QPT

And we have coverage in China for our heat dissipating, die attach process for high power, power electronics applications. https://lnkd.in/ezc7zAQV

Compound Semiconductor Magazine & CS International Conference has written about our die attach process announcement.  https://lnkd.in/en5GmCzA

Great to be covered by Semiconductor Today. https://lnkd.in/eA38Mp-j

One of the most important magazines in Power Electronics, Power Electronics World Magazine & PE International Conference has covered our die attached story about solving heat removal in GaN electronics. #GaN #PowerElectronics #Electronics #EV #automotive #VFD https://lnkd.in/eFf7xwTw

Delighted that Steve Bush of Electronics Weekly has written about our new die attach process, qAttach, that sets a new standard for removing waste heat from a die. This solves a major problem of overheating in power electronics especially for GaN dies as they handle a lot of power in a very small area. #GaN #SiC #PowerElectronics #VFD #MotorControl #EV #automotive #electronics #GreenTech #qGaN #qAttach https://lnkd.in/eJPHgGUa

And now the new die attach process in Spanish.... https://lnkd.in/eijxe26s

Word of our Die Attach process is spreading round the world. Here is the story in The Volt Post from India. https://lnkd.in/esWn-FG6

Delighted that Nick Flaherty of eeNews Europe has covered today's die attach process announcement as a top news story! #DieAttach #PowerElectronics #GaN #SiC #Die #HeatTransfer https://lnkd.in/eQzSxDyU

QPT solves major problem of waste heat removal in power electronics with novel die attach process Revolutionising power electronics packaging with up to 15x better heat removal and greater reliability The power electronics industry is facing a problem in that, as the power handled by transistors increases to meet the needs of new applications, the packaging will increasingly struggle to remove the waste heat from the die. QPT, the innovative power electronics company, has just filed a patent for a novel way to attach dies to the heat spreaders or substrates which are typically Aluminium Nitride (AlN), which it calls qAttach™. This provides a much better way to conduct heat away from the die and also increases reliability as the assembly process places less stress on the substrates, which is one of the biggest challenges the high-power semiconductor packaging industry faces. Our new qAttach process is a universal solution to solving the growing problem of the removal of waste heat that would otherwise hold back the development of next generation, power electronics. The ability of qAttach to improve transfer heat away from the die by up to 15x can also be used to solve the removal of waste heat from almost any other type of transistors such as Silicon Carbide (SiC) to enable them to handle higher power loads than they can at present. We already have a couple of leading multinationals interested in licensing this process as they can see the strategic benefits that this innovation would bring to their product lines. Please see article for more information. #PowerElectronics #die #CoolingDie #ChipCooling #packaging #SiC #electronics #SemiconductorBusiness #Automotive #VFD #GreenTech #EV

QPT at Bodo’s Wide Bandgap Event - December 3 & 4, 2024 - Hilton Munich Airport Want to know how to get the most out of GaN power and unleash the full potential of GaN to slash energy wastage in motor drives with our qGaN technology? Join Tony Astley at Bodo’s Wide Bandgap Event on 3 & 4 December 2024 at the Hilton Munich Airport. Learn more about our innovative qGaN technology. This award-winning technology has many other advantages such as pure sine wave output to reduce the stresses on motors to improve their MTBF, smaller sized solutions and lower BOM costs. In addition, our brand new, die attach process enables waste heat to be conducted away from dies much more efficiently than current attachment processes to prevent GaN dies from overheating.   Look for his name badge or contact him via LinkedIn to arrange a meeting.   #GaN #PowerElectronics #VFD #MotorControl #ElectricMotor #Electronics #SemiconductorBusiness #packaging #DieAttach #qGaN   https://lnkd.in/ehQycRYj