Nicholas Harris, CEO and Co-founder of Lightmatter delivered an insightful keynote at the International Microelectronics Assembly and Packaging Society (IMAPS) 2024 in Boston, captivating an audience of 1,000 attendees from diverse sectors, including packaging technologists, equipment vendors, OSAT, and material suppliers. His presentation tackled the pressing challenges posed by the growing compute and data bandwidth demands driven by generative AI, highlighting traditional technologies' limitations.
Harris articulated a compelling vision for Silicon Photonics as a crucial solution to meet these performance needs. He emphasized how Lightmatter’s optical interconnect technologies, Passage, are uniquely positioned to connect hundreds of thousands of chips within a high-bandwidth, low-latency interconnect framework. His talk underscored the critical role of innovative technologies in advancing the future of computing and data transmission.
Concluding his presentation, Harris asked the packaging community to focus on the technology building blocks necessary to bring Silicon Photonics to high-volume manufacturing. His call to action highlighted the importance of collaboration and innovation in achieving scalable solutions for the future.