International Semiconductor Industry Group

I.S.E.S. Taiwan 2025 – Where AI Meets Semiconductor Innovation! The next wave of semiconductor innovation is happening in Taipei on May 13-14! This is your chance to connect with global industry leaders, gain exclusive insights into AI-driven semiconductor advancements, and be part of discussions shaping the future of advanced manufacturing. Why Attend? ✅ Unrivaled Speaker Lineup – Hear from TSMC, NVIDIA, Amazon Web Services (AWS), and more! ✅ Cutting-Edge Discussions – AI’s impact on semiconductor manufacturing, advanced packaging, and next-gen computing. ✅ Exclusive Networking – Engage with C-level executives, decision-makers, and top innovators. ✅ Future-Focused Agenda – Explore the latest breakthroughs shaping AI applications and chiplet architectures. Registration is open! Don’t miss your chance to be part of Taiwan’s premier semiconductor summit. Secure your spot today! 👉 https://lnkd.in/dPhK_Y5K #ISESTaiwan2025 #theISIG #AI #Semiconductors #AdvancedManufacturing #Connect #Collaborate #Community

We are honored to have KLA as the Platinum Sponsor for I.S.E.S. USA Power 2025, happening April 14-15, 2025, at Plug and Play Tech Center, Silicon Valley! As a global leader in process control and yield management, KLA plays a pivotal role in advancing semiconductor manufacturing, ensuring the highest levels of precision, efficiency, and quality across the industry. Their cutting-edge solutions in inspection, metrology, and data analytics are critical for enabling power semiconductor innovations, driving the next wave of SiC, GaN, and advanced power electronics technologies. With power electronics rapidly evolving to meet the demands of electric vehicles, renewable energy, and high-efficiency industrial applications, KLA’s expertise is helping to push the boundaries of performance, reliability, and sustainability. Their commitment to technology leadership and industry collaboration makes them an essential partner in shaping the future of wide-bandgap semiconductors and next-gen power solutions. Thank you, KLA, for your invaluable support in making I.S.E.S. USA Power 2025 a premier industry platform for innovation and collaboration! 📅 April 14-15, 2025 📍 Silicon Valley, California 🎟️ Join us to connect with industry leaders and explore the future of power electronics: https://lnkd.in/dZ5vzvE3 #ISESUSAPower2025 #ThankYouKLA #PlatinumSponsor #PowerSemiconductors #SiC #GaN #TechLeadership #Innovation #Connect #Collaborate #Community

We’re thrilled to welcome Dr. Raja Swaminathan, Corporate Vice President of Advanced Packaging at AMD, as both a keynote speaker and panelist at I.S.E.S. USA 2025, happening April 8-9, 2025, in Silicon Valley! A true industry trailblazer, Dr. Swaminathan leads AMD’s advanced packaging and heterogeneous integration roadmap, driving the next generation of semiconductor breakthroughs. With a career spanning Intel, Apple, and now AMD, his contributions to design-technology co-optimization (DTCO) have played a pivotal role in innovations such as EMIB, Apple's Mx packages, 3D V-Cache, and 3.5D architectures for AI accelerators. Exclusive Sessions with Dr. Raja Swaminathan: 🎤 Keynote: Scaling AI Performance & Chiplet Architectures – Gain insights into how chiplet architectures are transforming AI performance, efficiency, and scalability in the new era of computing. 💡 Panelist: HBM Development and Memory Expansions – Join the discussion on how high-bandwidth memory (HBM) and advanced packaging are unlocking new levels of performance for AI and HPC applications. With over 100 patents, 40+ publications, and a recent IEEE Fellow recognition, Dr. Swaminathan’s impact on semiconductor technology is undeniable. As a technical advisor to multiple startups, he continues to shape the future of heterogeneous integration, pushing the boundaries of what’s possible in silicon technology. 📅 April 8-9, 2025 📍 Plug and Play Tech Center Silicon Valley, California 🎟️ Be part of the conversation shaping AI, chiplet architectures, and memory innovations—register now! https://lnkd.in/dF-CibAn #ISESUSA2025 #AMD #Chiplets #HBM #AI #AdvancedPackaging #SemiconductorInnovation #TechLeadership #IEEEFellow #Connect #Collaborate #Community

We’re bringing another industry giant to I.S.E.S. USA 2025, and this is one you won’t want to miss! Mark Wade, Ph.D., CEO of Ayar Labs, will be a panelist in the Co-Packaged Optics Session, diving deep into Silicon Photonics and the Future of AI Infrastructure. As a pioneer in photonics technologies, Mark’s groundbreaking work has transformed how processors communicate. Before founding Ayar Labs, he led the team behind the world’s first processor to communicate using light—a breakthrough that set the foundation for next-gen data centers, AI, and high-performance computing. 💡 Why Mark Wade’s Session is a Must-Attend In December 2024, Ayar Labs secured a massive $155M in Series D funding, backed by AMD, Intel Capital, and NVIDIA, to tackle the urgent need for scalable, cost-effective AI infrastructure. As Silicon Photonics becomes a key enabler for AI-driven workloads, chiplet architectures, and next-gen computing, Mark will provide exclusive insights into how this technology is reshaping the semiconductor industry. 📅 April 8-9, 2025 📍 Plug and Play Tech Center, Silicon Valley, California 🎟️ Join the conversation shaping the future of AI, silicon photonics, and data infrastructure: https://lnkd.in/dF-CibAn #ISESUSA2025 #AyarLabs #SiliconPhotonics #CoPackagedOptics #AIInfrastructure #TechLeadership #Semiconductors #AMD #Intel #NVIDIA #Connect #Collaborate #Community

MSWS USA 2025 just leveled up! We’re beyond excited to welcome Dr. Peter Hartwell, VP of Engineering at TDK InvenSense, as a keynote speaker at this year’s MEMS & Sensors World Summit, happening April 15-16 at Plug and Play Tech Center, Silicon Valley! With over 30 years of experience in commercializing silicon MEMS systems, Dr. Hartwell is a visionary leader driving global technology and strategy at TDK US Corporation. His expertise spans sensors, actuators, and software, shaping the future of MEMS innovation across consumer electronics, industrial applications, and beyond. A Legacy of Innovation & Industry Disruption. Before TDK, Dr. Hartwell was Chief Technology Officer (CTO) at InvenSense, where he spearheaded groundbreaking MEMS advancements before the company’s acquisition by TDK. His career also includes pivotal roles as Architect of Sensing Hardware at Apple and Distinguished Technologist at HP Labs, contributing to some of the most impactful sensor technologies in the industry. With over 40 patents worldwide in MEMS devices and sensor applications, Dr. Hartwell continues to shape the future of sensing technology, pushing the boundaries of miniaturization, performance, and real-world applications. Why you can’t miss his session? Dr. Hartwell will provide exclusive insights into the next era of MEMS & sensor innovation, discussing how cutting-edge developments are revolutionizing industries from consumer electronics to automotive, healthcare, and industrial automation. 📅 April 15-16, 2025 📍 Plug and Play Tech Center, Silicon Valley 🎟️ Be part of the MEMS and sensors revolution—register today! https://lnkd.in/dhXASYcb #MSWSUSA2025 #MEMS #Sensors #TDKInvenSense #PeterHartwell #Innovation #SmartTechnology #Semiconductors #TechLeadership #Connect #Collaborate #Community

We’re excited to announce our official Event Partners for I.S.E.S. USA 2025, taking place April 8-9, 2025, at the Plug and Play Tech Center in Silicon Valley! Meet the Industry Giants Joining Us: Teikoku Taping System, Inc. | Plasmatreat | Amazing Cool Technology Corporation | Palomar Technologies | EV Group | B H S | Brewer Science | Exyte | Evatec AG | Lam Research | FormFactor Inc. From advanced packaging and materials to plasma technology, semiconductor equipment, and process innovation, these companies are driving the industry forward and offering a unique opportunity for attendees to engage with decision-makers, executives, and technical experts. 💡 Why Attend? ✔️ Network with top executives from our event sponsors, partners and members ✔️ Gain insights into the latest advancements in semiconductor technology ✔️ Explore opportunities for collaboration and business growth This is your chance to meet, learn, and connect with some of the biggest players in the semiconductor ecosystem. 📅 April 8-9, 2025 📍 Silicon Valley, California 🎟️ Register now to be part of this premier industry gathering: https://lnkd.in/dF-CibAn #ISESUSA2025 #SemiconductorInnovation #EventPartners #TechLeadership #AdvancedPackaging #SemiconductorEquipment #LamResearch #FormFactor #EVGroup #BrewerScience #Connect #Collaborate #Community

Join I.S.I.G. as our Business Development Assistant in Taiwan! This exciting role offers the opportunity to work closely with our General Manager of Taiwan, Mia Chen, engaging in sales calls, client outreach, lead generation, and business development in the semiconductor industry. If you're a motivated sales professional ready to make an impact, apply now! #Hiring #SalesJobs #SemiconductorIndustry #TaiwanJobs #CareerOpportunity #JoinISIG #Connect #Collaborate #Community

I.S.E.S. USA Power 2025 just got even bigger! We’re beyond thrilled to welcome Gene Sheridan, CEO at Navitas Semiconductor, as a keynote speaker at this year’s summit, happening April 14-15, 2025, at Plug and Play Tech Center, Silicon Valley! With over 25 years of experience in power management and semiconductors, Gene is a true industry disruptor, leading Navitas Semiconductor at the forefront of GaN and SiC power solutions that are shaping the future of energy-efficient electronics. His career is marked by game-changing leadership, breakthrough innovations, and transformative business growth, making him one of the most influential figures in power semiconductors today. Before Navitas, Gene’s leadership transformed BridgeCo, a VC-backed semiconductor start-up, into an 80% market share powerhouse in wireless audio before its successful acquisition by SMSC. Prior to that, as VP & GM at International Rectifier, he led a $600M business unit, scaling teams and revenues to industry-leading heights. This is your chance to hear directly from a leader who is redefining the power semiconductor industry! 📅 April 14-15, 2025 📍 Plug and Play Tech Center, Silicon Valley 🎟️ Secure your spot today: https://lnkd.in/dZ5vzvE3 #ISESUSAPower2025 #Navitas #GaN #SiC #PowerElectronics #Innovation #Semiconductors #GeneSheridan #TechLeadership #Connect #Collaborate #Community

We’re excited to welcome Hidenori Abe, CTO of Semiconductor Materials at Resonac, as a speaker at I.S.E.S. USA 2025! A trailblazer in semiconductor materials innovation, Hidenori Abe leads electronics materials R&D and strategy at Resonac, driving advancements in substrates, displays, and packaging solutions. He has played a pivotal role in open innovation, spearheading initiatives like JOINT2, a cutting-edge packaging consortium focused on 2.xD and 3D package development. With a deep background in CMP slurry, epoxy molding compounds (EMC), and power module materials, Abe has been instrumental in developing next-generation chiplet packaging technologies that are essential for AI, high-performance computing, and advanced semiconductor integration. His contributions have driven major co-creation efforts between materials and equipment manufacturers, shaping the future of semiconductor fabrication. Presentation: Open Innovation Strategy of Resonac, a Co-Creative Chemical Company Abe will share insights into Resonac’s open innovation strategy, including: 🔹 How chiplet packaging is redefining semiconductor materials and manufacturing. 🔹 The role of co-creation between materials, equipment, and substrate manufacturers. 🔹 The impact of Resonac’s Packaging Solution Center & JOINT2 platform on the industry. 🔹 The launch of US-JOINT, Resonac’s new Silicon Valley-based open innovation initiative. 📅 When: April 8-9, 2025 📍 Where: Silicon Valley, CA Don’t miss this opportunity to learn from one of the leading minds shaping the future of advanced semiconductor materials and packaging! Join us at I.S.E.S. USA 2025: https://lnkd.in/d_BWZRU9 #ISESUSA2025 #Semiconductors #ChipletPackaging #AdvancedMaterials #Innovation #OpenInnovation #AI #SiliconValley #Connect #Collaborate #Community

The countdown to I.S.E.S. USA 2025 is on! We’re bringing the biggest names in semiconductors to Silicon Valley on April 8-9 for two days of AI-powered innovation, industry insights, and game-changing discussions. Theme: AI-Powered Innovation: Driving the Next Wave of Semiconductor Breakthroughs Just a few of our incredible speakers: ✅ Google – Bizhan Delgoshaei, Head of Custom Silicon Engineering Operation ✅ Broadcom – Near Margalit, VP & GM, Optical Systems Division ✅ NVIDIA – M. Ashkan Seyedi, Director, LinkX Products ✅ Samsung Electronics – Vincent Kim, EVP, Head of Packaging ✅ Micron Technology – Akshay Singh, VP Advanced Packaging Tech Development ✅ Ayar Labs - Mark Wade, CEO ✅ GlobalFoundries – Kevin Soukup, SVP Silicon Photonics Product Line ...and many more! 📢 This is where semiconductor leaders, investors, and visionaries will shape the future. Will you be there? 🔗 Register now – https://lnkd.in/d_BWZRU9 #ISESUSA2025 #Semiconductors #AI #ChipInnovation #SiliconValley #Leadership #15YearsOfISES #Connect #Collaborate #Community