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Optimization of flip-chip transitions for 60-GHz packages
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由 DG Kam 著作2014被引用 1 次 — In this paper we present a comprehensive sensitivity analysis to optimize the flip-chip transition. References (6). [1] A. Valdes-Garcia, S. Reynolds, J ...
Optimization of flip-chip transitions for 60-GHz packages
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Although flip-chip transitions have smaller parasitics than bonding wires, they should be carefully designed at 60 GHz. Insertion loss at a flip-chip ...
Modeling and optimization of a C4 flip-chip bump interface ...
ResearchGate
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This article reviews current research and development as well as future opportunities for packaging and antenna integration technologies
Low-cost antenna-in-package solutions for 60-GHz phased ...
ResearchGate
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2024年12月14日 — A low-cost, fully-integrated antenna-in-package solution for 60-GHz phased-array system is demonstrated. Sixteen patch antennas are ...
Package substrate differential impedance optimization for ...
Google Patents
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Google Patents
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The method optimizes parameters of vertical interconnections of BGA ball, via, and PTH, and around the joint between vertical and horizontal interconnections of ...
Flip Chip Technology: Advanced Semiconductor ...
Wevolver
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2024年11月13日 — An overview of Flip chip technology, its inception, manufacturing process, advancements and performance optimization techniques.
60 GHz Broadband MS-to-CPW Hot-Via Flip Chip ...
國立陽明交通大學
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國立陽明交通大學
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由 WC Wu 著作2007被引用 36 次 — The design and optimization of the hot-via flip chip intercon- nects were performed using the simulation tool HFSS for the. 3-D electromagnetic field analysis.
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Optimizing the heat source layout of chips using bionic ...
ScienceDirect.com
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由 H Dang 著作2022被引用 13 次 — In this work, we propose a feasible strategy to optimize the heat source layout using bionic method, and demonstrate the strategy by a flip chip ball grid ...
A Foil Flip-Chip Interconnect With an Ultra-Broadband ...
IEEE Xplore
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由 TIM PFAHLER 著作2024 — Above. 60 GHz, the RL decreases below 20dB and simultaneously, the losses increase significantly. This emphasizes the need to optimize the ...
Characterization of flip-chip interconnect for mm-wave ...
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This paper describes a systematic approach to characterize flip-chip solder bump interconnects to accurately design mm-wave on-chip devices and matching ...