Tresky GmbH

𝗧𝗿𝗲𝘀𝗸𝘆’𝘀 𝟮𝟬𝟮𝟰: 𝗔 𝗬𝗲𝗮𝗿 𝗼𝗳 𝗜𝗻𝗻𝗼𝘃𝗮𝘁𝗶𝗼𝗻𝘀, 𝗖𝗼𝗻𝗻𝗲𝗰𝘁𝗶𝗼𝗻𝘀, 𝗮𝗻𝗱 𝗠𝗶𝗹𝗲𝘀𝘁𝗼𝗻𝗲𝘀 As 2024 draws to a close, we at Tresky are proud to reflect on a year filled with remarkable achievements. From pioneering technologies to global events, here’s a recap of the highlights that defined our journey. 𝗜𝗻𝗻𝗼𝘃𝗮𝘁𝗶𝗼𝗻 𝗛𝗶𝗴𝗵𝗹𝗶𝗴𝗵𝘁𝘀 🚀 • Large-Area Sintering One of our major breakthroughs in 2024 was enabling dispensing over areas larger than 100 mm² for large-area sintering. This advancement addresses critical challenges in power electronics, especially for e-mobility applications. Learn more about large area sintering: https://lnkd.in/e4h84hGi • Expanded Contract Manufacturing Services We strengthened our service portfolio with state-of-the-art equipment, including a vacuum soldering system and a sintering press delivering up to 15 kN of force. Learn more about your solution for prototyping and small series in semiconductor assembly: https://lnkd.in/ebdpb3wk • Laser- and photodiodes DIE bonding in optoelectronics💡 In the dynamic world of optoelectronics, where light and electronics come together, the connection technology plays a crucial role for the performance and lifespan of laser diodes (LD) and photodiodes (PD). Tresky GmbH, as a leading manufacturer of DIE bonding systems, offers customized solutions that are specially tailored to the requirements of DIE bonding of laser- and photodiodes For more information please visit https://lnkd.in/eMBnqa8w 𝗧𝗵𝗼𝘂𝗴𝗵𝘁 𝗟𝗲𝗮𝗱𝗲𝗿𝘀𝗵𝗶𝗽 𝗮𝗻𝗱 𝗞𝗻𝗼𝘄𝗹𝗲𝗱𝗴𝗲 𝗦𝗵𝗮𝗿𝗶𝗻𝗴 📘 In 2024, we released two white papers co-authored by our CEO, Daniel Schultze, and Dr. Aaron Hutzler from Bond Pulse GmbH. This publication explored the motivations and techniques behind pressure-assisted metallic sintering and large area sintering in power electronics offering key insights for electronics professionals. Download: https://lnkd.in/d2PhPeF8 We look forward to the year 2025 together. Many thanks to all our customers, partners and the entire Tresky team! #Tresky #PowerElectronics #DIEBonding

🌏 Wrapping Up a Productive Week in Japan This past week in Japan was both inspiring and rewarding. Thank you to Fraunhofer ENAS, Fraunhofer IZM-ASSID, and IVAM Microtechnology Network for organizing the excellent symposium on "Micro/Nanotechnology, MedTec, and Life Sciences: Shaping the Future" in collaboration with Tohoku University. It was a great platform for valuable exchanges. In addition to attending SEMICON Japan, I had the chance to meet with customers and partners to strengthen relationships and explore new opportunities. Promoting Tresky GmbH in Japan was a highlight of the trip, and I’m grateful for all the insightful conversations. Heading home with many new ideas and a renewed appreciation for international collaboration. #Innovation #Networking #Microtechnology #MedicalTechnology #Tresky #Nanotechnology

Ultrasonic #DIE #bonding is an innovative and efficient technique increasingly utilized in the #semiconductor industry for the assembly of #microelectronic components. This method leverages high-frequency ultrasonic vibrations to create a reliable bonds between semiconductor DIEs and substrates, significantly reducing thermal stress compared to traditional bonding methods. The advantages of ultrasonic DIE bonding include rapid processing times, low temperatures and excellent mechanical strength, making it particularly suitable for advanced applications such as RF components, MEMS, power devices and #LED packaging. Learn more about the efficient use of ultrasonic bonding: https://lnkd.in/gsHCR_9Y

Much success to our colleague Gernot Wolkenstein at the 57th International Symposium on Microelectronics by IMAPS in Boston!   #Tresky #Microelectronics #Semiconductor

The IEEE ESTC in #Berlin was an amazing event. Thanks to our colleagues Gernot Wolkenstein and Jan-Peter Vorwerk for presenting our innovations. For more information, please visit our website: #tresky #bonding #estc

𝗠𝗮𝘅𝗶𝗺𝗶𝘇𝗲 𝗬𝗼𝘂𝗿 𝗣𝗿𝗼𝗱𝘂𝗰𝘁𝗶𝗼𝗻 𝗘𝗳𝗳𝗶𝗰𝗶𝗲𝗻𝗰𝘆 𝘄𝗶𝘁𝗵 𝗧𝗿𝗲𝘀𝗸𝘆!   Looking to streamline your production without the hassle of building new capacities or disrupting your current operations? As your trusted external partner, Tresky offers rapid prototyping and small-batch production on demand, utilizing our full range of DIE Bonding and DIE Sorting processes.   𝗦𝗶𝗴𝗻𝗶𝗳𝗶𝗰𝗮𝗻𝘁 𝗔𝗱𝘃𝗮𝗻𝘁𝗮𝗴𝗲𝘀:   - 𝗕𝗼𝗻𝗱𝗶𝗻𝗴 𝗧𝗲𝗰𝗵𝗻𝗼𝗹𝗼𝗴𝗶𝗲𝘀: Leverage the latest advancements for unmatched precision and reliability. - 𝗖𝘂𝘀𝘁𝗼𝗺𝗶𝘇𝗲𝗱 𝗦𝗼𝗹𝘂𝘁𝗶𝗼𝗻𝘀: Our processes are tailored to meet your unique requirements. - 𝗙𝗮𝘀𝘁 & 𝗘𝗳𝗳𝗶𝗰𝗶𝗲𝗻𝘁 𝗜𝗺𝗽𝗹𝗲𝗺𝗲𝗻𝘁𝗮𝘁𝗶𝗼𝗻: Accelerate your project timelines with our quick turnaround. - 𝗥𝗲𝗱𝘂𝗰𝗲𝗱 𝗗𝗲𝘃𝗲𝗹𝗼𝗽𝗺𝗲𝗻𝘁 𝗧𝗶𝗺𝗲𝘀: Shorten your time-to-market with our efficient solutions. - 𝗙𝗹𝗲𝘅𝗶𝗯𝗶𝗹𝗶𝘁𝘆: We seamlessly adapt to your specific needs. - 𝗘𝘅𝗽𝗲𝗿𝘁 𝗦𝘂𝗽𝗽𝗼𝗿𝘁: Benefit from the expertise and advice of our seasoned team.   Ready to take your production to the next level? Contact us today and let Tresky be your partner in achieving superior efficiency and innovation! https://lnkd.in/gHc3E2SF #Tresky #ContractManufacturing #DieBonding

We are one of the world's leading machine manufacturers for placement systems in the high-precision sector with more than 40 years of experience in the semiconductor industry. Our bonders are Made in Germany. All common packaging technologies can be realized with a flexible TRESKY machine, thanks to our extensive experience with multi-chip module applications. Our systems are perfectly tailored to the requirements of our customers. We have created a 32-page brochure to give you a detailed insight into the company, technologies and product portfolio. You can download it free of charge via the following link: https://lnkd.in/d2PhPeF8 #Tresky #Semiconductor #DieBonding #MadeInGermany

Vielen Dank an die EPP für die Veröffentlichung der Story "Dispensen für Large Area Sintering-Anwendungen - Herstellung großflächiger Leistungshalbleitermodule" Wenn Sie mehr zum Large-Area-Dispensing von Half-Bridge Modulen und zum Wet-Sintering Prozess erfahren möchten, können Sie die Pressemitteilung unter dem folgenden Link aufrufen: https://lnkd.in/dCZrEgAD #Tresky #Sintering #PowerModule #EPP #Dispensen

Fachtagung Leistungselektronik an der FH Kiel Spannende Vortäge, tolle Gespräche - gelungene Veranstaltung #fhkiel #leistungselektronik #powerelectronics #SiC #GaN #sintering