Yole Group

📅 ISS EUROPE 2025 | March 12-14, Sopot, Poland The Industry Strategy Symposium (ISS) Europe 2025 is an event focused on the global #semiconductor ecosystem. With #AI as a catalyst for Europe's competitiveness, this symposium provides a unique platform for strategic discussions on the latest trends, challenges, and opportunities shaping the future of the semiconductor industry. Our team will be on-site to share expert insights into semiconductor technology, market trends, and strategic opportunities. Jean-Christophe ELOY, President and Founder of Yole Group, will be part of the program on Friday, March 14, at 9:15 AM, presenting "What are the Next Technologies Supporting AI Infrastructure: From Advanced Packaging to Wide Bandgap Devices?" Don’t miss this opportunity to connect with us! More info : https://lnkd.in/eHSNKJrb

✍ Yole Group writes - #GooglePixel9 reflects RF filter transition When it comes to acoustic wave filters, BAW-type technologies have been dominating the MB/HB front-end while bulk SAW and TC-SAW technologies have a major share in low-band modules. Multilayer SAW technologies are gaining strong momentum as an alternative to static technologies, using a stacked layer substrate to boost RF filter performance. Yole Group observed this transition to new technology in its report RF for 4G/5G Industry 2024… 🔔 Today Yole Group’s analysts, Hassan Saleh, PhD and Ihor Pershukov step back and present a special focus on the Google Pixel 9 smartphone. The teardown team at Yole Group opens the system and takes a deep dive into the technology. 👍 Have a coffee and take a few minutes to discover what’s inside… https://lnkd.in/ez8ag9k7 #radiofrequency #filter #baw #saw #RFFE Qorvo, Inc. Skyworks Solutions, Inc. SOITEC #semiconductor #teardown #reverseengineering

📈 Yole Group Press - Advanced packaging: How AI is revolutionizing the game 🔔 #Datacenters and #HPC servers are expected to grow gradually in the next years. Both applications are strongly driven by #AI. Although the traditional server and networking markets have been weak during 2024, AI servers are growing strongly. Analysts at Yole Group recognize a significant opportunity for the growth and adoption of 2.5D/3D #packaging technologies. High-end performance packages with 2.5D/3D approaches are used today to package AI #processors like #GPUs and AI ASICs, as well as #HBM. 📣 Rayane MAZARI from Yole Group explains: There is an increased implementation of high-end systems in high-performance computing, networking, artificial intelligence, autonomous driving, personal computing, and gaming. Therefore, 2.5D & 3D advanced packaging platforms have become critical and effective for increasing device performance and bandwidth... 👉 Read the full press release on https://lnkd.in/gbCBdPZr

📊 Technology, Process, and Cost – YMTC 294L 3D NAND & CXMT G4 DDR5 DRAM We are currently evaluating whether China's latest memory technologies - the CXMT G4 DDR5 #DRAM and the YMTC 294L 3D #NAND - will have a significant impact on the semiconductor landscape. These advancements represent significant strides in China's #semiconductor field, but critical questions remain about their competitiveness in terms of cost and #technological evolution. Our analysis will explore whether these technologies can keep pace with global standards and assess China's capacity to secure the necessary tools for large-scale production. Beyond the technical benchmarks, the broader market impact is a key focus. We are evaluating how much of the demand in diverse end markets - including Enterprise, PC, #Mobile, #Automotive, Industrial, and Consumer - can be met by these mature nodes. As global demand continues to grow, understanding the potential market share and the ability to satisfy current and future needs will be crucial. Find these answers in our reports: -Yangtze Memory Technologies YMTC 294L 3D NAND: https://lnkd.in/e2DU98PU -CXMT G4 DDR5 DRAM: https://lnkd.in/ej9Pv7kg

📅 APEC 2025 | March 16-20, Atlanta, USA The IEEE Applied Power Electronics Conference (APEC) 2025 is a global event dedicated to #power #electronics, bringing together industry professionals, engineers, and researchers to explore the latest innovations in power conversion, systems, and applications. With a strong focus on energy efficiency, sustainability, and emerging technologies, APEC serves as a key platform for learning, networking, and discovering advancements shaping the future of power systems. Join Yole Group on site! Our experts will be on hand, sharing strategic insights into the power electronics sector. We will present our latest research on emerging trends, technological breakthroughs, and market dynamics driving the industry forward. Don’t miss it! More info: https://lnkd.in/ejaGrMRz

❓ Yole Group & STMicroelectronics – MCU integration in evolving #EV #architectures (Part 2) In the first part of our discussion, we explored the industry’s transition from distributed to centralized E/E architectures and how STMicroelectronics' #Stellar P platform is driving this evolution. Now, in Part 2, we take a deeper dive into the role of #MCU integration in optimizing #vehicleperformance and efficiency. Yu YANG and Thomas Hackenberg from Yole Group continue their conversation with Davide Santo, Automotive MCUs Director, and Francesca Canali, Marketing Manager for Automotive Processors at STMicroelectronics, to examine: 🔹 The impact of MCU integration on #powermanagement and system #efficiency 🔹 How software-defined vehicles (SDVs) are shaping the future of #automotive technology 🔹 The growing importance of functional safety and cybersecurity in next-generation EVs 📖 Read Part 2 of the interview here: https://lnkd.in/ec4UKDXe

📅 IMAGE SENSORS EUROPE 2025 | March 18-19, London, UK The Image Sensors Europe conference returns for its 19th edition, bringing together key players from across the #imaging ecosystem. This event will cover the latest trends in #CMOS sensors, automotive applications, #SWIR, #SPAD, depth #sensing, image processing, and more. Yole Group is proud to be a partner of Image Sensors Europe 2025! Our experts will be on-site to share exclusive insights into market trends, technological breakthroughs, and emerging opportunities in the image sensor industry. Don’t miss the chance to connect with us and gain a deeper understanding of this fast-evolving market. See you in London! More info: https://lnkd.in/esTS7vRK

🎬 ChipChat with Yole Group – Is #HBM riding the same #generativeAI wave? Discover valuable insights into the evolving #DRAM industry, especially the HBM segment with John Lorenz! 🙌 💡2024 has been a major rebound year for the DRAM industry, with over 80% revenue growth vs 2023 as supply & demand have come back into balance. However, the main factor for this has been in the rise of a particular type of memory called HBM, which has been around for almost 10 years, but the latest generations are now getting much more attention… This year, should bring the next generation of HBM, called #HBM4. This will double the interface width from its predecessor, bringing even higher bandwidth. The demand continues to grow too, with HBM suppliers like Samsung Semiconductor, SK hynix, and Micron Technology... In Yole Group’s memory collection of reports and monitors, John Lorenz and his team highlights the key changes in the memory landscape, including DRAM, HBM, #NAND… and the factors influencing #ASPs—and much more. 🚀 👉 To dive deeper into market challenges and technical developments, check out key features of Yole Group’s products on https://lnkd.in/efz7jjAb A big thank you to John Lorenz for sharing his #expertise! 🙏 #semiconductor #marketresearch #innovation #semiconductorindustry

📅 IMAPS DPC 2025 | March 3-6, Phoenix, USA IMAPS DPC 2025 is the event to explore the latest advancements in #device #packaging. It’s the perfect opportunity to stay ahead of emerging trends and technologies shaping the future of #microelectronics. Join Yole Group as we will be on-site, offering in-depth insights into the latest developments in device packaging and microelectronics. Gabriela Pereira, Technology & Market Analyst at Yole Group, will deliver two key presentations: on March 5th, “AI Market Today and Beyond: Transforming the Future of Advanced Packaging” and on March 6th, “Fan-out Panel Level Packaging: Driving Market Momentum for High-End System Integration.” Join us to discuss the future of the industry! More info: https://lnkd.in/enQd3WEx

✍ Yole Group writes - BYD sparks a revolution: ADAS for all in a game-changing move 💡 On February 10, BYD hosted its intelligence strategy launch event, unveiling the "Intelligent Driving for All" initiative powered by its advanced God's Eye driving system. While BYD has already integrated #ADAS into its premium brands—offering nine models with comprehensive sensor suites—it is now expanding these features to its more affordable models. 👉 Given BYD’s scale, Yole Group anticipates a significant industry impact. Our analysts closely monitor technological advancements to remain at the forefront of automotive innovation. Explore the latest insights from Yu YANG, Pierrick BOULAY and Hugo ANTOINE in our newest analysis: 💫 Enjoy the read, and feel free to reach out with any questions: https://lnkd.in/e-qmnVgn #computing #semiconductor #automotive #autonomousdriving #china