Technology and Electronics News

Pat Gelsinger, a veteran of the tech industry with over 40 years of experience, has retired (certainly, under significant pressure) as Intel’s CEO as of December 1, 2024. This comes after a challenging time for Intel, marked by tough competition and business struggles. In a LinkedIn post, Gelsinger called his departure “bittersweet,” thanking his colleagues and expressing pride in the company’s achievements. “Leading Intel has been the honor of my lifetime,” he wrote. Gelsinger’s time as CEO had both high hopes and tough realities. During his leadership, Intel faced several major problems: - Stock Drop: Intel’s stock fell by 61%, showing the difficulty of regaining investor trust. - Missing the AI Boom: Intel struggled to compete in the booming AI market, falling behind Nvidia, whose value skyrocketed by 720%. - Manufacturing Issues: Plans for advanced chip production ran into delays, with Broadcom stating that Intel’s 18A node wasn’t ready for mass production. - Financial Cuts: Intel announced major cost reductions, including laying off 15% of its employees to save $10 billion annually. Despite these struggles, Gelsinger worked on projects aimed at shaping Intel’s future: - Manufacturing Expansion: He led a multibillion-dollar plan to grow Intel’s U.S. chip production, with new facilities in Arizona, Ohio, and Oregon. - Innovative Goals: Gelsinger pushed the "five nodes in four years" plan to catch up with competitors like TSMC. - Government Support: He helped secure federal funding through the CHIPS Act to strengthen U.S. chip manufacturing. Gelsinger’s leadership was a mix of challenges and forward-looking plans, leaving Intel at a critical turning point as it searches for a new leader. #Intel #LeadershipTransition #SemiconductorIndustry #ChipManufacturing #TEnews

Join us for the latest episode of Technology and Electronics News, where we break down the key developments shaping electronics industry: - Rapid growth in humanoid robots and AI-powered devices. - The race for advanced chipmaking among TSMC, Samsung, and Intel. - Meta’s plans for a global subsea cable network. - Innovations in AMOLED displays, CubeSats, and next-generation batteries. We also explore the impact of U.S.-China trade tensions on semiconductors, AMD’s advancements in glass processors, and SK Hynix’s 321-layer NAND breakthrough. #Electronics #Semiconductors #TechNews #HardwareDesign #TEnews

Stay informed with the latest developments in the hardware industry! - EU's 'Chips Act 2.0' and Leadership Changes: Dr. Stefan Finkbeiner, CEO of Bosch Sensortec, has been appointed as the new Chair of the Chips Joint Undertaking Governing Board. Discussions are underway for a 'Chips Act 2.0', with industry leaders advocating for the inclusion of legacy chips alongside advanced technologies like quantum computing. - Executive Movements in the Semiconductor Industry: Gregg Lowe steps down as CEO of Wolfspeed amid restructuring efforts, while Peter Carlsson, co-founder and CEO of Northvolt, resigns during the company's bankruptcy proceedings. - Microsoft's Azure Integrated HSM: Microsoft introduces Azure Integrated HSM, a next-generation hardware security module designed to enhance cryptographic key protection while reducing latency. - DRAM Market Outlook: TrendForce reports a challenging forecast for the DRAM memory market in 2025, with prices for DDR4 and LPDDR4X declining due to high inventory and weak demand. - Infineon Technologies and Siemens Collaboration: Infineon partners with Siemens to integrate the AURIX TC4x microcontroller with Siemens' AUTOSAR-based Capital Embedded AR Classic software, aiming to advance software-defined vehicles (SDVs). - Supermicro's Financial Challenges: Supermicro faces potential Nasdaq delisting after missing financial filing deadlines, with additional challenges including a Department of Justice probe into its accounting practices. - DigiKey's Market Optimism: DigiKey expresses optimism about an upturn in the electronics market, citing economic stimulation efforts in the U.S. and Germany. Stay tuned for more insights and updates in this episode of Technology and Electronics News. #TechNews #ElectronicsIndustry #Semiconductors #ChipsAct #MicrosoftAzure #Microsoft #Cybersecurity #TEnews

In this week's episode of Technology and Electronics News, we delve into key highlights from Electronica 2024, the world's largest electronics trade show, featuring over 3,600 exhibitors in Munich. The event showcased innovations across semiconductors, EMS, IoT, AI, and automotive technologies. Product announcements ranged from Longsys' industrial and automotive storage solutions to Siemens EDA’s AI-driven design tools, Renesas' EV power axle, and ADI's deterministic Ethernet switches. Industry leaders also voiced concerns about fragmented supply chains and their impact on global semiconductor collaboration. Additional updates include ASML's projected annual sales growth driven by AI chip demand, AMD's restructuring to prioritize AI development, and Infineon's measures to address challenges outside AI markets. The EU’s €133 million investment in Dutch photonic semiconductor facilities, Nvidia and SoftBank’s AI-driven telecom partnership, SECO and Raspberry Pi’s collaboration on industrial IoT solutions, TSMC's 2nm wafer production timeline, and Microchip’s PolarFire FPGA advancements further emphasize the evolving tech landscape. For a comprehensive exploration of these stories and more industry trends, watch the full episode. #TechnologyNews #TechNews #Electronics #Electronica2024 #Semiconductors #AI #IoT #ElectronicsEngineering #Innovation #EDA #ChipIndustry #TEnews

New Episode of Technology and Electronics News - Electronica 2024 kicks off in Munich from November 12th–15th, gathering 3,000+ exhibitors and spotlighting breakthroughs in AI, decarbonization-driven semiconductors, and next-gen Gallium Nitride and Silicon Carbide technology. - TSMC’s Major Move: Compliance with U.S. restrictions halts AI chip production for Chinese clients, raising stakes in global semiconductor politics. - TSMC’s U.S. Expansion: A $65 billion investment in Arizona keeps momentum strong, despite political shifts. - Semiconductor Market Growth: Q3 2024 sales soar 23.2% year-over-year, with growth regional dynamics and challenges revealed. - Power Electronics Shake-Up: The market faces overcapacity and global tensions, but innovations and diversification beyond EVs lead the way. - ChipsJU: PIXEurope sets its sights on a world-leading photonic integrated circuits ecosystem. - Infineon’s AURIX™ TC4Dx Microcontroller launches, aiming to redefine software-defined vehicles with powerful six-core tech. - US CHIPS Act Funding Race: High-stakes maneuvers continue as companies secure government backing amid a changing political landscape. - And a fun tech twist: Imagine if Nvidia’s Jensen Huang had become TSMC CEO! A ‘no’ can sometimes shape history in amazing ways. Don't miss this episode of Technology and Electronics News. Packed with stories that matter most to the industry, from breakthrough innovations to the latest market shifts. Tune in now! #TechnologyNews #ElectronicsIndustry #Electronica2024 #TSMC #Semiconductor #Infineon #Innovation #PIXEurope #Podcast #Videocast #Sintecs #AI #PowerElectronics #CHIPSAct #TENews

On Friday, November 8th, chip equipment giant ASML faced a global IT outage, now fully resolved, according to the company. The cause? Still under wraps. This isn’t ASML’s first tech blip lately. Back in October, they 'accidentally' dropped their third-quarter earnings early due to a 'technical error.' #ASML #cybersecurity #TENews

Murata has become the first to apply the SGP.32 Remote SIM Provisioning standard for iSIMs in its Type 2GD Cat.M1/NB-IoT module, built with G+D’s compliant SIM OS and supporting ETSI/3GPP Release 17. This innovation targets IoT applications like POS, asset tracking, healthcare, smart cities, and more. SGP.32, introduced by the GSMA, allows secure, remote management of eSIM and iSIM profiles over cellular networks, eliminating physical SIM changes. This simplifies logistics, reduces costs, and offers flexible global IoT deployments. Murata’s integration of a iUICC further streamlines provisioning, cutting manual steps. "iSIMs will play a crucial role in the future of cellular IoT devices, cutting down on size and complexity for deployments like smart cities, medical IoT, and wearable devices," said Hirokazu Nakae of Murata. #IoT #Murata #iSIM #eSIM #SGP32 #RemoteProvisioning #TENews

In an interesting twist of history, TSMC founder Morris Chang once offered the role of CEO at TSMC to Nvidia’s CEO and co-founder, Jensen Huang, back in 2013. At the time, Chang was planning for TSMC’s future leadership as he neared retirement, and Huang stood out as a top candidate due to his success in building Nvidia into a leading force in the GPU market, with expanding influence in data centers and consumer electronics. Huang, focused on Nvidia’s trajectory, declined. That year, Nvidia was making significant strides with its Kepler GPUs, expanding its Tegra lineup, and even launching the Shield console. Instead, Chang appointed C.C. Wei and Mark Liu as co-CEOs, leading to today’s leadership structure at TSMC. The decision not only shaped TSMC’s path but allowed Huang to steer Nvidia toward becoming a global leader in AI and data centers, making it the most valuable company by market capitalization today. #Leadership #Semiconductors #TSMC #Nvidia #TENews

China's top chipmaker, SMIC, reported a 58.3% jump in Q3 net profit to $148.8 million, though below the $199.71 million expected. Revenue rose 34% to $2.17 billion, with a gross profit margin of 20.5%, exceeding guidance. While SMIC focuses on mature node chips, it gained attention for making advanced chips for Huawei's premium smartphones. Despite this, it hasn’t fully capitalized on AI-driven chip demand like its rivals. https://lnkd.in/e3ZvFvaD #SMIC #Semiconductors #ChipIndustry #TENews

Taiwan's GlobalWafers stated it expects the U.S. CHIPS and Science Act, aimed at encouraging chipmaking investments, to continue smoothly under the Trump administration. "Multi-year and decadal programs like the CHIPS Act and the agreements we have signed are regularly continued from one administration to the next," it said. "We expect the CHIPS program to be no different and run smoothly in the Trump administration." This reflects broader industry optimism that U.S. policies supporting semiconductor investments will maintain stability and drive growth. #Semiconductors #CHIPSAct #GlobalWafers #Trump #TENews