EECONE Project’s Post

Overlay is becoming a significant problem in the manufacturing of semiconductors, especially in the world of advanced packaging substrates — think panels — the larger the area, the greater the potential for distortion due to warpage. Solving this issue requires more accurate models, better communication through feed forward/feed back throughout the flow, and real-time analytics that are baked into the process. Keith Best, director of product marketing for lithography at Onto Innovation, talks about the intricacies of overlay, the pros and cons of glass substrates, and what’s needed for high-volume manufacturing. https://lnkd.in/g3BhfyXw #semiconductor #advancedpackaging #warpage #glasssubstrates #overlay #RDL

We're always looking for ways to make a difference 🌍 Retronix is leading the way with recovering and reusing components in electronics. It's a simple, yet powerful idea: take parts from old devices and give them a new life. It's about reimagining how we use our resources. It's about viewing used components not as waste, but as valuable resources that can be harnessed effectively. It's a forward-thinking approach that resonates with the global push towards sustainability. Learn More: https://lnkd.in/eQePpeSJ If your company wants to enhance its economic value while contributing positively to the environment, we invite you to join us on this journey. Let's explore how we can effectively reuse your electronic components and drive sustainability within your operations. Get in touch with us - https://lnkd.in/eJnStxDJ #Sustainability #Innovation

As devices are becoming more powerful, micro-electronic parts are shrinking in size, being placed in more complex layered structures. Traditional manufacturing techniques cannot scale up to meet future requirements. So, how do you keep connecting these constantly miniaturizing parts to offer better performance, reliability and functionality? Dutch Deep tech scale up FononTech has the answer – Impulse Printing™. Fonontech and NTS partner up to reshape nextgen electronics manufacturing. In our blog post Rob Hendriks, Roel Offermans and Jeroen Sprankenis tell you about this partnership of Fonontech and NTS. https://lnkd.in/e-4qcE_w

Getting real about sustainable electronics When you think about sustainability in electronics, energy efficiency is likely the first thing that comes to mind. Regulations have made it easy for us to compare the energy efficiency of products, but what about their CO2 footprint? Have you ever wondered about the carbon footprint of the electronics you use? Until now, this information has been hard to come by. Unlike traditional products, electronics are composed of hundreds, sometimes thousands, of components, each with its own CO2 footprint. This complexity has made it challenging to provide a clear picture of a product’s environmental impact. However, thanks to the incredible team at Sluicebox and their integration with Luminovo, this problem is now being addressed. While change takes time, the next time you see CO2 footprint information on an electronic product, there's a good chance this partnership played a key role in making that happen. Let's drive the change towards more transparent and sustainable electronics. 🌍💡

#MakeitSustainable | Small footprint, big impact on quality Discover OMRON's NX-HTC: the key to efficient space usage and advanced temperature control. Say goodbye to defects with its precise features, helping you detect issues early and keep production running smoothly. Explore the NX-HTC's capabilities: https://lnkd.in/dZNfyuJj #smartmanufacturing #temperaturecontrol #footprint

What challenges do you face in transitioning PCB production to more sustainable methods? Our Taiwan facility’s General Manager, Harry Yang explores some of these challenges in his article ‘Addressing PCB Environmental Supply Chain Issues with Direct Metallization Technologies’. Learn about how we, as industry players can actively contribute to more sustainable #PCB manufacturing practices: https://lnkd.in/ejgRmAjx #supplychain #directmetallization #printedcircuitboard #pcbreliability #pcbfabrication #connectinglayers #MacDermidAlpha #circuitrysolutions

#MakeitSustainable | Small footprint, big impact on quality Discover OMRON's NX-HTC: the key to efficient space usage and advanced temperature control. Say goodbye to defects with its precise features, helping you detect issues early and keep production running smoothly. Explore the NX-HTC's capabilities: https://lnkd.in/eRCSh6yF #smartmanufacturing #temperaturecontrol #footprint

Explore how #semiconductor Towards Packaging is shaping the future of #technology in our latest article. Discover #innovations driving advancements in miniaturization, performance, and integration, and understand their impact on tomorrow's tech landscape. #powerelectronics #powermanagement #powersemiconductor

Well... 2024 has certainly been an unexpected ride so far... Reflecting on the past couple of years, I've embarked on a fascinating journey delving into the intricate world of the #printing industry. It's a journey I had envisioned continuing unchanged until recent events. However, amidst every challenge lies an opportunity, and it's one we're determined to seize. I've had the privilege of spending significant time with remarkable vendors and printers during this period. Their candidness in sharing the real challenges they face has been truly humbling, and I've been all ears. The recurring themes they've echoed—#sustainability, #automation, #integration, #visibility and #cost will undoubtedly take centre stage at #Drupa later this month. Yet, it's the how these relate to the real world that has truly caught my attention. Enter CoCoCo —the fruit of this listening journey. We understand the immense untapped potential of current investments and are committed to unlocking it. Rather than imposing change, new purchases, and expecting others to conform to pre-set standards, we've embraced existing technology to deliver immediate value. Our platform is designed to support both evolutionary and revolutionary shifts for printers, driven by practical solutions rather than promises of future technology. Connecting software and hardware, combining the data, and enabling collaboration. I'm thrilled to engage in conversations about how our model can benefit printers of all sizes, from single-location shops to global networks. We're prepared and eager to make a difference from day one. #connectcombinecollaborate

Our next💥EMTECH on the Horizon💥 webinar is just around the corner! This time, we dive into the fascinating realm of Chiplets and Advanced Packaging. Trent Uehling, Technical Director of Package Innovation at NXP Semiconductors, will join us to explore how advanced packaging technologies are driving the #chiplet revolution. He will also discuss the latest developments in Chiplet Interface Standards and the Chiplet Advanced Packaging Marketplace. The advanced packaging market is expected to grow at a significant pace, largely driven by chiplets. Historically considered a “necessity” to connect chip power and signals, packaging now brings more value to the system solution. As I/O density and bandwidth increase, so does package cost. The key is to “right-size” technology to meet bandwidth and cost targets. Each part of the #semiconductor manufacturing value chain will have its place in chiplet packaging. OSATs and IDMs will likely drive advanced packaging for low to mid-performance devices utilizing 2D on substrate, fan-out, bridge, and passive interposer technologies. Wafer foundries and limited IDMs will play more in the high-performance arena with technologies such as 3D die stacking and hybrid bonding. Suppliers of BOM components such as silicon and glass interposers will also benefit from the increased application of advanced packaging. Mark your calendars for February 29th to join us for this insightful discussion! Register today: https://lnkd.in/geSuG8tq. #GSA #WhereLeadersMeet #webinar #chiplets #semiconductor #technology #advancedpackaging