👉 The Customer Problem: Fragility and Thinness of Silicon Wafers One of the primary issues in coating wafers is their fragility. Silicon wafers are brittle and highly susceptible to shock or impact damage. Even a minor bump can cause the wafer to shatter, particularly for thinner wafers that can be as slim as 0.3 mm. Handling these delicate wafers becomes increasingly difficult as their thickness decreases, necessitating specialized handling and processing techniques. Glass, by comparison, tends to be more resilient, but the challenge remains with crystal-based wafers, which are more prone to breakage. 🥊 AccuCoat’s Solution: Custom Tooling and Coating Vibration Controls Given the fragility of wafers, custom tooling is essential for both cleaning and coating processes. For instance, ultrasonic cleaning, a common method used for removing contaminants from wafers, requires specialized tooling to accommodate the wafer's delicate nature. Therefore, our coating tooling is designed to eliminate any unnecessary vibrations and secure the wafer firmly in place during the process. Loose or rattling parts can easily lead to cracks or other structural damage, making it imperative that custom fixtures are used to ensure the integrity of the wafer throughout the coating process. 🎯 Our Specialized Coatings for Sensors and Optics In addition to the semiconductor industry, wafer coating plays a crucial role in optical applications. Sensor wafers, for example, are often patterned and etched onto the wafer surface before receiving an anti-reflective (AR) coating for specific wavelengths or diffractive patterns. This allows for micro-level steering of light, a key requirement for sensors used in optical systems. We have adapted our processes to coat on top of these patterns, ensuring that the final product meets the specific optical requirements. Some applications require hydrophobic coatings for added functionality, depending on the intended use of the wafer. For more information on wafer coating and handling, visit our website, or contact Mark Kfoury at coatings@accucoatinc.com for technical support for your specific wafer requirements. #optics #rocoptics #coatingexperts
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Wanna shake hands with our engineered ceramic? Featured below is an end effector which functions as the robot’s hand that moves semiconductor wafers between positions. End effectors must be dimensionally precise and rigid, while having a smooth, abrasion-resistant surface to safely handle wafers without producing particulate contamination. In some cases, electrostatic discharge-safe ceramics are used to prevent static buildup on the wafer surface. Learn more about CoorsTek end effectors at https://bit.ly/44FRnR4 and electrostatic discharge-safe ceramics at https://bit.ly/4bg7TKc. #Semiconductor #Innovation #TechnicalCeramics #EndEffector
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Semiconductor probes are core components used throughout the entire chip #production process. Due to the very small size of #semiconductor products, the size requirements for probes as well as their #quality have to be #precise and flawless. As a leading provider of #microtools for the #miniature industry, #TaeguTec #CuttingTools offer excellent surface quality, extremely tight tolerances, are #rigid, #stable, precise and extend #ToolLife in order to increase productivity and lower cost. Get Inspired at https://bit.ly/MiniElect “Miniature Industry” brochure at https://bit.ly/MiniBro “The Right Choice – Technical Guide” at https://bit.ly/3cVEYhL #SemiconductorProbes #metalworks #micro #micromachining #IndustrySleuth #IndustrySolutions #NextGeneration #SurfaceFinish #Swiss #IndustrySolutions #electronics #CostEffective #RightTool #turning #grooving #threading #milling #drilling #parting #MachinistLife #AdvancedMachining #EngineeringLife #CuttingEdge #machining #InventoryControl #superior #HighSpeed #MachineShopLife #HighPerformance #premium #StateOfTheArt #ToolingSolutions #fabrication #EngineeringExcellence #manufacturing #GetInspired #ManufacturingExcellence #ToolsOfTheTrade #ToolRoom #machinist #tooling #accuracy #ChipControl #innovative #MachineShop
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Semiconductor probes are core components used throughout the entire chip #production process. Due to the very small size of #semiconductor products, the size requirements for probes as well as their #quality have to be #precise and flawless. As a leading provider of #microtools for the #miniature industry, #TaeguTec #CuttingTools offer excellent surface quality, extremely tight tolerances, are #rigid, #stable, precise and extend #ToolLife in order to increase productivity and lower cost. Get Inspired at https://bit.ly/MiniElect “Miniature Industry” brochure at https://bit.ly/MiniBro “The Right Choice – Technical Guide” at https://bit.ly/3cVEYhL #SemiconductorProbes #metalworks #micro #micromachining #IndustrySleuth #IndustrySolutions #NextGeneration #SurfaceFinish #Swiss #IndustrySolutions #electronics #CostEffective #RightTool #turning #grooving #threading #milling #drilling #parting #MachinistLife #AdvancedMachining #EngineeringLife #CuttingEdge #machining #InventoryControl #superior #HighSpeed #MachineShopLife #HighPerformance #premium #StateOfTheArt #ToolingSolutions #fabrication #EngineeringExcellence #manufacturing #GetInspired #ManufacturingExcellence #ToolsOfTheTrade #ToolRoom #machinist #tooling #accuracy #ChipControl #innovative #MachineShop
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Blade dicing frequently leads to manufacturing defects like chipping and cracking, which can add to long-term costs for companies beyond the initial investment. With laser dicing, professionals are presented with a cost-effective solution that can cut down on the risk of damage during manufacturing due to the technology being a non-contact method. This benefit also translates to the solution being a better fit for the dicing of fragile or thin wafers and wafers with densely packed or delicate features. Learn more about wafer dicing: https://bit.ly/4agKmrL #Fonon #semiconductor #waferdicing #manufacturing
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𝗫-𝗿𝗮𝘆 𝗶𝗻𝘀𝗽𝗲𝗰𝘁𝗶𝗼𝗻: 𝗧𝗮𝗸𝗶𝗻𝗴 𝗲𝗳𝗳𝗶𝗰𝗶𝗲𝗻𝗰𝘆 𝗮𝗻𝗱 𝗾𝘂𝗮𝗹𝗶𝘁𝘆 𝘁𝗼 𝘁𝗵𝗲 𝗻𝗲𝘅𝘁 𝗹𝗲𝘃𝗲𝗹 Short circuits, voids, or component misalignment - there are many sources of error that can affect the function and reliability of an electronic circuit. Unfortunately, these defects are not always immediately obvious and can cause enormous delays or, worse, malfunctions and loss of quality. To ensure the safety, reliability and quality of our circuits and microsystems, we use X-ray inspection to inspect assembled PCBs. By analyzing the X-rays, internal structures such as contacts, misalignment, solder bridges, solder flow, faulty solder joints, or faulty solder melting can be detected. 𝗫-𝗿𝗮𝘆 𝗶𝗻𝘀𝗽𝗲𝗰𝘁𝗶𝗼𝗻 𝗶𝘀 𝘂𝘀𝗲𝗱 𝗮𝘁 𝗠𝗶𝗰𝗿𝗼-𝗛𝘆𝗯𝗿𝗶𝗱 𝘁𝗼: ▶ Perform non-destructive inspections ▶ Locate short circuits on hidden solder joints such as BGA, CSP, QFN and Flip Chips. ▶ Eliminate voids in solder joints (BGA, CSP, QFN, QFP, Flip Chip and many more) ▶ Semiconductor inspection (wire bonding, die alignment) ▶ Inspect relays and contacts ▶ Perform initial sample inspection to eliminate costly serial defects ▶ Optimize process parameters ▶ Perform random sample analysis The major benefits are the time savings and the ability to optimize process parameters in near real time and adjust them if necessary to avoid or correct defects. X-ray technology is also used in the development of assemblies. Making micrographs of samples or claims used to be a very complex and time-consuming process. X-ray localization is fast and effective, especially for hidden solder or contact points. The creation of micrographs can therefore be targeted as needed. Unnecessary destruction of components is eliminated. #electronicsolutions #xray #quality #nextlevel #efficiency #optimization #customerspecifsolutions #microhybrid Andy Seifert
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Axial insert machines offer unparalleled advantages in manufacturing. They ensure stability, simplifying maintenance with reduced circuitry and fewer optical switches. Precision engineering guarantees accuracy up to 0.01 millimeters, minimizing mechanical adjustments. User-friendly interfaces make operation intuitive, while versatile programming meets diverse production needs. These machines are highly upgradable, ensuring access to the latest technology throughout their lifespan. Energy efficiency is maximized, reducing operational costs and environmental impact. Innovations in tool stability and chip ejection mechanisms enhance longevity, while patented technology such as turntable mechanisms and user-installable PCBs with pre-installed heat sinks provide added value. Moreover, their space-saving design optimizes floor space, enhancing overall efficiency in manufacturing operations. #smt #tht #axial #insert machine #high precision #pcb #pcba
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Wafer Stages for Thin Film Metrology and Glass Substrate Inspection — PRBuzz.co — Configurable, granite-based wafer-stage sub-system, new from PI. AUBURN, #Mass May #29 2024 PI, a #global #leader in nanopositioning and #motion #control is offering granite-based multi-axis #precision motion systems for the #automation of wafer metrology, #glass substrate inspection and lithography applications. These highly #accurate stages are #based on #modular #concepts that allow #fast customizations. Several technologies are #available including #air bearings, rails-on-granite, and several #types of piezo #drive systems. #Large #travel ranges of one meter and more can be #achieved with a #variety of different configurations. The XYZ-Theta #example #stage shown is #designed for thin film metrology equipped with direct drive motors, nanometer resolution encoders, and high-performance ACS motion controllers. More information on precision motion for semiconductor applications PI's advanced design expertise and long experience as a supplier to top tier semiconductor manufacturers and leading system integrators enables us to understand and meet the high demands of the industry, including copy exactly and meeting strict cleanroom requirements. Industries Served Semiconductors, photonics, optics, automation, metrology Applications Blog
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The Difference Between 2 Types of PCB Laser Via Forming https://lnkd.in/gG5cdfnM #PCBLaserViaForming #LaserViaForming #UltravioletLaser #InfraredLaser #HoYoGoPCB
The Difference Between 2 Types of PCB Laser Via Forming
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Are you struggling to detect voids and their severity in your PCB components? No worries! As electronic manufacturing processes become more intricate and layered, detecting pores in solder bumps within PCBs has become an increasingly daunting task for electronics manufacturers. The complex structures of semiconductors, which include multiple layers, high board density, and intricate components, can interfere with porosity analysis, resulting in imprecise detection of voids. This can lead to weakened connections at the component and board level, as well as restricted electricity and heat transfers. Our system Cheetah EVO uses Computed Laminography, which allows users to scan a PCB and obtain highly detailed cross-sectional scans with greater magnification of an area of your choice. And that's not all! Our Void Inspect CL, powered by Dragonfly 3D World, simplifies everyday defect analysis by enabling users to set thresholds for defect analysis. Read our blog below to find out more about how you can successfully detect voids in your PCB components! https://lnkd.in/dW9X2viV #cometyxlon #ndt #softwaresolution #electronics #pcb #dragonflyai #dragonfly #AI #voidanalysis #defects #defectdetection
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