CEA-Leti’s Post

📢 The countdown has started! ⏰ 📢 Just one week to the launch of a major new whitepaper on Europe’s critical supply chains in the semiconductor industry. 📢 The whitepaper - drafted jointly by Toppan Photomask, IMS Nanofabrication GmbH, Mycronic, and Vistec Electron Beam GmbH - will be published next week (26 June). 📢 Watch this space! #Whitepaper #Toppan #semiconductorindustry

Here we go - we're ready for Semicon Europa 2024! Members from the CSA Catapult team will be attending and speaking at the event. Take a look what we're up to this week 👇 📢 Keynote talk focused on the future of III-V semiconductors in integrated photonics will be delivered by Nick S., CTO at CSA Catapult. The presentation will focus on ‘Paving the Way for High-Performance Electronics: The Future of III-V Semiconductors in Integrated Photonics.’ 🕛 Wednesday 13th November - 10:45 📢 Presentation during the 'III-V Summit – Integrated Photonics' will be delivered by Jayakrishnan Chandrappan, head of packaging at CSA Catapult. The presentation will focus on 'Next-Gen Telecom: Leveraging Advanced Packaging and Compound Semiconductors' and highlight CSA Catapult's expertise in packaging technology. 🕛 Wednesday 13th November - 14:30 Plus, John Robins head of business development, Chris Davies head of commercial and Paul Jarvie DER-IC Lead and business development manager, will be attending the event to learn more about the latest industry trends. 🤝 Are you attending the conference too? Drop us a comment below to let us know. #SEMICON #Photonics #Quantum #Technologies #Semiconductors #Packaging #Telecoms #Packaging #Collaboration #Technology

7 days before our #WEBINAR! There's just one week left to register for our first webinar: "𝙃𝙤𝙬 𝙞𝙨 𝙄𝙋𝘾𝙀𝙄 𝙈𝙀/𝘾𝙏 𝙨𝙝𝙖𝙥𝙞𝙣𝙜 𝙩𝙝𝙚 𝙛𝙪𝙩𝙪𝙧𝙚 𝙤𝙛 𝙢𝙞𝙘𝙧𝙤𝙚𝙡𝙚𝙘𝙩𝙧𝙤𝙣𝙞𝙘𝙨 𝙞𝙣𝙣𝙤𝙫𝙖𝙩𝙞𝙤𝙣?". Join us as we explore IPCEI's essential role in driving innovation within the European microelectronics ecosystem. | Date: June 26, 2024 |  | Time: 2pm- 4pm | In this webinar, thanks to the participation of our experts you will get information on: • The need for IPCEI ME/CT in today's landscape. • How IPCEI ME/CT fosters innovation in the European semiconductor industry. • Impact of IPCEI ME/CT. • Where to access IPCEI ME/CT resources?   This is a valuable opportunity to understand how IPCEI ME/CT is shaping the future of microelectronics innovation! Register here : https://lnkd.in/eZgeRRRT #webinar #ipcei #semiconductors Sandra EGER AT&S, Nicolas Gouze VDI/VDE Innovation + Technik GmbH, Ferdinand Bell NXP Semiconductors, Patrick Pype NXP Semiconductors, Martin Strassburg OSRAM, Uwe Baeder Rohde & Schwarz, Alain Filipowicz Continental, Pro. Stefano SELLERI European Commission, Cosimo Musca STMicroelectronics, Mirelle TER VEER & Clara Pawlak ABGi France

Join us for the first IPCEI ME/CT webinar to learn more about the program and microelectronics innovation landscape!

🚀 We are proud to be part of a IPCEI project to support research, #innovation and early industrial deployment of #microelectronics and communication technologies across the value chain

Jenoptik is taking the next step towards automated PIC testing for high-volume manufacturing in the #semiconductor industry. How? We're enabling the integration of our opto-electronic UFO Probe® Card into an ATE system. Don't miss Christian Karras' presentation at #ITWS 2024: 📍 Munich, Germany 📅 September 16, 2024 🕕 6 p.m. CEST Be sure to discover more details on the new direct-probe PIC wafer-level test solution for fast wafer probing, such as: ✔ Application scenarios for integrating an opto-electronic probe card into an ATE system. ✔ Challenges of today's wafer sorting (drive to single instead of dual test insertion). ✔ Future standardization requirements for direct probe solutions (focus: high-volume PIC manufacturing). ITWS - European IS-Test Workshop is a technical conference with a focus on wafer probing, probe cards, and probing technologies to address challenges of the industry. We're looking forward to seeing you there! #MoreLight #photonics #innovation

Canatu will exhibit at #SPIEPhotomaskEUV from Oct 1-2, 2024, at the Monterey Conference Center, CA. Visit booth #403 to see our CNT membrane pellicles, inspection membranes, and optical filters for the semiconductor industry. Canatu’s advanced CNT membranes enhance EUV processes, enabling the next step in performance. These CNT membranes can be used as inspection membranes in pre- and post-lithography processes to improve quality control. They can also serve as CNT membrane pellicles, offering higher transmittance and performance compared to traditional materials. Additionally, CNT membranes function as optical filters, capable of filtering specific wavelengths while selectively blocking unwanted particles, electrons, and photons. Visit booth 403 to meet Juha Kokkonen, Heikki Heinaro, Taneli Juntunen, and Emile van Veldhoven and discuss how our advanced CNT membranes help enable a step change in performance in semiconductor manufacturing. Read more: https://lnkd.in/dzbrwBUW #Canatu #SPIEPhotomaskEUV #semiconductors

Speaker Spotlight 🌟 David Harame, PhD, IEEE Fellow - AIM Photonics Theme: PIC Packaging: Securing Optimal Integration and Performance 🎤 AIM Photonics Foundry providing Co-Process and Co-Development to Address Challenges in Photonic Integrated Circuit (PIC) Packaging Photonic integrated circuits (PICs) are fabricated in CMOS semiconductor fabrication facilities, which allows manufacturers to take advantage of the large installed base of tools and processes. However, traditional electronic packaging is not equipped to handle the inherent challenges associated with packaging advanced photonic devices into functional products. In this presentation we explore some of these challenges, such as sub-micron alignment tolerances, sensitivity to temperature variations, optical losses, and a lack of established standards, especially as they relate to the design and manufacture of optical coupling structures. At AIM Photonics, we have learned that the best results are obtained when the PIC manufacturing and packaging processes are co-designed to better achieve low-loss coupling, particularly between photonic integrated circuits and other elements in the system. This often requires structural and process changes in the bae PIC processes to achieve the best results. Our “end-to-end” approach to developing an integrated photonics manufacturing ecosystem—including electronic photonic design automation (EPDA), wafer manufacturing (including interposers and heterogeneous integration), and electronic-photonic test, assembly and packaging capabilities—enables us to develop reliable, accessible and affordable solutions that will ensure the manufacturing-readiness of this critical technology for decades to come. 🎉 Get Ready to Be Inspired! 🌟 As we draw closer to the grand event of 2024, Are you ready to embark on this thrilling journey with us? Register to secure your place at PIC International to hear David's presentation! https://lnkd.in/e2ymYJKc Stay connected with us as we bring you more stories and insights from inspiring individuals attending PIC International. 95% of exhibition and speaking slots have already been filled. Get in touch with us today if you want to find out how to get involved and penetrate the photonic integrated circuit industry! To find out more please contact James Cheriton: 📧 info@picinternational.net 📞 024 7671 8970 🌐 www.picinternational.net #PICInternational #PICmagazine #photonics #EmpoweringVoices #SpeakerSpotlight #AIMPhotonics

PERTE Chip or the ambition to put Spain on the semiconductor map - thank you very much, Marilés de Pedro, for your great article on Newsbook! "We analyze what the #PERTEChip consists of and what stage it is at. A PERTE that aims to put Spain on the semiconductor map. AMETIC, the technology employers' association, has shown its commitment ... In #Spain, there are also leading companies such as KDPOF with a business focused on the packaging and testing of #optoelectronics chips, as KDPOF's CEO Carlos Pardo explains: 'These chips link microelectronics and optics, so the encapsulation process connects both worlds. The precision required in optics and the high speed demanded in microelectronics make encapsulation a key part of the product.'" Please read on in the original (Spanish) article 👉 #packagingplant #microelectronics #ICtesting #fiberoptics #automotive #autonomousvehicles #ipcei

Here is a short animation to explain semiconductor packaging from the very basics to the most advanced architecture... in less than 2min ! #AdvancedPackaging is the next milestone in semiconductor innovation