Dinesh Mishra’s Post

Inspection and Metrology: New Solutions for Semiconductor Industry THE Marposs GROUP STRENGTHENS ITS PRESENCE IN SEMICONDUCTOR AND #CONSUMERELECTRONICS SEGMENT ALSO. Placing and maintaining a process under control is the key factor for any production. This is even more true for the very demanding semiconductor and semiconductor like manufacturing processes, which can be considered some of the most complex ones, that requires the control of an increasing number of parameters. Not to forget that semiconductor is a brittle and hard material that requires dedicated machine  tools to slice, lap, thin, get intelligent and finally cut the die. In order to improve and maintain high yield, #inspection and #metrology are key factors. They are also crucial for the management of the semiconductor manufacturing process to find defects on both patterned and unpatterned wafers. Marposs engineers are ready to support you in defining how to improve the performances of automatic machines used during #waferprocessing, the front-end and back-end fabrication steps. Indeed, we offer #sensors and #gauges for slicing and #lappingmachines, #backgrinders and #dicingsaws, #wafershape (bow/warp) measurements, layer & pattern measurements, #bump & #groove measurements. The #semiconductor and semiconductor like industries continue to produce ever smaller devices that are more complex in both shape and materials. For these purposes, #Marposs has a complete range of non-contact sensors used for thin-film metrology, wafer dimensional characterization, #waferinspection and #packaginginspection. Our #sensors can work inside automatic inspection machines to find defects and dimensional variation. Luca Matteucci Nitika Sharma Pretti Mishrra Dynamic Manufacturing India Machine Insider INDUSTRY SAMURAI AWARDS #samuraiawards2024 #samuraiawards https://lnkd.in/dB8tryT5

Although the paper is from 2020 it is an excellent primer for the use of different types of non destructive metrology for semiconductor advanced WFE fabrication.

Exploring the World of Automated Optical Inspection (AOI) 🔍 In today's fast-paced manufacturing landscape, precision and efficiency are paramount. That's where Automated Optical Inspection (AOI) comes into play, revolutionizing quality control processes across industries. AOI utilizes advanced imaging technology to meticulously inspect components, assemblies, and products with unparalleled accuracy. By employing high-resolution cameras and sophisticated algorithms, AOI systems can detect defects, inconsistencies, and deviations from specifications in real-time. From electronics manufacturing to automotive production, AOI ensures product integrity, minimizes defects, and enhances overall quality. Its non-invasive nature reduces the need for manual inspection, saving time and resources while maintaining consistency and reliability. As technology continues to evolve, so does AOI, with innovations such as machine learning and AI further enhancing its capabilities. With these advancements, businesses can achieve greater efficiency, lower production costs, and ultimately deliver superior products to customers. Read about the 'Automated Optical Inspection' here: https://lnkd.in/eBai9wnX Join me in exploring the transformative potential of Automated Optical Inspection and its role in shaping the future of manufacturing. #AOI #QualityControl #Manufacturing #Innovation #Technology

Progress In Wafer And Package Level Defect Inspection The technology to enable sampling and the need for more metrology and inspection data in a production setting have aligned just in time to address the semiconductor industry’s newest and most complex manufacturing processes. In both wafer and assembly manufacturing, engineering teams have long relied on imaging tools to measure critical features and to inspect for defects after specific processes. These tools, which utilize different emitter sources — optical, X-ray, and e-beam — are essential for process development, yield ramp, and production monitoring. Optical systems continue to be the primary workhorse systems in a production setting. They have the highest throughput, and for decades their measurement resolution has kept pace with the critical dimensions and defect sizes of interest. But optical is running out of steam at ≤14nm advanced CMOS logic nodes, and during assembly with bump/pillar pitches ≤50µm. https://lnkd.in/gcQp-6jA

In this article, Indranil De, VP of Design-for-Inspection at PDF Solutions, uses a traffic analogy to explain the tradeoffs between e-beam spot size, current and measurement locations. He explains, "You can have a certain width of a street and can travel at a certain speed. Now you can make your street larger or you can travel faster, but you’re still limited by how many electrons you can pump per unit time. Instead of looking at every location on that street (i.e. pixel), you could look at only the locations of interest and scan 2% of the street."

Great explanation from Indranil De on PDF Solutions raster-scan method for e-beam inspection "Using this approach in a two-to-four hour period, PDFs e-beam system can scan several billion selected features on a 300mm wafer. In a production environment, a manufacturer can judiciously elect to perform such scans. But the pre-work to define the locations of interest, which includes a highly detailed design sensitivity analysis, is crucial for this type of inspection. The analysis combines layout sensitivity at each layer, and detailed signal and power interconnect routing information. For example, an engineer may care about a routing with only 3 redundant vias, and not care about any with 10 redundant vias."

How to TSvs Manufactured???? **Through-Silicon Vias (TSVs)** are a critical technology for connecting various die in a stacked die configuration. They allow for vertical interconnection between different layers of integrated circuits (ICs) in a 3D integration scheme. Here's how TSVs are manufactured: 1. **Etching the Via**: - TSVs are created by etching trenches into the silicon substrate or a dielectric material. - The via is essentially a vertical hole that penetrates through the layers of the stacked ICs. 2. **Barrier and Seed Layer Deposition**: - After etching, the via is lined with a barrier layer to prevent copper diffusion. - A seed layer is then deposited on top of the barrier layer. - The barrier layer ensures the integrity of the diffusion barrier, while the seed layer provides a foundation for subsequent copper deposition. 3. **Copper Filling**: - The via is filled with copper using some form of aqueous deposition. - The copper fills the via from the bottom (where the seed layer is) to the top. - The deposition process ensures that the via is completely filled with copper, creating a conductive path between the stacked die. 4. **Challenges and Considerations**: - TSVs are larger than typical interconnects in integrated circuits. Their diameters can range from 5 microns to several tens of microns. - High aspect ratios (depth-to-width ratio) and scalloped sidewall profiles are challenging for physical vapor deposition (PVD) processes used for barrier and seed layer deposition. - Electrografting, an electrochemical process, has been proposed as a solution for TSVs. It applies an electrical current to an aqueous solution containing chemical precursors, allowing controlled deposition of metals or polymers onto conducting or non-conducting surfaces¹[1].

When manufacturing #semiconductors, what effect does virtual fabrication have on the impact of different channel hole profiles on the SONO punch area? Learn more on Lam Research's blog. #LifeAtLam

What drives AI? Beyond the software and the codes is the hardware of course and a key component of such are wires and connectors. The efficient production of cables and associated connectors is tied to injection molding. Without hardware there is no digital - software does not function without it. Vertical machines from ARBURG, Inc. are a key enabler. These machines are used for overmolding electrical components efficiently and reliably. Excellent process control is essential to meet very tight tolerances. Want to learn more about our options and see case studies - check it out here: https://lnkd.in/eWpqknnK #injectionmolding #electronics #chipmaking #AI