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Kim, Kyoung Suk; Jung, Hyun Chul; Kang, Ki Soo; Lee, Chan Woo; Yang, Sung Pil
Proceedings of the Korean Society for Nondestructive Testing Fall Meeting 19981998
Proceedings of the Korean Society for Nondestructive Testing Fall Meeting 19981998
AbstractAbstract
[en] This paper discusses a non-contact optical technique, electronic speckle pattern interferometry, that is well suited for thermal deformation measurement without the need of any surface preparation and temperature compensating process. Also, three kinds of composite materials with fiber and epoxy -unidirectional laminates([0]16 and [90]16) and Cross-ply laminates([0/90]s) have been analyzed by ESPI to determine their thermal expansion behavior.
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The Korean Society for Nondestructive Testing, Seoul (Korea, Republic of); 347 p; Nov 1998; p. 214-224; 1998 Fall Meeting of the Korean Society for Nondestructive Testing; Seoul (Korea, Republic of); 20 Nov 1998; Available from KSNT, Seoul (KR); 7 refs, 5 figs, 1 tab
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Miscellaneous
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Conference
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