[en] The behavior of Ti--Mo--Au metallization on Al₂O₃ and C was investigated by backscattering spectrometry. Results show that Mo--Au bimetal films typically mix during deposition. Diffusion of Ti in Mo film occurs at 600⁰C, but is inhibited by the presence of oxygen in the Ti film. Even 1000 A of Mo is not a barrier against interdiffusion of Ti and Au during 20-min anneals at 600⁰C. The amount of mixing observed also depends on the nature of the substrate which supports the Ti--Mo--Au metallization. (U.S.)