Semiconductor Engineering

The dream may be to have generative AI write RTL, but text is only one of the necessary things AI must understand to help with many design and implementation problems. By Brian Bailey. https://lnkd.in/g_FmwbZa #EDA #GenAI #semiconductor IC Manage #AI Cadence Rod Metcalfe Alexander Petr Keysight Technologies Chandra Akella Siemens Digital Industries Software Cristian Amitroaie AMIQ EDA

Special Report: Third party chiplets are hitting the market as chiplet models evolve. Who’s calling the shots isn’t clear yet. By Ann Mutschler. https://lnkd.in/gVxjZzTs #chiplets #EDA #semiconductor David Fritz Tim Kogel Christopher Rumpf Mayank Bhatnagar Sue Hung F. Alphawave Semi Open Compute Project Foundation Arm Siemens Digital Industries Software Synopsys Inc Intel Corporation AMD Cadence Kevin Donnelly Eliyan Corporation Blue Cheetah Analog Design, Inc. Elad Alon Ashley Stevens Arteris Chun-Ting "Tim" Wang Lee, PhD Keysight Technologies

Panel-level packaging offers scalability and cost efficiency, but meeting advanced node process targets remains a formidable challenge. By Gregory Haley. https://lnkd.in/gfdavCkt #semiconductor #FOPLP #advancedpackaging #fanoutpanellevelpackaging Doug Scott Amkor Technology, Inc. Chee Ping Lee Lam Research Lihong Cao ASE Global Wenkai Cheng Brewer Science Samsung Semiconductor TSMC Powertech Technology (Suzhou) Ltd. Dick Otte Promex Industries Inc. Keith Best Onto Innovation Eoin OToole Amkor Technology Portugal S.A John R Hoffman Nordson Test & Inspection Shawn Nikoukary Synopsys Inc Keith Lanier

Semiconductor Engineering discussed the growing list of challenges at advanced nodes and in advanced packages with 5 industry experts (part 2). With Jamie S., vice president of product management at GlobalFoundries; Dechao Guo, director of advanced logic technology R&D at IBM; David Thompson, vice president at Intel Corporation; Mustafa Badaroglu, principal engineer at Qualcomm; and Thomas Ponnuswamy, managing director at Lam Research. https://lnkd.in/gg_wCtCD #semiconductor #chiplets #advancedpackging #HBM

SemiEngineering's latest Automotive, Security and Pervasive Computing newsletter https://lnkd.in/gCdVDiSP #automotive #zonalarchitectures #SDVs #edgecomputing #batteries #LLMs #3DICs #radar #PCIe Rambus Synopsys Inc Synaptics Incorporated Siemens Digital Industries Software Cadence Infineon Technologies

Latest news: SK hynix’s 321-high NAND; CEO turnovers; Cadence’s system chiplet; Eliyan’s interconnect chiplet; GF’s funding finalized; SRC’s digital twin win; chiplets ramp; Enfabrica funding; NAND flash standard and more https://lnkd.in/gb2n9QRm #semiconductor #chiplets #RISCV #HBM SK hynix Rapidus Corporation GlobalFoundries Absolics Inc. Arizona State University Cadence Keysight Technologies Eliyan Corporation Enfabrica Ubitium Center for Strategic and International Studies (CSIS) Semiconductor Industry Association David Goeckeler Purdue University Arm Ansys TSMC Advantest Arteris Infineon Technologies Siemens Digital Industries Software Semiconductor Research Corporation (SRC) William Reinsch Andreas Schumacher Oak Ridge National Laboratory Bronson Messer Andrea Goldsmith imec SiPhox Health Sai Zhou

Special Report: High-bandwidth memory (HBM) sales are spiking as the amount of data that needs to be processed quickly by state-of-the-art AI accelerators, graphic processing units, and high-performance computing applications continues to explode. By Laura Peters. https://lnkd.in/g9iWV__y #HBM #AI #LLMs #DRAM #3DDRAM Neeraj Paliwal Rambus Kenneth Hsiang ASE Global Indong Kim Samsung Semiconductor Lihong Cao Micron Technology SK hynix Lam Research Chee Ping Lee JEDEC Sungmock Ha Curtis Zwenger Amkor Technology, Inc. Sutirtha Kabir Synopsys Inc

Several PPA considerations mean no single type of data is ideal for all AI models. By Bryon Moyer. https://lnkd.in/g_nDMj3F #artificialintelligence #datatypes #inferencing #PPA #CNNs Ian Bratt Arm #AItraining Todd Koelling Synopsys Inc Russell Klein Siemens Digital Industries Software Prem Santh T. Expedera Inc. Arif Khan Cadence Design Systems NVIDIA R K Anand Recogni Nigel Drego Quadric Jason Lawley Cadence Design Systems

Billions of dollars have been pouring into Asian countries for the past few years in an effort to boost their production capacity, explore leading-edge technology, compete on the global stage, and shore up supply chains in the face of geopolitical turmoil. By Elizabeth Allan. https://lnkd.in/gmawPiuz #semiconductor #funding #Asia Rapidus Corporation Siemens Digital Industries Software Paul Karazuba Expedera Inc. Lam Research KOREAN AMERICAN SEMICONDUCTOR ASSOCIATION Jayashankar Narayanankutty Cadence Design Systems All India Council for Technical Education (AICTE) Ministry of Electronics and Information Technology Centre for Development of Advanced Computing (C-DAC) Indian Institute of Science (IISc) Synopsys Inc Singapore Semiconductor Industry Association (SSIA) Ministry of Economic Affairs (Taiwan) SK Group CASPA Office TSMC SMIC Tata Group Kaynes Technology India Limited Renesas Electronics Stars Microelectronics (Thailand) Micron Technology Tower Semiconductor KIOXIA Group EdgeCortix MKS Instruments Arm Samsung Semiconductor AMD Hana Microelectronics SAPEON Inc. NAVER Corp Sensesemi Technologies Private Limited #Asiabusiness

More efficient hardware, better planning, and better utilization of available power can help significantly. By Ann Mutschler. https://lnkd.in/g_C5-Mnp #semiconductor #AI #lowpower #sustainability #GPUs #GenAI Dermot O'Driscoll Arm William Ruby Synopsys Inc Steven Woo Rambus Rich Goldman Ansys NVIDIA Sharad Chole Expedera Inc. Hassan Moezzi Future Facilities Ltd Cato Digital