日月光

We are thrilled to share insights from our latest blog article by Thomas Wang, Director of Corporate R&D at ASE: "Innovation and Collaboration in Power Module Packaging: A Thermal Perspective."   Power modules are at the heart of modern electrical systems — powering electric vehicles (xEVs), industrial motors, and renewable energy solutions. As demand grows for smaller, more powerful systems, effective thermal management is critical to ensuring reliability and performance.   At ASE, we are tackling these challenges through 3 key innovations:   ➡️ Reducing Thermal Sources: Optimizing die design, employing advanced materials and connections to minimize heat generation. ➡️ Minimizing Thermal Interfaces: Rethinking module design, streamlining thermal dissipation paths to enhance efficiency. ➡️ Lowering Thermal Resistance: Selecting right material choices to improve thermal conductivity and overall performance.   With the power module market projected to reach $14.8 billion by 2028, industry collaboration is more important than ever. By co-developing solutions with our customers, we are driving the next wave of innovation in power electronics. Read the full article here - https://lnkd.in/g6K28aPG #PowerModules #ThermalManagement #Innovation #Collaboration #Sustainability #ElectricVehicles #ASE  

Our industry has always been about #innovation and #collaboration with partners across the eco-system. So it was indeed heartening to witness the formalization of a partnership between SEMI Southeast Asia and Malaysia Semiconductor Industry Association, aiming to strengthen cooperation amongst members from around the region and build resilience in the face of global challenges. At the recent SEMI x MSIA networking nite in #Penang, YAB Tuan Chow Kon Yeow, Chief Minister, Penang State Government encouraged members from both organizations ‘to explore new opportunities for collaboration in supply chain resilience, talent mobility, or co-innovation … ‘ and that the ‘partnerships cultivated today will define the future of our industry.’ ASE applauds both organizations for their commitment to advancing semiconductor growth and development in Malaysia as well as the region. Way to go Dato’ Seri #WongSiewHai | Linda Tan | KC Ang 📍Eastern & Oriental Hotel

What an incredible journey it has been! Reliving the Grand Launch of ASE Malaysia’s Facility Expansion through this highlight reel brings back the energy, excitement, and camaraderie that made the event truly special.    From the unveiling of our fifth plant in Bayan Lepas, #Penang to the inspiring speeches and meaningful connections forged, this milestone marks a new chapter in our commitment to innovation and growth.    A heartfelt thank you to our esteemed guests, government partners, customers, suppliers, and employees for making this grand occasion a success. Your support fuels our vision for the future – We are ready for the new horizon!   📸 Browse the event highlights and memorable moments in our photo gallery here: https://lnkd.in/gDUmbeDj   #ASEMalaysia #NewHorizon #GrandLaunch #Penang

The #SiliconValley was lit up last week all the way from #SanJose to #SanFrancisco with perspectives on #heterogeneousIntegration and the limitless applications that are being made possible through #advancedpackaging innovation. At #ISSCC2025, the Open Compute Project Foundation ‘open chiplet economy’ initiative was laid out impeccably by Anu Ramamurthy who spoke about the collaboration required as the industry moves further into the business of making chiplets. For years, Cliff Grossner Ph.D. has been leading OCP efforts to bring the #chiplet ecosystem together, and it's paying off. CP Hung as always represented ASE well, and delivered a presentation on "Heterogeneous integration technologies suitable for SatCom applications." Keynoter Navid Shahriari from Intel Corporation highlighted transformative new capabilities emerging to give future generations of #engineers and #developers so much more to play with in terms of discrete chips, IP, nodes, cost, and more. He referred to the interconnect power efficiency that has taken the industry by storm and is enabling unprecedented achievement in integration, while package density scales in new ways. Talks from Daniela Rus of Massachusetts Institute of Technology and Jaihyuk Song of Samsung Electronics cemented the theme, bringing their genius to the plenary stage to demonstrate the impact of #robotics and #memory respectively.  Infineon Technologies Peter Schiefer informed that society will see more #automotive change in the next 5 years than we have seen in the last 50 years, encompassing fully connected, always online, user-centric, highly-automated and fully electric, "with semiconductors driving the #digitalization and #decarbonation of mobility." The #HIRSymposium 2025 likewise had many highlights - and standout speakers. With a fully loaded program, the audience came away wiser and more updated than ever on the swathes of incredible collabs going on across government, academia, research institutes, and indeed industry itself. The HI Roadmaps provide thought-provoking and non-competitive vision and play a crucial role for technologists who increasingly rely on #HeterogeneousIntegration and a well-prepared manufacturing ecosystem to drive their unique innovations forward - and to market. Issues widely discussed included #power, #thermal, #cooling, #materials, #interconnectivity, and the list goes on. Please visit the HIR website for latest release on roadmap chapters. Bravo to William Chen, Ravi Mahajan, Benson Chan, Subramanian Iyer, Rockwell Hsu, Ph.D., Kitty Pearsall, Jeff Suhling, Christopher Bailey, and Denise Manning, as well as the many others who contribute so significantly to the HIR. Shoutout to Timothy Lee who could not attend given IEEE commitments, but provided a fantastic presentation deck nonetheless. There was certainly a lot of to and fro last week, but the quality of content presented at both conferences undoubtedly melted away the usual Highway 101 commute angst 😊

2.18. A fabulously auspicious day to officially unveil our fifth plant in Bayan Lepas #Penang! After months of planning, we were absolutely thrilled to gather together with partners from the government and industry, our valued customers, suppliers and employees to celebrate this grand occasion. Many thanks to our guest of honor Penang Deputy Chief Minister 2 YB Japdeep Singh Deo for his congratulatory speech, whereby he emphasized the allocation of resources to support ASE’s operations and future expansion. We were also delighted to have the presence of YB Tuan Tze Tzin Sim | Mr SIVASURIYAMOORTHY SUNDARA RAJA Malaysian Investment Development Authority | Representative Phoebe Yeh Taipei Economic Office | Yoeu Chek Lee InvestPenang We are so grateful for the overwhelming support of the grand launch, with over 200 guests attending. Once again, thank you. We will be sharing more photos of the launch in the upcoming weeks. Stay tuned. But for now, ASE #Malaysia is ready for the new horizon. Bersedia untuk wawasan baharu! For more information, please see our official press release https://lnkd.in/gjsqmmUN

To all the Semiconductor #Bravehearts out there, we wish you a lovely weekend!

Join Dr. William Chen - and experience the exciting #HeterogeneousIntegration narrative - at the HIR Symposium, 19-21 Feb in San Jose. You'll hear from trailblazers with vision and perspective on the #semiconductor road towards $1T! For more: https://lnkd.in/e9HNCEQB

ASE is proud to sponsor the 8th Annual Heterogeneous Integration Symposium, which has been brilliantly put together by ASE's William Chen, Intel Corporation's Ravi Mahajan, Lawrence Berkeley Labs's John Shalf, EPS - IEEE Electronics Packaging Society's Denise Manning, Annette Teng, and many others. It's just what we need: a forum on AI & Energy Efficiency and Advanced Packaging Metrology. If you fancy, check out the agenda and register to join here: https://lnkd.in/e9HNCEQB #AI #DataCenter #power #chiplets #semiconductors

AI × Semiconductors: The Dual Engine Driving Technological Innovation 🚀 AI and semiconductors go hand in hand, driving breakthroughs in innovation. In particular, #AdvancedPackaging technology plays a crucial role in bridging chips and systems, empowering AI to operate with high efficiency.   📌 The Future of Semiconductor Development 🔹 More Moore: Transistor scaling enhances IC performance 🔹 More than Moore: Diverse chip applications are thriving 🔹 #HeterogeneousIntegration: Advanced packaging and #SiP technology drive system upgrades   📌 Trends in AI Advanced Packaging 🔹 2.5D Packaging: Si Interposer enables AI chiplet integration 🔹 FOCoS / FO-Bridge Packaging: #RDL Interposer boosts performance 🔹 #ActiveInterposer replacing passive interposers, with #VerticalStacking emerging as the new trend 🔹 Signal transmission is evolving toward #OpticalInterconnects, overcoming bandwidth limitations AI applications are accelerating semiconductor innovation, spanning 5G, autonomous driving, data centers, and beyond. How will the synergy between AI and semiconductors reshape the future? Find out now 👉 https://lnkd.in/g_85NvDj  •┈┈┈┈┈┈୨୧┈┈┈┈┈┈•  AI × 半導體：推動科技創新的雙引擎 🚀 AI與半導體相輔相成，驅動創新突破。尤其是 #先進封裝 技術，成為連接晶片與系統的關鍵，助力AI高效運作！   📌 半導體的未來發展 🔹 More Moore：電晶體微縮，提升IC效能 🔹 More than Moore：多樣化晶片應用蓬勃發展 🔹 #異質整合：先進封裝 與 #SiP 技術驅動系統升級   📌 AI先進封裝發展趨勢 🔹 2.5D封裝：Si Interposer 整合AI Chiplets 🔹 FOCoS / FO-Bridge封裝：重佈線層 #RDL Interposer 提升效能 🔹 #主動式Interposer 取代被動式，#垂直堆疊 成為新趨勢 🔹 訊號傳遞邁向 #光學連接 ，突破頻寬限制   AI應用加速半導體創新，涵蓋5G、自駕、數據中心等領域。AI與半導體的雙向驅動如何改變產業未來？立即探索👉 https://lnkd.in/g2NZUNTr

At the recent #CES2025, the role and channels of today’s influencers were debated throughout a dynamic conversation with some of the best and most skillful #contentcreators at the show. Thanks to Brian Tong, Justine Ezarik Jen Adams, and moderator Katie Melton (Everds) of LTK. And especially to Brian and Justine for also sharing a weekful+ of highly engaging content that delivered shrewd 360° observations from the best show floor yet (thanks to Gary Shapiro & Kinsey Fabrizio). There are #influencers everywhere, each with their own unique reputation, passion, expertise, and ability to put the spotlight on a spectrum of topics and products. But influencers are not just for beauty, fashion, fitness, travel, and food. It hit home that there are many in the semiconductor industry that are wittingly - and perhaps unwittingly -  playing an influencer role in terms of elevating the visibility of the industry and its truly powerful impact across society today. Every presentation counts. Every conversation counts. Indeed, every word counts. Efficacious influencers are the thought leaders and opinion makers amongst us that represent our industry well. Besides rockstar corporate leaders, we are fortunate to have such champion influencers such as Jodi Shelton, Ajit Manocha, and others that passionately use their platforms, whether digital, virtual, in person, or otherwise, to keep expanding the reach of the compelling semiconductor narrative, year after year. Such also include Nitin Dahad, Ed Sperling, E. Jan Vardaman, Shari Liss, Robert Quinn, Françoise von Trapp, Brian S., and the original #HIR warrior William Chen who continues to work like a trojan every day to bring #advancedpackaging roadmaps to life - and innovations to market. As the semiconductor industry collaborates in various ways to address talent shortage concerns and to support #workforcedevelopment initiatives, we can be very mindful that our words have influence, and we can all play an influential role in one way or another.  Our collective voices and content creativity will help draw the talent needed to shape the trajectory of our industry as we continue towards a $1T market. It's an exciting time. Here’s to making 2025 the year of the semiconductor influencer! #semiconductorinfluencer #semiconductors #chiplets #heterogeneousintegration #VIPack #AI #HPC #DataCenter #acceleratedcompute