#ForumHighlights ✨ Heterogeneous Integration Packaging Innovation Forum(異質整合封裝創新論壇): Driving Collaboration and Inspiring Innovation!
SEMI's latest data projects the global semiconductor market to surpass $1 trillion by 2025, highlighting #HeterogeneousIntegration as a key technology for enhancing chip performance and energy efficiency, driving progress beyond Moore's Law 🚀
The "Heterogeneous Integration Packaging Innovation Forum: AI drives the development of heterogeneous integration packaging technologies and supply chain collaboration (異質整合封裝創新論壇)," hosted by SEMI and the Metal Industries Research & Development Center under the Industrial Development Administration, MOEA, attracted over 200 industry leaders, including TSMC, Foxconn, Powertech, Nanya, 旺宏電子, and 台達電子 The forum explored industry trends, process technologies, and equipment innovations, highlighting collaboration opportunities in the AI-driven supply chain and shaping semiconductor innovation💪
📌 By 2025, global semiconductor demand will reach $127.5 billion, with Taiwan holding 20% of the market. According to Industrial analyst CHEN, I-HUA from the Metal Industries Research & Development Center, AI and HPC applications are driving rapid chip performance growth.As process nodes near 3nm limits, heterogeneous integration becomes key, introducing new topics like #FOPLP and #glasssubstrates. A strong supply chain and collaboration will accelerate domestic innovation and development.
📌 日月光 Director Calvin Lee shared that the next trend in heterogeneous integration packaging is large-scale panel-level fan-out technology, with silicon photonics driving high-density integration. He emphasized the importance of collaboration across the supply chain, especially for heat dissipation in high-power applications. The next step for heterogeneous integration is "#standardization," aiming to push Taiwan’s specifications globally.
📌 聯華電子股份有限公司 Deputy Director Pax Wang emphasized that AI demands higher data transmission rates and energy efficiency, both for cloud servers and edge devices. In addition to #HPC/ #AI data centers, other market segments will also grow, driving the adoption of advanced packaging solutions. To make AI more sustainable and powerful in daily life, nearly all upgraded or specially designed AI solutions require supply chain collaboration. He called for the industry to join forces and grow together!
In addition to industry trend presentations, the forum also featured insightful technical discussions ✨.
Travis Liang , Vice President of GPTC, Joe Lin, Sales Assistance VP of Cheng Mei Instrument Technology, and Gary Lee, Chief Operating Officer of Ta Liang Technology, shared advancements in semiconductor packaging, including wet process applications, panel-level packaging circuit testing, and wafer stacking edge measurement.
Their presentations showcased Taiwan's leadership and strengths in heterogeneous integration and advanced packaging. 🔥
#semiconductor
