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Sahin, T.; Flanigan, E.J.; Sears, J.T.
Tungsten and other refractory metals for VLSI applications II1987
Tungsten and other refractory metals for VLSI applications II1987
AbstractAbstract
[en] Chemical kinetics of low pressure chemical vapor deposition (LPCVD) of molybdenum on single crystal p-type (100) oriented silicon substrates were studied by hydrogen reduction of MoF/sub 6/. The pressure and temperature ranges covered were 0.9-10 torr and 2500C to 4000C, respectively. The rate of molybdenum deposition showed a square root dependence on the hydrogen partial pressure and no dependence on the MoF/sub 6/ partial pressure. The molybdenum film characteristics were dependent on the deposition conditions. Higher temperatures and pressures appeared to favor the formation of molybdenum silicide films near the molybdenum-silicon interface
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Broadbent, E.K; p. 199-206; ISBN 0-931837-66-9; ; 1987; p. 199-206; Materials Research Society; Pittsburgh, PA (USA); Workshop on tungsten and other refractory metals for VLSI applications; Palo Alto, CA (USA); 12-14 Nov 1986
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Book
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Conference
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