[en] The disassembly of an excited nuclear aggregate is described as a time-dependent decay process in which clusters are continuously and sequentially emitted by the primitive aggregate and those which have already been formed at a given time. The dynamics describe the rate at which the different species are generated as well as the rate at which the system de-excites and expands isotropically in space. The model is applied to the study of sequentially decaying ⁴⁰Ar as a function of the initial excitation energy. (orig.)

No abstract available

[en] The effects induced by the presence of an inertia term in the collective description of mass transfer are analysed in the framework of a transport model. The model is applied to the study of the collision of S on Ge. The transfer regime is shown to be quasi-oscillatory. The main differences with the overdamped regime are described. The implication of the presence of inertia terms on physical observables like differential cross sections is discussed. (orig.)

[en] This paper deals with the contribution to the reaction cross section coming from the break-up of an interacting complex of two fragments which is trapped in a pocket of the relative potential acting between the fragments. Calculations for the systems S on Co and S on Ge are done by using the semi-classical expression of tunneling through the barrier and the statistical break-up probability. The results are discussed and conclusions about the reaction mechanism are drawn. (orig.)

[en] For power devices, the reliability of thermal fatigue induced by thermal cycling has been prioritized as an important concern. The main target of this work is to apply a numerical procedure to assess the fatigue life for lead-free solder joints, that represent, in general, the weakest part of the electronic modules. Starting from a real multi-chip power module, FE-based models were built-up by considering different conditions in model implementation in order to simulate, from one hand, the worst working condition for the module and, from another one, the module standing into a climatic test room performing thermal cycles. Simulations were carried-out both in steady and transient conditions in order to estimate the module thermal maps, the stress-strain distributions, the effective plastic strain distributions and finally to assess the number of cycles to failure of the constitutive solder layers. (paper)