Onto Innovation

“Advanced IC substrates (AICS) have been marching toward the 2µm line/space (L/S) redistribution layer (RDL) technology node for some time. However, many questions remain about the ability of organic substrates to meet the line/space requirements of the next generation of advanced packages (AP), those below 2µm L/S and perhaps to 1.5µm L/S. Simply put: are organic substrates up to the challenge?” Onto Innovation’s Keith Best answers this question in his latest blog at Semiconductor Engineering. To read what Keith has to say about organic and glass substrates, please visit: https://lnkd.in/eKTq-GQ2

Onto Innovation is currently hiring for a Staff Supplier Quality Engineer at its Bloomington, Minnesota, office. This position requires hands-on engagement in all aspects of supplier quality, product quality and customer support. As a lead, you will be expected to drive effective problem-solving, continuous improvement strategies and proactive solutions to assure best-in-class supplier quality performance. Responsibilites include: ▪ Owning all aspects of supplier quality for assigned component, assembly and contract manufacturing suppliers. ▪ Establishing cross-functional working relationships and collaboration across the organization (manufacturing, supply chain, engineering, quality, service) to gather, organize and execute solutions for the production line and customers. ▪ Engaging throughout the product lifecycle internally and with suppliers to assure supplier quality outcomes meet requirements. ▪ Developing and deploying supplier and contract manufacturer quality management strategies with commodity business management and supplier development engineering. To apply for this position, please visit: https://lnkd.in/e3u9S8k4.

Onto Innovation is seeking a Senior Product Manager, Inspection, in its Bloomington, Minnesota, office. The Senior Product Manager will work with a cross-functional team to manage the health of Onto's inspection products and will drive the continual improvement process and next generation product initiatives. Major responsibilities include developing product strategy (including specifications and roadmaps), coordinating product life cycle initiatives, and tracking product health. Other responsibilities will include: ▪ Cross-functional engagement with account managers, engineering, operations and executive leadership ▪ Manage and own product life cycle gate reviews ▪ Develop product requirement documents for new products ▪ Assist Technical Account Managers in specification reviews ▪ Prioritize engineering projects based on field input and internal resource availability To apply for this position, please visit: Careers at ONTO.

Increasing interconnect density is making it harder to guarantee these devices will work as expected. By Anne Meixner. https://lnkd.in/gm4vGciz #semiconductor #interposers #KGI Jeorge Hurtarte, PhD, MBA Teradyne Vidya Neerkundar Siemens Digital Industries Software Monita Pau Onto Innovation Bruker Amkor Technology, Inc. TSMC John R Hoffman Nordson Test & Inspection Saman Adham Min-Jer Wang Advantest Shinji Hioki

Polarized spectroscopic reflectometry has been used for optical critical dimension and film thickness analysis for over two decades but has taken a backseat to Mueller matrix ellipsometry as device scaling has persisted. With the scaling of advanced packaging feature sizes and vertical stacking of chips and wafers, reflectometry is ideally suited as an "all in one" solution to the most challenging metrology applications in advanced packaging. In this presention at SEMICON Korea 2025, February 19-21, Onto Innovation will show how critical process steps like silicon back grind and polish, through silicon via etch and reveal, hybrid bonding Cu recess, redistribution layer after develop inspection and dielectric film deposition are all ideal applications for spectroscopic reflectometry utilizing advanced machine learning, fast Fourier transform and rigorous coupled wave analysis algorithms. A new spectroscopic reflectometry channel will also be introduced called MASE (multi-azimuth spectroscopic enrichment) that provides additional spectral channels and a significant sensitivity improvement on the most challenging applications (like Cu pad recess). For more on SEMICON Korea, please visit: https://lnkd.in/eg3C_GW.

Increasing interconnect density is making it harder to guarantee these devices will work as expected. By Anne Meixner. https://lnkd.in/gm4vGciz #semiconductor #interposers #KGI Jeorge Hurtarte, PhD, MBA Teradyne Vidya Neerkundar Siemens Digital Industries Software Monita Pau Onto Innovation Bruker Amkor Technology, Inc. TSMC John R Hoffman Nordson Test & Inspection Saman Adham Min-Jer Wang Advantest Shinji Hioki

🌟 Onto Innovation Receives Volume Purchase Agreement from a Leading DRAM Manufacturer for Metrology Product Suite 🌟 🚀 Announces expansion of metrology suite into the estimated $400 million critical films market with launch of Iris G2 🚀 🔹 Onto Innovation Inc. today announced that a leading DRAM manufacturer has finalized a $69 million volume purchase agreement spanning Onto Innovation’s optical metrology ecosystem, including common films, optical critical dimension, and integrated metrology. This agreement implies increased adoption of the Iris™ system for common films metrology, along with increased adoption of integrated metrology. Deliveries begin in the first quarter of 2025, supporting management’s expectations for the start of a recovery in the DRAM market in 2025. 🔹 Beyond memory, the demand for Onto Innovation’s films metrology has been robust, nearly doubling in revenue year over year. In response to market feedback, Onto Innovation is pleased to announce the launch of the Iris G2 system, a single platform film metrology system for both common and critical films for advanced node, mature and specialty device applications. #Innovation #Technology #Metrology #DRAM #IrisG2 #OntoInnovation #OpticalMetrology #MarketExpansion #TechNews To learn more, please visit: https://lnkd.in/eadZ_2Db.

🚀 Onto Innovation Advances Process Control Suite for 3D Interconnect Yields 🚀 🌟 Onto Innovation Inc. is excited to announce the advancement of a cutting-edge product suite for 3D interconnect process control! 🌟 🔹 3Di™ Technology on Dragonfly® G3 System: This new technology is designed for bump process control in high bandwidth memory (HBM) and advanced logic applications. 🔹 EchoScan™ System: Introducing a new system for detecting micro voids as small as 1µm in wafer bonding applications, including advanced hybrid bonding for Cu-Cu interconnects. 📈 Initial Orders for 3Di Technology: ·       Top HBM manufacturer ·       Tier one OSAT ·       Leading manufacturer of bump process equipment 📦 Shipping First System: The first EchoScan system will ship in Q1, with additional tools planned to ship to customers throughout 2025. #Innovation #Technology #ProcessControl #3DInterconnect #Metrology #Inspection #HBM #HybridBonding #AdvancedLogic #EchoScan #OntoInnovation To read more about these new interconnect innovations, please visit: https://lnkd.in/eR5BFthB.

The 2025 IEEE Hybrid Bonding Symposium starts this Thursday, January 16, and Onto Innovation’s Monita Pau will be among the speakers. Monita’s topic: Process Control for Hybrid Bonding Applications. “Direct Cu-Cu bonding is poised to succeed microbumps in devices requiring high-bandwidth data transfer. While its adoption differs among various high-end applications, 3D stacked memory is expected to be the volume driver for hybrid bonding, with its initial adoption in 3D NAND stack followed by HBM and 3D DRAM,” Monita says. “As known good dies/wafers are being bonded together, stringent process control is required every step along the way in order to ensure the final stacked product is of high yield. Bonding surface topography monitoring and the detection of particles, cracks and voids are some of the critical process control parameters in hybrid bonding. In this presentation, we will discuss the various metrology solutions addressing these needs.” Join Monita and others as they discuss the commercialization of hybrid bonding. To learn more about the event, please visit: https://lnkd.in/g65h58MV.