CITC - Chip Integration Technology Center’s Post

Tomorrow, CITC's Mark Luke Farrugia, PMP will be one of the speakers at the Advanced Packaging Conference in Munich. He will give a presentation about Competitive and Sustainable Advanced Packaging (CSAP) – a new approach to FO-PLP. His presentation is part of session 5: Sustainable materials enabling performance which will be held in ICM Munich, room 14a on November 13. The session begins at 16:25 hrs, Mark Luke will talk from 16:50 hrs – 17:10 hrs. We hope to see you there! #accesstoinnovation #competitiveandsustainable #CSAP

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