DYMEK VIETNAM

#HFLeistung #EMVTechnik #Elektronik #ICTesting #HFProbe #Elektronikentwicklung #Signalinterferenz #Technologie #AutomotiveElectronics #HighFrequency #LangerEMV #Halbleiter #Ingenieurwesen #Baugruppen #Elektroniksicherheit

“Nanotronics adapts its models to the continuous improvements of NVIDIA architectures with new core types,” said Matthew Putman, co-founder and CEO of Nanotronics.

Revolutionizing Fluid Control in Microfluidics 💉 Precise fluid control is at the heart of microfluidic technology, driving innovations in research, diagnostics, and medicine. 🌟 In our latest blog post, we compare key flow control methods, including the trusted syringe pumps, and introduce the cutting-edge OB1 Microfluidic Flow Controller. Designed for advanced fluid management, the OB1 offers unmatched precision, speed, and adaptability to meet the demands of modern microfluidic workflows. Discover how Elveflow's solutions can empower your work and push the boundaries of innovation. 👉 Read more here:https://bit.ly/3PlpHu3 #Microfluidics #FlowControl #Innovation #Diagnostics #Research

𝐀𝐝𝐯𝐚𝐧𝐜𝐞𝐝 𝐄𝐥𝐞𝐜𝐭𝐫𝐨𝐦𝐚𝐠𝐧𝐞𝐭𝐢𝐜 𝐅𝐚𝐮𝐥𝐭 𝐈𝐧𝐣𝐞𝐜𝐭𝐢𝐨𝐧 𝐰𝐢𝐭𝐡 𝐈𝐂𝐈-𝐃𝐏 𝐇𝐇𝟐𝟓𝟎-𝟏𝟓 𝐒𝐞𝐭 The ICI-DP HH250-15 Set is a cutting-edge solution for electromagnetic fault injection (EMFI) to test the resilience of safety-critical circuits. It generates both single and double pulse sequences, with a minimum pulse following time of 25 ns, providing precise testing capabilities. The set includes the BPS 204 high voltage source and the ICI-DP HH250-15 probe, which can be synchronized with external function sequences via sync inputs. Parameters such as pulse voltage and polarity are fully adjustable via software. With its high temporal and spatial resolution, the ICI-DP HH250-15 Set is ideal for use in cybersecurity, semiconductor testing, and critical systems validation, ensuring the integrity and reliability of electronic systems.  For more details, visit: https://lnkd.in/gqUSPGkh. #EMFITesting #CircuitTesting #FaultInjection #HighVoltageTesting #Cybersecurity #SemiconductorTesting #CriticalSystems

𝐌𝐞𝐫𝐫𝐲 𝐂𝐡𝐫𝐢𝐬𝐭𝐦𝐚𝐬 𝐚𝐧𝐝 𝐇𝐚𝐩𝐩𝐲 𝐍𝐞𝐰 𝐘𝐞𝐚𝐫 𝟐𝟎𝟐𝟓 Season's Greetings from Dymek Vietnam As the holiday season approaches, we take this opportunity to reflect on an extraordinary year of collaboration, innovation, and success—achievements made possible by your trust and unwavering support. At Dymek Vietnam, we deeply value the relationships we have built and look forward to reaching even greater milestones together in 2025. May your Christmas be filled with warmth, love, and laughter, and may the New Year bring abundant prosperity, happiness, and exciting new opportunities. Thank you for being an indispensable part of our journey. We are thrilled to continue working together to achieve excellence and shared success in the coming year. Wishing you and your loved ones a safe, joyful, and peaceful festive season. Warm regards, Dymek Vietnam

𝐅 𝐒𝐞𝐫𝐢𝐞𝐬 𝐃𝐢𝐞 𝐁𝐨𝐧𝐝𝐞𝐫: 𝐏𝐫𝐞𝐜𝐢𝐬𝐢𝐨𝐧 𝐟𝐨𝐫 𝐀𝐝𝐯𝐚𝐧𝐜𝐞𝐝 𝐀𝐩𝐩𝐥𝐢𝐜𝐚𝐭𝐢𝐨𝐧𝐬 The 73KF Series Die Bonder is the ultimate solution for precision die attach in RF, microwave, semiconductor, hybrid, and medical device industries. Designed with a robust gantry-style chassis and capacitive touchscreen interface, it offers unparalleled ease and accuracy in die placement. Key features include epoxy and eutectic bonding capabilities, interchangeable tool heads for quick conversions, and programmable settings with storage for up to 30 device profiles per mode. Its 8:1 X-Y-Z micromanipulator, programmable force (15-150g), and radiant tool heat ensure consistent and repeatable results. The open-frame design of the 73KFX model supports integration into conveyor systems or tabletop setups, accommodating extra-tall components. Learn more: https://lnkd.in/gxkSX368 #DieAttachTechnology #SemiconductorManufacturing #MicroelectronicsInnovation #EutecticBondingSolutions #EpoxyDieBonding #PrecisionDiePlacement #RFandMicrowaveDevices #HybridTechnologyTools #MedicalDeviceAssembly #AdvancedBondingEquipment #DieBonderSolutions #ElectronicsManufacturingEquipment

𝐉𝐚𝐧𝐝𝐞𝐥 𝐑𝐌𝟑𝟎𝟎𝟎+: 𝐏𝐫𝐞𝐜𝐢𝐬𝐢𝐨𝐧 𝐢𝐧 𝐌𝐚𝐭𝐞𝐫𝐢𝐚𝐥 𝐓𝐞𝐬𝐭𝐢𝐧𝐠 The Jandel RM3000+ delivers high-precision four-point probe measurements with currents from 10nA to 100mA and voltage detection from 0.001mV to 1000mV. It offers a wide measurement range—1 milliohm/square to 100 megohms/square for sheet resistance and 1 milliohm.cm to 1 megohm.cm for volume resistivity—making it ideal for both thin-film and bulk material testing. With autoranging, onboard memory for 50 time-stamped readings, and integrated software for data management, the RM3000+ ensures seamless and efficient operation. Its accuracy (better than 0.1%) and support for USB/RS-232 connectivity make it a trusted tool for semiconductor and material science research. Learn more: https://lnkd.in/gfMBMcPj  #FourPointProbe #SheetResistance #MaterialTesting #JandelRM3000Plus #SemiconductorResearch #PrecisionMeasurement #ThinFilmAnalysis #BulkResistivity

The 4Di InSpec AT is a high-throughput, high-resolution defect and feature inspection solution. The automated system can measure dozens of edge break features, chamfers and radii in minutes rather than days, vastly improving throughput and driving down inspection costs. The 4Di InSpec AT integrates a non-contact 4D InSpec or 4D InSpec XL surface gage with a collaborative robot and other automation for rapid production inspection. 4Di InSpec AT systems are the turnkey option for quality control of aerospace components such as turbine blades and rotors, air foils, high-pressure compressor blades, blisks and dovetails. The high-resolution gage measures in any orientation, on curved surfaces, over large and complex geometries, and in tight spaces or blind locations. The 4Di InSpec AT instantly produces high-resolution, 3D measurement results, with far more information than other methods. An inspector can immediately see both an image of the feature and easy-to-read statistics. User-friendly measurement automation software flags any out-of-spec measurements and automatically remeasures the locations. To learn more, click on the video below: https://lnkd.in/gve4fBPm

The 4D SurfSpec is the first surface measurement system for the process control of coatings, from substrate to clearcoat. Comprehensive, quantified results let you fingerprint the entire process — to ensure final coating quality and to prevent further processing on parts leading to unacceptable final quality. The portable 4D SurfSpec can be used throughout the factory, either handheld or robot-mounted. Test any of the common locations of concern on a body in white, then retest the same locations after coating to trace results throughout the process. The 4D SurfSpec measures in any orientation, even upside down, on verticals and on curved surfaces. Developed in partnership with key industry experts, the 4D SurfSpec provides real-world usability and the most relevant information. It is the only system that measures surfaces on all common materials, at every coating stage. It provides the reliable data you need to control every step of the coating process and produce high-quality final coatings. For more about the 4D SurfSpec, please visit: https://lnkd.in/e6xvADpr.

The 4D Showcase: This week, we are kicking off our ongoing product showcase with the NanoCam™ HD. This is a dynamic profiler that measures surface roughness on small to meter-scale coated and uncoated optics, as well as precision metals, plastics, and other polished specular surfaces. How can it work for you? This measures supersmooth surfaces with sub Angstrom resolution, including major applications like x-ray and deep EUV mirrors, synchrotron optics, lenses for semiconductor equipment, laser gyro mirrors, and laser resonators. Check it out in-person next month at our SPIE Photonics West Booth #1849 in San Francisco or learn more here: https://lnkd.in/dKm9VjKF