Semiconductor Engineering

Design and AI companies are using a range of tools to help graduates become productive more quickly. Some are feeding their requirements directly to university. By Elizabeth Allan. https://lnkd.in/deMZcQxN #semiconductor #workforce #EDA Ansys Arm Axiomise Cadence Expedera Inc. Siemens EDA (Siemens Digital Industries Software) Michael Philippi Khaled Benkrid, PhD CEng MBA Honorary Professor Monique Williams-Lesser Paul Karazuba Ansys Learning Franchon Warmack King's College London Synopsys Inc Susan Coleman Cadence Academic Network Portland State University Queen's University

SemiEngineering's latest Test, Measurement and Analytics newsletter https://lnkd.in/gDc5aznY #semiconductor #semiconductortest #advancedpackaging #yieldmanagement PDF Solutions Nordson Test & Inspection proteanTecs Advantest Synopsys Inc Onto Innovation Bruker Nano Surfaces & Metrology DR YIELD Teradyne Siemens Digital Industries Software

Latest news:  Intel CEO out; IC industry on track to $1T by 2030; Japan, S. Korea invests; Xiaomi's own mobile processors; Korea’s FOPLP; CHIPS Act rush to fund; Samsung’s new leaders; S Korea’s chip support; metrology tool acquisition; diamond semiconductors; NAND flash; ALE, CXL, RISC-V fundings. https://lnkd.in/gfaUBevH #semiconductor #ALE #EDA #CHIPSAct #FOPLP PwC Xiaomi Technology Korea Institute of Machinery & Materials Intel Corporation BAE Systems Samsung Electronics Samsung Semiconductor Center for Strategic and International Studies (CSIS) Gregory C. Allen Thibault Denamiel Nova Ltd. Valeo ROHM Co., Ltd. DIAMFAB HiQuTe Diamond AlixLabs Panmnesia Iontra Inc Lightsynq Vishay Newport Limited Sagence AI STMicroelectronics POET Technologies JX Advanced Metals USA, Inc. University of Florida Nalla Anandakumar Ph.D CEA-Leti Virginia Tech Jason LeGrow Indian Institute of Technology, Ropar PRABUDDHA SINHA Infineon Technologies Imagination Technologies Paul K. Kearns

The dream may be to have generative AI write RTL, but text is only one of the necessary things AI must understand to help with many design and implementation problems. By Brian Bailey. https://lnkd.in/g_FmwbZa #EDA #GenAI #semiconductor IC Manage #AI Cadence Rod Metcalfe Alexander Petr Keysight Technologies Chandra Akella Siemens Digital Industries Software Cristian Amitroaie AMIQ EDA

Special Report: Third party chiplets are hitting the market as chiplet models evolve. Who’s calling the shots isn’t clear yet. By Ann Mutschler. https://lnkd.in/gVxjZzTs #chiplets #EDA #semiconductor David Fritz Tim Kogel Christopher Rumpf Mayank Bhatnagar Sue Hung F. Alphawave Semi Open Compute Project Foundation Arm Siemens Digital Industries Software Synopsys Inc Intel Corporation AMD Cadence Kevin Donnelly Eliyan Corporation Blue Cheetah Analog Design, Inc. Elad Alon Ashley Stevens Arteris Chun-Ting "Tim" Wang Lee, PhD Keysight Technologies

Panel-level packaging offers scalability and cost efficiency, but meeting advanced node process targets remains a formidable challenge. By Gregory Haley. https://lnkd.in/gfdavCkt #semiconductor #FOPLP #advancedpackaging #fanoutpanellevelpackaging Doug Scott Amkor Technology, Inc. Chee Ping Lee Lam Research Lihong Cao ASE Global Wenkai Cheng Brewer Science Samsung Semiconductor TSMC Powertech Technology (Suzhou) Ltd. Dick Otte Promex Industries Inc. Keith Best Onto Innovation Eoin OToole Amkor Technology Portugal S.A John R Hoffman Nordson Test & Inspection Shawn Nikoukary Synopsys Inc Keith Lanier

Semiconductor Engineering discussed the growing list of challenges at advanced nodes and in advanced packages with 5 industry experts (part 2). With Jamie S., vice president of product management at GlobalFoundries; Dechao Guo, director of advanced logic technology R&D at IBM; David Thompson, vice president at Intel Corporation; Mustafa Badaroglu, principal engineer at Qualcomm; and Thomas Ponnuswamy, managing director at Lam Research. https://lnkd.in/gg_wCtCD #semiconductor #chiplets #advancedpackging #HBM

SemiEngineering's latest Automotive, Security and Pervasive Computing newsletter https://lnkd.in/gCdVDiSP #automotive #zonalarchitectures #SDVs #edgecomputing #batteries #LLMs #3DICs #radar #PCIe Rambus Synopsys Inc Synaptics Incorporated Siemens Digital Industries Software Cadence Infineon Technologies

Latest news: SK hynix’s 321-high NAND; CEO turnovers; Cadence’s system chiplet; Eliyan’s interconnect chiplet; GF’s funding finalized; SRC’s digital twin win; chiplets ramp; Enfabrica funding; NAND flash standard and more https://lnkd.in/gb2n9QRm #semiconductor #chiplets #RISCV #HBM SK hynix Rapidus Corporation GlobalFoundries Absolics Inc. Arizona State University Cadence Keysight Technologies Eliyan Corporation Enfabrica Ubitium Center for Strategic and International Studies (CSIS) Semiconductor Industry Association David Goeckeler Purdue University Arm Ansys TSMC Advantest Arteris Infineon Technologies Siemens Digital Industries Software Semiconductor Research Corporation (SRC) William Reinsch Andreas Schumacher Oak Ridge National Laboratory Bronson Messer Andrea Goldsmith imec SiPhox Health Sai Zhou

Special Report: High-bandwidth memory (HBM) sales are spiking as the amount of data that needs to be processed quickly by state-of-the-art AI accelerators, graphic processing units, and high-performance computing applications continues to explode. By Laura Peters. https://lnkd.in/g9iWV__y #HBM #AI #LLMs #DRAM #3DDRAM Neeraj Paliwal Rambus Kenneth Hsiang ASE Global Indong Kim Samsung Semiconductor Lihong Cao Micron Technology SK hynix Lam Research Chee Ping Lee JEDEC Sungmock Ha Curtis Zwenger Amkor Technology, Inc. Sutirtha Kabir Synopsys Inc