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A new prediction method for ReRAM data retention ...
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由 Z Wei 著作2015被引用 9 次 — The quantitative 3D percolation model is developed based on direct observation of the filament structure and hopping conduction, which is ...
A new prediction method for ReRAM data retention statistics ...
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The quantitative 3D percolation model is developed based on direct observation of the filament structure and hopping conduction, which is confirmed with ultra- ...
A new prediction method for ReRAM data retention ...
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由 Z Wei 著作2015被引用 9 次 — The quantitative 3D percolation model is developed based on direct observation of the filament structure and hopping conduction, which is confirmed with ultra- ...
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Koji Katayama
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A new prediction method for ReRAM data retention statistics based on 3D filament structures. IRPS 2015: 5. [c3]. view. electronic edition via DOI · unpaywalled ...
Shunsaku Muraoka | Scholar Profiles and Rankings
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A new prediction method for ReRAM data retention statistics based on 3D filament structures (conference). Wei, Z. | Katayama, K. | Muraoka, S. | Yasuhara, R ...
Publications/International conferences - 京大推進研
京都大学
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京都大学
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Muraoka, R. Yasuhara, and T. Mikawa: "A New Prediction Method for ReRAM Data Retention Statistics based on 3D Filament Structures", IEEE Int. Reliability ...
Demonstration of high-density ReRAM ensuring 10-year ...
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A new oxygen diffusion reliability model for a high-density bipolar ReRAM is developed based on hopping conduction in filaments.
Takumi Mikawa
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A new prediction method for ReRAM data retention statistics based on 3D filament structures. IRPS 2015: 5. [c4]. view. electronic edition via DOI · unpaywalled ...
Koji Katayama's research works | Panasonic Corporation and ...
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The quantitative 3D percolation model is developed based on direct observation of the filament structure and hopping conduction, which is confirmed with ultra- ...
CN101738419B - 检测可变电阻材料的方法
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2015 A new prediction method for ReRAM data retention statistics based on 3D filament structures. Priority And Related Applications. Priority Applications (1).