No abstract available

[en] Distribution forms of abrasives in the chemical mechanical polishing (CMP) process are analyzed based on experimental results. Then the relationships between the wafer, the abrasive and the polishing pad are analyzed based on kinematics and contact mechanics. According to the track length of abrasives on the wafer surface, the relationships between the material removal rate and the polishing velocity are obtained. The analysis results are in accord with the experimental results. The conclusion provides a theoretical guide for further understanding the material removal mechanism of wafers in CMP. (semiconductor technology)

[en] This paper details the analysis of vibration monitoring for end-point control in oxide CMP processes. Two piezoelectric accelerometers were integrated onto the backside of a stainless steel polishing head of an IPEC 472 polisher. One sensor was placed perpendicular to the carrier plate (vertical) and the other parallel to the plate (horizontal). Wafers patterned with metal and coated with oxide material were polished at different speeds and pressures. Our results show that it is possible to sense a change in the vibration signal over time during planarization of oxide material on patterned wafers. The horizontal accelerometer showed more sensitivity to change in vibration amplitude compared to the vertical accelerometer for a given polish condition. At low carrier and platen rotation rates, the change in vibration signal over time at fixed frequencies decreased approximately ampersand frac12; - 1 order of magnitude (over the 2 to 10 psi polish pressure ranges). At high rotation speeds, the vibration signal remained essentially constant indicating that other factors dominated the vibration signaL These results show that while it is possible to sense changes in acceleration during polishing, more robust hardware and signal processing algorithms are required to ensure its use over a wide range of process conditions

[en] The advance of high-power laser technology is dependent on the rate of advancement in laser glass forming and surface preparation. The threshold damage of glass surfaces continues to be a weak link in the overall advancement of laser technology. Methods were developed and used in the evaluation of existing glass surface preparation techniques. Modified procedures were evaluated to reduce surface contamination and subsurface defects. Polishing rates were monitored under controlled polishing conditions (purity, pH, particle size distribution, particle concentration, etc.). Future work at LLL for this ongoing investigation is described

[en] Based on the Preston equation, the mathematical model of the material removal rate (MRR), aiming at a line-orbit chemical mechanical polisher, is established. The MRR and the material removal non-uniformity (MRNU) are numerically calculated by MATLAB, and the effects of the reciprocating parameters on the MRR and the MRNU are discussed. It is shown that the smaller the inclination angle and the larger the amplitude, the higher the MRR and the lower the MRNU. The reciprocating speed of the carrier plays a minor role to improve the MRR and decrease the MRNU. The results provide a guide for the design of a polisher and the determination of a process in line-orbit chemical mechanical polishing. (semiconductor technology)

[en] A signal processing method for the friction-based endpoint detection system of a chemical mechanical polishing (CMP) process is presented. The signal process method uses the wavelet threshold denoising method to reduce the noise contained in the measured original signal, extracts the Kalman filter innovation from the denoised signal as the feature signal, and judges the CMP endpoint based on the feature of the Kalman filter innovation sequence during the CMP process. Applying the signal processing method, the endpoint detection experiments of the Cu CMP process were carried out. The results show that the signal processing method can judge the endpoint of the Cu CMP process. (semiconductor technology)

[en] Plating operations were performed at the lead plating facility at SUNY, Stony Brook. Initial procedures were based on the previous experience of prototype development by Ben-Zvi and Brennan. Several attempts were made to produce satisfactory results, however the lead surfaces were consistently stained and lacked the bright metallic finish routinely achieved with the split loop resonator at SUNY. The development of a new set of procedures was initiated, aided by reports of plating success from Ben-Zvi. Controlled tests were conducted which suggested several changes in the plating parameters. Based on these results and suggestions from the staff at SUNY a new process was defined which was successful in producing the smooth reflective metallic surface known to be necessary forla optimum resonator performance. Following a successful repair of the the crack, the prototype was plated and chemically polished with the new techniques. The resultant surface was highly reflective and free of stains and particulates. The subsequent prototype cold test was successful

[en] A model for calculating friction torque during the chemical mechanical polishing (CMP) process is presented, and the friction force and torque detection experiments during the CMP process are carried out to verify the model. The results show that the model can well describe the feature of friction torque during CMP processing. The research results provide a theoretical foundation for the CMP endpoint detection method based on the change of the torque of the polishing head rotational spindle. (semiconductor technology)

No abstract available

[en] Experimental techniques for serial sectioning and reconstruction were investigated in the three-dimensional imaging of microstructures in metallic materials. Mechanical polishing equipped with a light optical microscope and a digital image processor was used for the serial sectioning and reconstruction. Different processing conditions were investigated for three different alloys: Al-Si alloy, Al-SiC composite, and AZ31 magnesium alloy. Proper selection of polishing cloths and polishing abrasives was pre-requisite for obtaining good slice images. The thicknesses of the slices were precisely controlled for each alloy by changing the mechanical polishing and chemical etching conditions. Two-step polishing was a very effective method for serial sectioning of multi-phase alloys with a soft matrix and hard particles such as Al-SiC composites. Image filtering with a delineate and median filter was very useful for successful image segmentation of multi-phase alloys.