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Colombo, D.; Grilli, E.; Guzzi, M.; Sanguinetti, S.; Fedorov, A.; Kaenel, H. von; Isella, G., E-mail: mario.guzzi@mater.unimib.it2006
AbstractAbstract
[en] A detailed analysis of the thermal strain relaxation in GaAs/Ge/Si structures by means of crack formation is presented. The study was performed through optical microscopy and photoluminescence measurements. The as grown epilayers were found to be in a metastable state with respect to crack formation. Repeated thermal cycling increased the crack density up to an asymptotic limit. The thermal strain is not fully relaxed even near to the asymptotic crack density
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E-MRS 2006: Symposium D, Silicon-based photonics; Nice (France); 29 May - 2 Jun 2006; S0022-2313(06)00592-8; Copyright (c) 2006 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.; Country of input: International Atomic Energy Agency (IAEA)
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