關於我們

ASE (Advanced Semiconductor Engineering, Inc), a member of ASE Technology Holdings (NYSE:ASX) is one of the world's largest providers of outsourced semiconductor manufacturing services in assembly and test (OSAT), and, a leading provider of electronic manufacturing services (EMS) through its sister company, USI.  Addressing global proliferation of sophisticated electronics geared towards improving lifestyle and efficiency, ASE is strategically integrating synergies between its well established OSAT and EMS business units. ASE is at the forefront of a new class of EMS that delivers modularized, miniaturized ICs with system-level precision to enable high-performance and highly integrated devices. As a result, ASE is truly bridging the gap between silicon and system makers. From traditional semiconductor players to players innovating applications within IoT, wearables, automotive, AR/VR, connectivity and many more, success within an increasingly dynamic market hinges on creating and sustaining highly productive manufacturing partnerships. ASE has proven ability to collaborate closely with customers, to understand markets and create value propositions, and to deliver advanced packaging and SiP solutions to meet growth momentum across a broad range of end markets. Manufacturing facilities are strategically located within key electronics manufacturing hubs, including Taiwan, China, Korea, Japan, Malaysia, and Singapore. Serving customers across the global electronics ecosystem, regional sales offices are located in Sunnyvale (USA), Brussels (Europe), Hsinchu (Taiwan), Shanghai/Beijing (China), Shenzhen (China), Yokohama (Japan), Gyeonggi-do (Korea) and Singapore. For more, please visit: aseglobal.com. Also, please follow ASE on Twitter: @aseglobal.

產業
半導體製造
公司規模
10,001+ 名員工
總部
Kaohsiung, Taiwan
類型
上市公司
專長
Substrate design and supply、Wafer level packaging、Fanout、Fiip chip、System-in-Package、Wire bond、TSV-interposer integration、Wafer probe & bump、MEMS & sensor solutions、Embedded die technology、Final test and design、Electronic manufacturing services、VIPack和Advanced Packaging

地點

  • 主要

    No. 26, Chin 3rd Road

    Nantze Export Processing Zone

    TW Kaohsiung, Taiwan

    查詢路線
  • 1255 E. Arques Ave

    94085 USCASunnyvale

    查詢路線
  • 550, Chung-Hwa Road

    Section 1

    320 TWChung-Li

    查詢路線
  • Waterloo Office Park - Building M

    Drève Richelle, 161, Box 23

    B-1410 BEWaterloo

    查詢路線

日月光員工

動態消息

  • 瀏覽日月光的組織專頁,圖案

    84,974 位關注者

    技職典範 永續薪傳-第六屆技職教育貢獻獎-團體組🏆 日月光今年很榮幸從教育部部長手上接下這個獎座,我們長期關注學生的畢業發展,與校園合作,提前讓學生接軌職場,提供發展個人長才機會,並以多元的員工福利照顧每位夥伴,讓畢業學生不用成為北漂族,也能在南部找到好工作✨ 主動和學校合作多項的專案,為的就是讓學生可以透過不同管道,提早認識企業、了解職場環境;成為日月光的一份子後,我們更有責任,開立專班或是進修學程,持續培育這些潛質人才的發展,學習多元新技能 (#Reskill),並且能有效提升技能 (#Upskill)。公司能夠更加了解校方及學生的需求,提供學生更適切的職業試探機會,串接半導體產業脈動,培育即戰力的專業實務人才,讓學生有更多元、更暢通的發展管道🙋🙋♂️ 日月光以永續經營的理念,透過完整的訓練體系及福利照護政策,打造多元共融的職場環境,吸引畢業學子加入,培植更多半導體產業專才。我們也長期支持及配合政府政策,重視人才永續,建構完善職涯發展計畫,如產學聘用、在職進修轉型方案等,給予同仁持續發展的機會與價值,與日月光共同成長,成為公司穩定且關鍵的續航力💪 了解更多資訊,歡迎前往Life at ASE Taiwan分頁https://lnkd.in/gjKX8hfU    #技職教育貢獻獎 #日月光多元攬才 #全方位人才培育

  • 瀏覽日月光的組織專頁,圖案

    84,974 位關注者

    ASE recently received the TSMC Open Innovation Platform's Partner of the Year Award 2024 in the category of 3DFabric #OSAT. This accolade recognizes ASE's dedication in supporting TSMC‘s mission to accelerate innovation, efficiency, and productivity within semiconductor ecosystem. We are immensely grateful to TSMC for this recognition, as expressed here by Ingu Yin Chang. And thank you to ASE's pathfinding engineering teams for constantly pushing innovation forward. Thanks also to Mark Gerber for accepting the award on ASE's behalf. Our strong partnership and close collaboration with TSMC is helping ASE to provide our customers with the most innovative and creative solutions for AI and beyond. #advancedpackaging #heterogeneousintegration #design #3DBlox #3DFabric #VIPack #FoCoS #Bridge

  • 瀏覽日月光的組織專頁,圖案

    84,974 位關注者

    Once again, SEMICON Europa delivered! It was an expanse of data-driven optimism, innovative technology presentations, and tremendous networking opportunities. Co-located with Electronica, the show floor was buzzing with people and conversation, and ASE was delighted to support activities at the USI (Universal Scientific Industrial Co., Ltd.)/ Asteelflash) exhibition, putting a spotlight on advanced packaging and system-in-package technologies (thanks to Polly Wen).  On the conference side, SEMI’s Ajit Manocha gave a CEO view of the global market, exploring the unprecedented growth opportunities that are leading us towards the Quantum era while describing the critical need for industry collaboration on global advocacy, #sustainability, and workforce development initiatives. SEMI Europe President Laith Altimime warmly welcomed everyone back to #Munich, and kicked off the excellent CxO Summit by describing the permeation of AI and the application drivers propelling the semiconductor market towards $1T+ by 2030. His presentation set the stage for the brilliant talks that followed from speakers including, Gustav Kalbe, Jari Kinaret, Luc Van den hove, Kai Beckmann, John Behnke, Barbara Frenkel, Pierre Barnabé, Frederic Godemel, Stephan Eirik Haferl, Katharina Westrich, and Carlos Mazure! ASE had two notable presentations on the conference agenda: Firstly, Mark Gerber presented on ‘elevating power efficiencies through advanced packaging innovation’, particularly honing in on the benefits derived across the #VIPack and #PowerSiP platforms that are significantly helping data center and HPC applications in the AI era. Secondly, Ryan Lai presented on '#MEMS & #Sensors package innovation to accelerate AI everywhere', on the premise that sensing technology has become pivotal to accelerating #AI everywhere. Indeed it is driving innovation in packaging, and devices are brimming with greater function and performance integrated by innovators who strive to closely emulate human sensing. Ryan explored the role of sensing in AI, and shared how ASE’s innovative portfolio is evolving in alignment with game changing applications that will help our world become smarter, healthier, greener, and much more efficient. Huge thanks to the entire SEMI Europe team including Cassandra Melvin, Ana Bernardo, Maria Daniela Perez, Robert Sellnow, and Salil Gupte for all the unwavering help and support. You're all very much appreciated! Roll on, #SEMICONEuropa 2025!

    • 無圖片說明
    • 無圖片說明
    • 無圖片說明
    • 無圖片說明
    • 無圖片說明
      +5
  • 瀏覽日月光的組織專頁,圖案

    84,974 位關注者

    We are witnessing a monumental shift from an internet economy to an AI-driven world, where tools like ChatGPT are just the beginning. As AI integrates deeper into our lives, we anticipate a surge in demand—tripling to 30 billion units—and propelling the semiconductor market toward $1 trillion. 🚩Challenges Ahead Despite this growth, we face significant challenges in scaling AI performance, managing power consumption, and rising production costs. Heterogeneous integration is essential to overcome these hurdles, enabling us to achieve sustainable scaling in the AI era. 🎯Advanced Packaging for AI and HPC ASE’s advanced packaging platform, VIPack™️, leverages advanced redistribution layer (RDL) processes, embedded integration, and 2.5D and 3D technologies to enhance performance and reduce costs, empowering innovation in AI and high-performance computing (HPC). With our Integrated Design Ecosystem™️ (IDE) in collaboration with leading EDA vendors, we are enabling faster and more efficient design processes for our customers. 🙌Join Us The AI economy is poised for exponential growth, and we are excited to collaborate with partners to shape its future. Let’s push the boundaries of innovation together! 👉🏻Learn how heterogeneous integration accelerate the AI Economy: https://lnkd.in/gJB8hBMj #AI #Semiconductor #HeterogeneousIntegration #Innovation #VIPack

    Accelerating the AI Economy through Heterogeneous Integration | ASE

    Accelerating the AI Economy through Heterogeneous Integration | ASE

    ase.aseglobal.com

  • 瀏覽日月光的組織專頁,圖案

    84,974 位關注者

    There were countless moments of enlightenment, inspiration, and camaraderie at the recent Global Semiconductor Alliance GSA Women's Leadership Initiative WISH 2024 conference in San Jose. ASE was proud to sponsor such an impactful event that had almost doubled in size over the 2023 edition. #WISH2024 was where over 700 women (and some guys) gathered to hear from accomplished semiconductor industry executives that are fearlessly blazing trails in the AI era, yet paying forward with intention and resolve. Keynoter, Christine King, spoke candidly about her professional journey from humble beginnings to being the world’s first female CEO of a semiconductor company, with insights and humor, and we loved her shout out to ASE CEO Tien Wu during her talk! Breakout sessions were excellent, demonstrating innovations that are driving applications forward at unprecedented pace. Expert panel moderators including Sylvia Acevedo, Amber Huffman and Gayathri Radhakrishnan posed compelling questions to draw out thought-proving responses that promoted resiliency and determination, as well as allyship and collaboration.  And huge kudos to the panel of gentlemen, including Belli Kuttanna (Rivos Inc.), Nuno Ramalho (Synopsys Inc), Parthasarathy Ranganathan (Google), and Rajeev Pal (Qualcomm), who all spoke from the heart to share perspectives and offer encouragement. Rani Borkar spoke passionately about continuous personal growth, sharing that “what got you here, won’t get you there.” Brava to a star of an EmCee, Annelise McCarthy, whose pizzazz was infectious, and to the extremely capable WLI team led by the amazing Traci Brandon (thanks as always to Ahlam Samad, Caitlin Kelley, Darla Vasquez, Shungo Saito). Of course, WISH 2024 would have been impossible without the vision of GSA CEO Jodi Shelton who has been instrumental in elevating the WLI platform, illuminating female leadership, and providing opportunities for women to gather and learn from some of the greats. Team ASE had the best time - and we're already excited about WISH 2025! #teamwork #advancedpackaging #heterogeneousintegration #VIPack

    • 無圖片說明
    • 無圖片說明
    • 無圖片說明
    • 無圖片說明
    • 無圖片說明
      +4
  • 瀏覽日月光的組織專頁,圖案

    84,974 位關注者

    🌊 Taiwan, a beautiful island surrounded by vibrant waters, is home to a diverse marine ecosystem. Sadly, this natural heritage faces threats from growing waste accumulation on the ocean floor and beaches.    Since 2021, ASE Global has taken a stand with our marine conservation program. We've mobilized over 150 divers, conducted more than 140 cleanups, and restored 540 coral colonies to help protect and revitalize ocean ecosystems. 🌍💧   In collaboration with the ASE Environmental Protection and Sustainability Foundation, the corporate communications team has produced a short film to share our journey and achievements. Highlighting ASE’s innovative marine conservation and environmental stewardship, the film has captivated international judges with its creative portrayal of our sustainability efforts and social impact.   We are incredibly proud that our film has won Gold at the PwC Sustainability Impact Awards! 🎉🌟 This award not only honors sustainable innovation in Taiwan but also aligns with the vision of the Cannes Lions International Festival of Creativity, celebrating storytelling that drives impact, in alignment with the UN SDGs.   #Sustainability #MarineConservation #SocialImpact #ASE

  • 瀏覽日月光的組織專頁,圖案

    84,974 位關注者

    Hello GSA Global Semiconductor Alliance You’ve come a long way! A throwback to the mid-2000s, when ASE first won a coveted seat representing the OSAT sector, on the Board of directors of the FSA (before it evolved to become GSA). We’ve never looked back since, and have maintained a very good relationship with the GSA global team over the years. The charismatic leadership of Jodi Shelton and the dedicated support of the GSA member community have contributed in no small measure to the meteoric growth of the semiconductor industry. Through the era of the internet, smart phones, cloud and now #AI, our industry has never stopped transforming and innovating. This year, ASE was a Platinum sponsor at the APEF in #Taipei. The calibre of the speakers at the forum was impressive but what was truly inspiring was the increased representation of women on the agenda including Claire Wang | Debra Bell | Hsiao-Lu Denise Lee | Mei May Soo | Vanessa Lee Although #AI and its impact took centerstage at the forum, the richness and depth of the day’s presentations as well as panel discussions were deeply insightful and engaging. Once again, hats off to the amazing GSA team Power Chi Crystal Wang Shungo Saito for the organizing of a successful event. Happy 30th anniversary to GSA Global and Happy 20th anniversary to GSA #Asia Pacific To more good years to come #Taiwan #onetrillion2030 #chiplets #heterogeneousintegration #semiconductors #edgecomputing #machinelearning #GenAI #WomeninTech

    • 無圖片說明
    • 無圖片說明
    • 無圖片說明
    • 無圖片說明
    • 無圖片說明
      +5
  • 瀏覽日月光的組織專頁,圖案

    84,974 位關注者

    It was a tremendous honor to host a large delegation of distinguished guests from Jalisco, Mexico at ASE’s US Headquarters in #Sunnyvale this week. Leading the contingent was Governor Enrique Alfaro Ramírez, accompanied by Governor elect, Pablo Lemus Navarro who will move into office 2024 – 2030. Their joint presence and visit to the #SiliconValley is testament to their alignment  - and commitment to growing the semiconductor industry in Jalisco. Governor Alfaro spoke passionately about how his administration has supported and partnered with leading #semiconductor companies to build up a thriving manufacturing hub in #Guadalajara, widely known as Mexico’s Silicon Valley. One of his economic ministers, Xavier Orendain De Obeso shared his perspective on the ongoing strategic investments in technology, infrastructure, and talent to support a growing industry, while Alfonso Pompa Padilla, Secretary of Ministry of Science, Technology and Innovation, and Juan Carlos Flores M., Secretary of Education, deeply echoed these sentiments.   Governor elect Lemus shared his excitement and vision for the next six years and beyond, while newly elected Secretary of Economic Development Cindy Blanco Ochoa spoke ardently about her motivation and drive to build out the semiconductor and OSAT ecosystem, with ASE leading the way. Thank you to ASE’s Ingu Yin Chang for sharing ASE's vision and to Ou Li for sharing some personal experiences from her visits to the region, referencing the amazing #engineering talent - and fabulous food. We much appreciate the support from our sister companies, ISE Labs | ASE and Universal Scientific Industrial Co., Ltd. Represented by Jeff Thompson and Andrew Lee respectively, both underscored the importance of Guadalajara within the North American semiconductor value chain. Sincere thanks to Dina Grijalva and Nestor Eduardo Garcia Romero for all the help and support. We look forward to our continued partnership. Gracias - and safe travels home to Gobierno del Estado de Jalisco! #AI #Chiplets #HeterogenerousIntegration #advancedpackaging #VIPack

    • 無圖片說明
    • 無圖片說明
    • 無圖片說明
    • 無圖片說明
    • 無圖片說明
      +1
  • 瀏覽日月光的組織專頁,圖案

    84,974 位關注者

    🌐 Key Takeaways from the HI & AI Panel at IMPACT 2024   At the #IEEE EPS Panel during #IMPACT2024, ASE Global VP CP Hung moderated an insightful discussion with industry leaders Glenn Daves from NXP Semiconductors, Chih-Ming Hung from MediaTek, Chris Scanlan from IMAPS, and William Chen from IEEE-EPS on the future of #semiconductor design and manufacturing.   The panelists emphasized the need for standardization in packaging tools and materials to overcome industry challenges. Collaboration across the supply chain was emphasized as essential to aligning goals and advancing technologies. Interdisciplinary skills were also highlighted as critical for today’s engineers, who must combine deep expertise with broad, cross-functional knowledge.   The transformative potential of #AI was a major theme. From optimizing chip designs to streamlining complex packaging processes, AI is set to reshape the industry. Additionally, hybrid bonding was identified as a breakthrough technology poised to redefine chip interconnectivity. 💡   In closing, CP Hung emphasized the pivotal role of HI and AI in driving packaging innovations.   Thank you to the panelists and attendees for these valuable insights!   #IMPACT2024 #IEEE #AI #HI  

    • 無圖片說明
    • 無圖片說明
    • 無圖片說明
    • 無圖片說明
    • 無圖片說明
      +3

附屬頁面

相似頁面