This document is an excerpt from the EUR-Lex website
Document 32014R0722R(01)
Corrigendum to Council Regulation (EU) No 722/2014 of 24 June 2014 amending Regulation (EU) No 1387/2013 suspending the autonomous Common Customs Tariff duties on certain agricultural and industrial products ( OJ L 192, 1.7.2014 )
Corrigendum to Council Regulation (EU) No 722/2014 of 24 June 2014 amending Regulation (EU) No 1387/2013 suspending the autonomous Common Customs Tariff duties on certain agricultural and industrial products ( OJ L 192, 1.7.2014 )
Corrigendum to Council Regulation (EU) No 722/2014 of 24 June 2014 amending Regulation (EU) No 1387/2013 suspending the autonomous Common Customs Tariff duties on certain agricultural and industrial products ( OJ L 192, 1.7.2014 )
OJ L 293, 9.10.2014, p. 58–58
(BG, ES, CS, DA, DE, ET, EL, EN, FR, HR, IT, LV, LT, HU, MT, NL, PL, PT, RO, SK, SL, FI, SV)
9.10.2014 |
EN |
Official Journal of the European Union |
L 293/58 |
Corrigendum to Council Regulation (EU) No 722/2014 of 24 June 2014 amending Regulation (EU) No 1387/2013 suspending the autonomous Common Customs Tariff duties on certain agricultural and industrial products
( Official Journal of the European Union L 192 of 1 July 2014 )
On page 29, Annex I, columns ‘CN code’/‘TARIC’, entry ‘ex 9014 10 00’/‘30’, column ‘Description’:
for:
‘Electronic compass, as a geomagnetic sensor, in a housing (e.g. CSWLP, LGA, SOIC) suitable for fully automated printed circuit board (PCB) assembly, with the following main components:
— |
a combination of one or more application-specific integrated circuits (ASIC) and |
— |
one or more micro-electromechanical sensors (MEMS) manufactured with semiconductor technology, with mechanical components arranged in three-dimensional structures on the semiconductor material, |
of a kind used in the manufacture of products falling in chapters 84-90 and 94 (1)’
,read:
‘Electronic compass, as a geomagnetic sensor, in a housing (e.g. CSWLP, LGA, SOIC) suitable for fully automated printed circuit board (PCB) assembly, with the following main components:
— |
a combination of one or more application-specific integrated circuits (ASIC), and |
— |
one or more micro-electromechanical sensors (MEMS) manufactured with semiconductor technology, with mechanical components arranged in three-dimensional structures on the semiconductor material, |
of a kind used in the manufacture of products falling in chapters 84-90 and 94’
.