Nexperia

🎉Congratulations #TeamNexperia Malaysia! We’re excited to share the success of the ATSN 2024 Technical Forum, which provided a platform for our talented engineers to showcase their innovative ideas and groundbreaking research ties to this year’s theme: Embracing Transformation: a means to achieve lower-cost innovation and operations.   Of the impressive 36 abstracts submitted, ten were selected as finalists and six were chosen for poster presentations. Thank you to the organizing committee for organizing such a remarkable event.   A huge thank you to our esteemed panel of judges from the Technical Ladder Community:   - Full Paper Presentation: Vegneswary A/P Ramalingam, Roger Tan, and Saraswathy A/P Supramaniam - Poster Presentation: Lee Wai Wai, Ong See Jin, and Pan Yen Jeat We were honored to have Prof. Ir. Dr. Cheong Kuan Yew from University Sains Malaysia join us as a panel judge. His expertise added a valuable new perspective to the evaluation process.   Finally, congratulations to the winners of the full technical paper and poster presentations! Your ingenuity is inspiring. Let's continue to embrace transformation, share knowledge and drive innovation!

This was a lovely surprise: an Advent calendar in the shape of a bus! Not just any bus, but a mini version of a real Nexperia branded e-bus cruising through Hamburg! 🌟 At Nexperia we don’t just shrink buses (well, sort of 😉) – we’re experts at making things smaller where it truly matters: electronics. From automotive and industrial to mobile and consumer applications, our power semiconductors, power ICs, discretes, and logic components enable the essential functionality of countless electronic designs. With over 300 packages in our portfolio, we continuously innovate to make our products better and smaller, saving valuable PCB space and optimizing material usage. It’s all part of our commitment to responsible innovation. Miniaturization is one of the biggest trends in our industry, and we’ve proven once again this year why Nexperia leads the way. But stay tuned – 2025 promises more exciting product launches! 🚀 If you’re in Hamburg, keep an eye out for the real e-bus. It was last seen in Eidelstedt. Wishing you all a wonderful Advent season full of surprises, big and small! ✨🎄   #TeamNexperia #Hamburg #semiconductors #greenertransportation #miniaturization #keinehalbensachen #halbleiter

Nexperia's CCPAK1212 packaging delivers outstanding performance for power MOSFETs, including:   •Top-side and Bottom-side Cooling: Flexible thermal management options for superior heat dissipation. •Low Inductance: Reduces switching losses and improves overall efficiency. •Low RDS(on): Minimizes conduction losses, improving system efficiency. •Low thermal resistance: Ensures optimal thermal management, allowing devices to handle higher power levels. •High current density: Enables compact designs that handle greater power in less space. •High-performance silicon in a robust package: Provides enhanced performance, reliability, and durability for demanding applications.   These features make CCPAK1212 power MOSFET packaging ideal for next-gen systems that require high current and thermal performance, powering applications across telecom, communications, industrial and storage systems.   Learn more - https://lnkd.in/eh3KBjiP

🌟 A Look Back at #NexInspire's October Session! 🌟 Last month, the #NexInspire community had the privilege of learning from Sara Martin Horcajo, an inspiring all-rounder who has carved out an extraordinary journey. From being the first in her family to attend university to earning a PhD with distinction, Sara has overcome challenges in both academia and industry with resilience and a passion for learning. Now a Senior GaN Reliability Manager, Sara shared her expertise on #semiconductor reliability, #GaN technology, and her professional growth journey. A line from her talk that resonated deeply: "Set measurable goals, break them down into simpler steps, and learn from failures. Then try again." Her insights on perseverance and teamwork inspired us all, as did her reminder to "enjoy the journey and appreciate the achievements." ✨ Sara was also awarded a STAR Award for her outstanding contribution to the session, recognizing her dedication and the immense value she brought to the NexInspire community. 🚀 With her story in mind, we’re excited for #NexInspire's final session of the year, happening next #Wednesday - just one week away! 💡 Are you interested in being part of the #NexInspire community? Whether as a speaker or an attendee, we’d love to have you join us! Feel free to connect at nexinspire@nexperia.com to learn more. Let’s grow, inspire, and innovate together! #NexInspire #Leadership #Innovation #GaNTechnology #Inspiration #CareerGrowth #WomenInSTEM #TechCommunity #EngineeringExcellence #SemiconductorInnovation #TechLeadership #ProfessionalDevelopment #STEMCareers #EmpoweringWomen #FutureOfTech #TechForGood #Nexperia #STEMLeadership #EngineeringSuccess #JoinTheMovement

Shaping the Future of European Semiconductor Industry   Yesterday, we had the pleasure of hosting Germany’s Federal Minister for Special Affairs, Wolfgang Schmidt, MP Niels Annen and Hamburg MP Marc Schemmel at our Hamburg fab. Joined by our CFO, Stefan Tilger, we were able to give them a look behind the scenes at the world’s largest discretes semiconductor factory. The group had a productive discussion about the future of semiconductor manufacturing in Europe, the challenges we face, and the opportunities ahead. We emphasized the need for skilled labor and affordable housing to support our growth and attract top talent while solidifying the role of Northern Germany as a hub for tech innovation. We're excited to continue our partnership with local and national governments to drive innovation and strengthen Europe's position in the global semiconductor industry.

20 years ago, we revolutionized the industry with the introduction of LFPAK packaging, and we’ve continued to innovate ever since. Our copper-clip technology reached new heights with CCPAK1212, first introduced in our 650 V GaN FET portfolio. Now, we’re excited to announce that CCPAK1212 packaging is now part of our Power MOSFET portfolio, with future plans to extend across more voltage ranges and our AEC-Q101 qualified portfolios. This advancement addresses the evolving demands of next-generation systems, delivering higher current and thermal performance to power the most demanding applications. Stay tuned as we continue to lead the way in power packaging! Learn more about our CCPAK MOSFETs - https://lnkd.in/eh3KBjiP

⚡Power Up Your Designs: Explore #TeamNexperia’s Latest Application Guide   Looking for the perfect components to bring your next project to life? 💡   Our new Application Guide is here to help! This comprehensive resource features over 80 one-page application solutions, covering a wide range of fields like automotive, industrial, consumer, and mobile & wearables.   What's inside?   - Clear block diagrams - Targeted value propositions - Recommended parts - In-depth product information - Evaluation board overviews   🔓Unlock the power of Nexperia’s essential design insights with your free copy, ready to download - https://lnkd.in/ejywrfeU

More Than Just Chips: Nexperia's Commitment to Greater Manchester It was an honor to welcome Greater Manchester Mayor, Andy Burnham, to our Manchester site along with Rachel Eyre from MIDAS Manchester's Inward Investment Agency and Councillor Rowenna Davis from Croydon. Their visit highlighted the importance of industry-community partnerships in driving local economic growth and fostering the next generation of skilled workers.   We’re committed to being more than just a business at our sites around the globe. We have been integral to Manchester’s industrial landscape for over 50 years. Around 30 percent of the 1000+ highly skilled workers on #TeamNexperia Manchester have worked at the site for over a decade. By working closely with local organizations and educational institutions, we're investing in the future of our region.   We're proud to support initiatives like the Employer Integration Board, formed by Mayor Burnham in December 2023, which aims to create pathways for young people to access high-quality technical education and employment opportunities. To support the board’s goal of more young people taking on T-level qualifications, we will host T-level placements this year for the first time.   Mayor of Greater Manchester, Andy Burnham, said: “Giving young people in Greater Manchester a clear path to highly skilled jobs in the city-region is at the heart of our plans for the Greater Manchester Baccalaureate (MBacc). Nexperia has worked very closely with us on the Employer Integration Board and it was great to see first-hand the opportunities they are going to be offering to those taking T-Levels in Greater Manchester.”   Fredrik Öberg, UK Country Manager and Vice-President of Nexperia said: “We really appreciate the Mayor taking the time to visit our site and to learn more about our business and our history in Manchester. We take great pride in our innovation, the quality of our production and our continued investment in our skilled workforce.”

Inspiring the next generation of women in STEM with Girls'Day - Mädchen-Zukunftstag   We recently had the pleasure of joining a #GirlsDay event hosted at Hamburg University of Applied Sciences focused on energy, robotics and mobility. A few of our engineers participated in a speed dating activity to give the students personal insights into work life in the semiconductor industry. We hope it sparked a hidden passion for some young minds and started the journey towards a career in science, technology, engineering, and mathematics.   Let's continue to break down barriers and inspire the next generation to shape the future.   Thank you to María Catalina B., Henriette Bethke, @Friederike Detgen, Jessica Kräuter and Julie Lu for representing #TeamNexperia and inspiring the next generation to shape the future!   #womeninstem 

In today's 24/7 world where so much of our daily lives depend on rack-based computers, communications and storage systems that are always on, ensuring the reliability and efficiency of critical systems is crucial. That's why we're excited to announce the expansion of our ASFETs (Application Specific MOSFETs) portfolio with the launch of our new CCPAK1212 package.   Our new ASFET devices offer: • Thermal stability: Up to 75% lower thermal impedance than other ASFET alternatives, providing superior thermal stability during linear mode transitions. • Efficiency: 40% lower RDS(on) reduces conduction losses, improving overall system efficiency and longevity. • Flexible cooling: Top-side (CCPAK1212i) and bottom-side cooling (CCPAK1212) package variations provides flexible thermal management.   Ideal for:   • Servers • Communications infrastructure • Renewable systems & more   By combining reliable linear mode operation, enhanced SOA, and low RDS(on), our new ASFETs are the perfect solution for demanding applications.   Learn more - https://lnkd.in/gtYj6Vgi