Semiconductor Engineering

Multi-physics is the new buzzword in semiconductor design and analysis, but the fuzziness of the term is a reflection of just how many new and existing problems need to be addressed simultaneously in the design flow with advanced nodes and packaging. By Brian Bailey. https://lnkd.in/g8TesJh2 #EDA #multiphysics #semiconductor #simulation #advancedpackaging Rich Goldman Ansys Roland Jancke Fraunhofer IIS, Division Engineering of Adaptive Systems Siemens Digital Industries Software John Ferguson Andy Heinig Suhail Saif Sherry Hess Cadence Synopsys Inc

Timely engineering fixes rely on communications standards, but data inconsistencies are getting in the way. By Anne Meixner. https://lnkd.in/g46Byu4Z #semiconductor #semiconductormanufacturing #dataanalytics #communicationstandards #semiconductoequipment Albert Fuchigami PEER Group Inc. Joe Fillion Onto Innovation SEMI Brian Rubow PDF Solutions Alan Weber PDF Solutions Cimetrix Incorporated Boyd F. Tignis Dieter Rathei DR YIELD Melissa Grupen Shemansky #smartmanufacturing

New technical papers recently added to Semiconductor Engineering’s library https://lnkd.in/gUnWRun9 #semiconductor #EDA #PDN #LLMs #chiplets #hybridbonding #AI Georgia Institute of Technology #CIM Madison Manley James Read Ankit Kaul University of Minnesota Cadence Subhadip Ghosh Endalk Y Gebru Chandramouli (Chandra) Kashyap ETH Zürich University of Bologna (Alma Mater Studiorum – Università di Bologna) Maciej Besta Luca Benini Torsten Hoefler 🇨🇭The University of Edinburgh Microsoft Congjie He Yeqi Huang Ziming Miao Universitat Politècnica de Catalunya Emmanuel Irabor, Mariam Musavi, Abhijit Das, Sergi Abadal Seoul National University of Science and Technology Sangwoo Park Jun Young Choi Rochester Institute of Technology Corning Incorporated Eli Powell Meghana Nagesha Robert Manley Bin Zhu Karl Hirschman

Chip Industry Week In Review https://lnkd.in/di_bpdPy Latest news: power spikes in AI workloads; critical IC mineral concerns; wafer shipments shrink; Europe bets big on AI; new ultrasonic cleaner; high-speed DRAM test; Europe’s 6G; HW-assisted verification; India IC grows; NPU acquisition; silent data errors and more #semiconductor #AI #EDA #DRAM #6G Center for Strategic and International Studies (CSIS) Gracelin Baskaran, PhD Duncan Wood imec Ingrid Moerman Advantest Synopsys Inc Lam Research Enfabrica TSMC SMIC Keysight Technologies AMD SambaNova Systems PDF Solutions Groq EnCharge AI Positron AI Nordson Test & Inspection Siemens Digital Industries Software Alphawave Semi Infineon Technologies Ansys Miuko Tanaka LightSolver Kyungmi Lee Massachusetts Institute of Technology Pooya Aghanoury Santosh Ghosh, PhD Sandeep Sunkavilli

Chiplet design engineers have complex new considerations compared to PCB concepts. By Ann Mutschler. https://lnkd.in/giBmrgd2 #chiplets #signalintegrity #EDA #semiconductor Mayank Bhatnagar Cadence Andy Heinig Fraunhofer IIS, Division Engineering of Adaptive Systems Javier DeLaCruz Arm Marc Swinnen Keith Lanier Synopsys Inc Subramanian Lalgudi Siemens Digital Industries Software Intel Corporation AMD

Rigorous testing is still required, but an abstraction layer can significantly reduce errors in the fab while optimizing device behavior. By Gregory Haley. https://lnkd.in/gciGk3aE #semiconductor #simulation #semiconductortest #semiconductormanufacturing #multiphysics John Ferguson Siemens Digital Industries Software Marc Swinnen Ansys Nitza Basoco Teradyne Murthy Upmaka Keysight Technologies Quaid Joher Advantest Keith Lanier Synopsys Inc Jack Lewis Modus Test, LLC

Special Report: Expanded DFT and test strategies are catching more SDEs, but this rare problem in server fleets is far from solved. By Laura Peters. https://lnkd.in/gyzn66Ti #semiconductor #silentdataerrors #SDEs #DFT #datacenters Adam Cron Synopsys Inc Ira Leventhal Advantest Janusz Rajski Siemens Digital Industries Software Evelyn Landman proteanTecs Jyotika Athavale Stephen Pateras Nitza Basoco Teradyne Andrzej Strojwas PDF Solutions Steven Woo Rambus #silentdatacorruption Harish D Dixit

Semiconductor Engineering's January Test, Measurement and Analytics Newsletter https://lnkd.in/gxy47upu #semiconductor #semiconductortest #KGI #DFT #glasssubstrates #chiplets #DPPM #semiconductormanufacturing DR YIELD Teradyne Bruker Nano Surfaces & Metrology Onto Innovation Siemens Digital Industries Software Synopsys Inc proteanTecs Advantest Nordson Test & Inspection PDF Solutions

Med Tech Morphs Into Consumer Wearables https://lnkd.in/gQCvackr Smart watches, rings, and a growing array of patches are adding more functionality and being used across a growing set of applications. By Elizabeth Allan. https://lnkd.in/gQCvackr #wearables #medtech #sensors #DSPs #hearingaids #MEMS #IoMT Shantanu Bhalerao Infineon Technologies Ryan Bauer Siemens Digital Industries Software Prakash Madhvapathy Cadence Apple Theranica #migraines #CGM Ansys imec-SMIT, Vrije Universiteit Brussel SKINETIX Northwestern University Georgia Institute of Technology John Rogers Omer Inan Samer Mabrouk University of Oxford Chrystalina Antoniades Kuniharu Takei The University of Tokyo Hokkaido University Massachusetts Institute of Technology UC San Diego SiPhox Health Michael Dubrovsky Beomjoon Kim Zhenan Bao Satish Ganesan Synaptics Incorporated Ansys Keysight Technologies

Rising complexity and heterogeneous integration are reshaping test methodologies and fault coverage, but challenges persist. By Gregory Haley. Semiconductor Engineering sat down to discuss the rapidly changing landscape of design for testability (DFT), focusing on the impact of advancements in fault models, high-speed interfaces, and lifecycle data analytics, with Jeorge Hurtarte, PhD, MBA, senior director of product marketing in the Semiconductor Test Group at Teradyne; Sri Ganta, director of test products at Synopsys Inc; Dave Armstrong, principal test strategist at Advantest; and Lee Harrison, director of Tessent automotive IC solutions at Siemens EDA (Siemens Digital Industries Software).  https://lnkd.in/giXbi4sQ #semiconductor #DFT #heterogeneousintegration #chiplets #3DIC