Corning launches EXTREME ULE® Glass to support next-generation chip manufacturing
Corning Incorporated has introduced Corning EXTREME ULE Glass, a new technology designed to aid chip manufacturers in producing smart and AI-driven devices. This innovation responds to the rising demand for advanced materials in chip manufacturing, particularly for enhancing photomasks essential for wafer design. The EXTREME ULE Glass is optimized for extreme ultraviolet (EUV) yellow light process technologies, especially high numerical aperture (High NA) EUV, becoming the new industry standard.
The glass technology significantly improves thermal stability and material uniformity, crucial for consistent wafer manufacturing performance. Claude Echahamian, vice president and general manager of Corning Advanced Optics, notes that this innovation will enable higher power EUV manufacturing and boost yields, reinforcing Corning's commitment to advancing Moore's Law. Key features of the EXTREME ULE Glass, including its thermal expansion, flatness, and homogeneity, minimize mask waviness and variability, enhancing high-end coatings and manufacturing consistency.
Utilizing a titanium dioxide silicate material known for its near-zero expansion properties, EXTREME ULE Glass marks a significant advancement in Corning’s ultra-low expansion (ULE) glass portfolio. Corning also plans a more efficient glass forming process to reduce energy consumption and waste during production, supporting the company's sustainability objectives. The EXTREME ULE Glass will be showcased at the SPIE Photomask Technology + Extreme Ultraviolet Lithography conference in Monterey, California, from September 30 to October 3.
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