[en] Adjacent to the reactor main building a building for sodium component overhaul is prepared. This building contains a sodium cleaning facility for the primary main pump in addition to other facilities. In this paper the sodium cleaning facility and its cleaning process is described. Further, the function of this facility is evaluated using the result of cleaning tests and experiences of actual pump cleaning. (author)

[en] High purity polycrystalline InP has been required for preparation of starting materials in LEC pulling. Usually, these materials are synthesized by the horizontal Bridgman (HB) or gradient freeze (GF) method. The major problem for InP synthesis has been attributed to silicon contamination during the growth, as shown by several workers. In a previous paper, the authors proposed a model in which the silicon contamination would occur due to the transport of SiO and In/sub 2/O gas species from the In-P melt to the phosphorus region by the reaction of the melt with the quartz boat in the HB growth system and suggested that the Si concentration in the In-P melt would have an intimate correlation with the temperature in the phosphorus region. However, the effect of the temperature in the phosphorus region on the electrical properties has not been studied in details as of yet. In this note, a modified horizontal Bridgman (MHB) method was developed to reduce the residual donor impurities, and the reduction mechanism is discussed

[en] Plasma waves are important observational targets for scientific satellite missions to investigate electromagnetic phenomena that occur in space. For future scientific missions, reduction in the resource requirements of plasma wave receivers without loss of performance is important. This paper introduces a miniaturized on-board instrument for the observation of plasma waves using analogue application-specific integrated circuit (ASIC) techniques. The developed ASIC functions as a system chip to filter and amplify signals detected by plasma wave sensors. Miniaturization of the analogue circuit using the ASIC leads to the realization of a tiny plasma wave receiver. The overall size of the developed plasma wave receiver circuit board is less than 1/20 that of a conventional receiver used in previous scientific missions. The power consumptions of the system chip and the plasma wave receiver are 165 and 525 mW, respectively. (paper)