Tune into episode 6, of I-Connect007’s “On the Line With…Cadence” podcast series. Hear Cadence's Mark Hepburn discuss data management and the value of collaboration in PCB design and manufacturing cycles. Watch it here: https://bit.ly/4ctOUfq #Cadence #PCBdesign
Cadence System Design and Analysis’ Post
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Don’t miss our #AdvantestTalksSemi Podcast's newest episode to be released on September 12, as we discuss how digital twins and EDA advancing chip design with Marc Huntner and Ron Press from #SIEMENS. #TechPodcast #DigitalTwin
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Stay tuned for our latest #AdvantestTalksSemi Podcast's episode to be released tomorrow, on September 12, as we discuss how digital twins and EDA advancing chip design with Marc Huntner and Ron Press from #SIEMENSEDA! #TechPodcast #DigitalTwin
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One of the most enjoyable conversations I've had on a podcast. Speaking to Daniel Bogdanoff about how deterministic AI can help product companies make better decisions: optimising their products for cost, power, size, supply chain, reliability and saving time in the process!
Tomide Adesanmi, the co-founder and CEO of Circuit Mind, aims to release engineers from the tyranny of reading datasheets, building spreadsheets, and drawing circuit symbols so they can focus on design innovation and circuit optimization. Listen to this thought-provoking episode of the All About Circuits podcast sponsored by SiliconExpert! ➡️ Listen to the full episode now: http://arw.li/6046dRVrY EETech Group #PrintedCircuitBoards #circuitoptimization
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The demand for innovative #advancedpackaging solutions is higher than ever as we see artificial intelligence pushing the boundaries of high-performance computing and chiplets further and further. Enter #glass substrates – a game-changer for the #semiconductor industry. In the latest 3D InCites podcast episode, Françoise von Trapp and Richard Noack discuss the future of glass in HPC and chiplet packaging. They share insights from our recent webinar, "Evolving HPC and Chiplet Packaging with Glass," diving deep into the motivation and trends driving this shift. Key topics include: - The need for collaboration across the glass ecosystem - Developing metrology solutions for transparent materials - Challenges like reliability data, aspect ratio issues, and standardization - The adaptability and flexibility of LPKF Laser & Electronics SE LIDE technology for glass microstructuring. Join us at ECTC 2024 to learn more about the maturity of LPKF LIDE technology, the solutions for glass based advanced packaging. Don’t miss this opportunity to meet Dr. Roman Ostholt and Richard Noack at Booth # 431 and catch the replay of the webinar — find the link in the comments... #LPKF #ECTC2024 #HPC #Chiplets #GlassSubstrates #Semiconductors #Innovation #TechConference #Webinar #AdvancedPackaging Stay tuned for more updates and see you in Denver!
🎤 NEW PODCAST EPISODE!🎤 It's been a while, but we're back with all new episodes! We've been talking a lot about #glasssubstrates with our community member, LPKF Laser & Electronics SE. You may have caught our recent webinar on the topic featuring E. Jan Vardaman, of; Venky Sundaram of 3D System Scaling, and Nils Anspach of LPKF. If you missed it, you'll want to listen to this recap discussion with Richard Noack. You'll learn about the remaining challenges of bringing glass to high-volume manufacturing and hear a call to action for downstream metrology companies to collaborate on developing solutions for measuring through transparent materials. Listen here or wherever you get your podcasts: https://lnkd.in/gBTPiSc2
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Discover the secrets of design reuse in this new episode of the Printed Circuit Podcast! ⭐ https://sie.ag/uWSU1 Reusing proven circuitry speeds up product development, reduces risk, saves time, and lowers cost. #PCBDesign #ElectricalEngineering #Circuits
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Discover the secrets of design reuse in this new episode of the Printed Circuit Podcast! ⭐ https://sie.ag/uWSU1 Reusing proven circuitry speeds up product development, reduces risk, saves time, and lowers cost. #PCBDesign #ElectricalEngineering #Circuits
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Discover the secrets of design reuse in this new episode of the Printed Circuit Podcast! ⭐ https://sie.ag/uWSU1 Reusing proven circuitry speeds up product development, reduces risk, saves time, and lowers cost. #PCBDesign #ElectricalEngineering #Circuits
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Principal Technical Product Marketing Manager - SME PCB Design, MIT, CID+, CPCD - Chairman - Printed Circuit Engineering Association (PCEA)
Carlos Gazca has great insights on design reuse and database management. Check out the #PrintedCircuitPodcast to hear what he has to say on these two subjects. #Reuse #EDM #PCBDesign
Discover the secrets of design reuse in this new episode of the Printed Circuit Podcast! ⭐ https://sie.ag/6YNoKv Reusing proven circuitry speeds up product development, reduces risk, saves time, and lowers cost. #PCBDesign #ElectricalEngineering #Circuits
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European Application Engineer | CID+| PCB/DFM Solutions chez Siemens EDA (Mentor Graphics)
Discover the secrets of design reuse in this new episode of the Printed Circuit Podcast! ⭐ https://sie.ag/uWSU1 Reusing proven circuitry speeds up product development, reduces risk, saves time, and lowers cost. #PCBDesign #ElectricalEngineering #Circuits
