔶 Cryo-PDK enabling IC design in CAD tools at 4K We look forward to welcoming you again next year—stay tuned for dates and details!

🚀 6𝐆 𝐑𝐈𝐂: 𝐖𝐨𝐫𝐥𝐝-𝐅𝐢𝐫𝐬𝐭 𝐃𝐞𝐦𝐨𝐧𝐬𝐭𝐫𝐚𝐭𝐢𝐨𝐧 𝐃-𝐁𝐚𝐧𝐝 𝐋𝐢𝐧𝐞-𝐨𝐟-𝐒𝐢𝐠𝐡𝐭 𝐌𝐈𝐌𝐎 𝐥𝐢𝐧𝐤 𝐚𝐭 𝐜𝐚𝐫𝐫𝐢𝐞𝐫 𝐟𝐫𝐞𝐪𝐮𝐞𝐧𝐜𝐲 𝐨𝐟 135 𝐆𝐇𝐳 🔶 On October 10th and 11th, the IHP team had the pleasure of participating in the 6G-RIC Advisory Board Meeting & Workshop at the Science-Tech Space Fraunhofer Heinrich Hertz Institute HHI. The central theme was “6G Technology Advancements: Highlights & Future Directions.” 🔶 IHP Highlights: Our stand featured two pioneering wireless link demonstrations: 𝐃-𝐁𝐚𝐧𝐝 𝐋𝐢𝐧𝐞-𝐨𝐟-𝐒𝐢𝐠𝐡𝐭 𝐌𝐈𝐌𝐎 by Darko Cvetkovski 240 𝐆𝐇𝐳 𝐒𝐢𝐧𝐠𝐥𝐞-𝐂𝐚𝐫𝐫𝐢𝐞𝐫 𝐋𝐢𝐧𝐤 by Matthias Scheide Both demos leverage RF Front-Ends developed in IHP's 130nm SiGe BiCMOS technology, demonstrating remarkable progress in wireless communication. 🔶 World-First Demonstration: A key highlight was Darko Cvetkovski’s live demo of a 𝐰𝐨𝐫𝐥𝐝-𝐟𝐢𝐫𝐬𝐭 𝐃-𝐁𝐚𝐧𝐝 𝐋𝐢𝐧𝐞-𝐨𝐟-𝐒𝐢𝐠𝐡𝐭 𝐌𝐈𝐌𝐎 𝐥𝐢𝐧𝐤 operating at a carrier frequency of 135GHz. By multiplexing two QPSK-modulated data streams with a 4GHz RF bandwidth, this wireless link currently achieves an impressive 16Gb/s throughput, with ongoing efforts to enhance performance even further. 🔶 About 6G-RIC: The 6G-RIC Research and Innovation Cluster (6G-RIC) is a research hub dedicated to laying the foundation for the next generation of mobile communications (6G) across all tech levels, from radio access to core networks and fiber optic transport. Funded by Germany’s Federal Ministry of Education and Research (BMBF) with an investment of up to €250 million, 6G-RIC unites around 17 research partners, including leading universities and research institutes such as RWTH Aachen, the German Research Center for Artificial Intelligence (DFKI), and Fraunhofer HHI. Photos: Fraunhofer HHI, IHP

September was packed with events, but let’s take a moment to look back at one of the highlights: the Fall Meeting of the European Materials Research Society (E-MRS), held on September 16-19. This event is one of Europe's most significant materials science events, attracting top international talent. Our IHP Materials Research and Technology team was well represented, with six team members participating in the symposium H Integration of Advanced Materials on Silicon: From Classical to Neuromorphic and Quantum Applications. Dr. Katarzyna Hnida-Gut was the main organizer of the symposium, and Dr. Costanza Manganelli was an invited speaker, presenting “All around the thermo-opto-mechanical properties of GeSn optoelectronic devices.” Our scientists also delivered several engaging talks: Dr. Oliver Skibitzki: "Towards III/V-on-Si Co-Integration—growth, integration, application.” Diana Ryzhak: "Influence of composition and capping layers on the photoluminescence of SiGe and Ge quantum dots on Si Nanotips.” Dr. Jon Schlipf: "Large-scale fabrication of near-field-coupled plasmonic titanium nitride nanotriangle arrays in a CMOS-compatible process.” Alberto M. Mistroni: "Wafer scale probing of low disorder and high mobility Si/SiGe heterostructures fabricated in a 200 mm BiCMOS pilot line." Looking ahead, we’re excited to announce that Dr. Costanza Manganelli will be co-organizing the symposium at EMRS Fall 2025. We're proud to contribute to this prestigious event and look forward to participating again next year!

🚀 New Joint Lab is opened! Together with RWTH Aachen University and Forschungszentrum Jülich we have taken our collaboration to the next level with the official opening of a Joint Lab on semiconductor-based quantum computing in Frankfurt (Oder). This lab focuses on advancing scalable quantum computer architectures and enhancing spin-based qubit technologies. During the opening, Prof Dr Hendrik Bluhm, alongside Dr Lars Schreiber (RWTH Aachen) and Dr. Vincent Mourik (FZ Jülich), presented the state-of-the-art research that will be crucial for the development of next-gen quantum technologies. Also, Prof Dr Gerhard Kahmen stressed the potential of quantum technologies, particularly Si/SiGe-based approaches, to solve complex, previously unsolvable problems. The Joint Lab is fully equipped with top-notch infrastructure for fabricating quantum devices, including the first successfully tested silicon quantum wells. Dr. Marvin H. Zöllner, coordinator of the lab, highlighted its role in driving forward innovations in preparation for the Quantum Year 2025. This partnership aims to unlock the potential of quantum computing to tackle real-world problems by scaling up to millions of qubits. Yes, the aim is very ambitious but we are optimistic to reach it together with the enthusiastic colleagues from the Joint Lab. Read more in our press release:  https://lnkd.in/efFYrEhN #QuantumComputing #Innovation #Semiconductors #TechResearch #FutureTech #IHP #RWTH #FZJülich

Prof. Dr. Andreas Mai, Leiter der Technologie am IHP: „Quantentechnologien besitzen großes Potential, sowohl im Bereich des Computings als auch für die Sensorik, aktuell noch scheinbar unlösbare Probleme zu meistern. Das IHP arbeitet hier mit seiner Expertise in der Halbleiterforschung bereits an Technologien und Lösungen, um neue Bauelemente für das Quantencomputing als auch in der Sensorik zu ermöglichen. Dies kann nicht nur wichtige Impulse für zukünftige Märkte geben, sondern auch die Rolle Brandenburgs in diesem hochspannenden Technologiefeld stärken und nachhaltig verändern.“

European Microwave Week in Paris is said to be the busiest ever, and we’re thrilled to be part of it! Alongside our booth, we’re proud to have many of IHP’s scientists presenting their papers at conferences and participating in panel discussions. Don’t miss the opportunity to connect with us—come by and visit our booth #806c Also, our HR-team is here and will be glad to welcome you at the student career party at Chalet du Lac later today.

We are happy that IHP was present at this year’s RADECS, both at the conference and trade show with our experts—and not just because it was held in Gran Canaria! We've used the opportunity to show and talk about our advancements in radiation-hardened technology, especially about these highlights: - The COCHISA Project, which develops Ka- and X-band core chips to enhance phased-array antenna integration for SAR satellites and LEO telecommunications. https://lnkd.in/ec32EJz3 - Our Radiation Hard Design Kit, offering powerful tools to develop radiation-tolerant microelectronics for harsh space environments. - The Silicon Lifecycle Management (SLM) Platform, leveraging on-chip sensors and analytics to optimize IC performance, reliability, and lifespan. Stay tuned for exciting updates on SLM coming next year!