[en] This patent describes a circuit element. It comprises: an insulative substrate presenting first and second parallel major surfaces, a first means for providing a conductive path between at least two locations on the first major surface including a thick film conductor having a thickness of at least 5 μm, a second means for providing a conductive path between at least two locations on the second major surface including a thick film conductor, and a third means for providing a conductive path between the first and second conductive path means