EFY Expo Chennai’s Post

Vijay Bolloju, Director – R&D at iVP Semiconductor, is on stage at #EFYExpoChennai! In his talk, "Optimising High-Power Electronic Systems with Better Electro-Thermomechanical Design," Vijay Ji shared valuable insights on enhancing the performance and reliability of high-power electronic systems through advanced electro-thermomechanical design approaches. #EFYExpo2024 #conference #EFYChennai #ElectronicsExpo

Exciting advancements in microelectronics! 🌐 Stephan Guttowski from FMD introduces the APECS Pilot Line – paving the way for Advanced Packaging and Heterogeneous Integration in electronic systems. A step forward for innovation and efficiency in microelectronics production across Europe. 🚀 #EmbeddedSystems #Innovation #Microelectronics #FutureTech

As the market for automotive and industrial applications evolves, SiC semiconductors are taking center stage, driven by the need for smaller die areas, higher current densities and lower costs. This shift demands new packaging materials and advanced sintering and interconnection technologies. We will dive into the latest material developments for packaging SiC power devices, including metal ceramic substrates, cutting-edge sintering and soldering techniques, and innovative die top interconnection.   We'll explore how these innovations optimize performance, enhance reliability, and address the challenges posed by higher power density, elevated temperatures, and faster switching frequencies. If you're passionate about pioneering breakthroughs in power module technology, this tutorial is your opportunity to gain valuable insights and strategies to drive forward-thinking innovations.   Don't miss this chance to connect with us at the ECCE Conference and Expo. Dr. Habib Mustain is looking forward to meeting you in his tutorial on October 20th. https://lnkd.in/gaTdiYwP   #ECCEConference #PowerModuleInnovations #SiCPowerDevices #SemiconductorPackaging #Engineering #ScientificInnovation #Tutorial

Exciting News from the IEEE International Electron Devices Meeting ! Join us in San Francisco, California, from December 7 to 11 for the world's largest international conference, #IEDM focused on semiconductor and electronic device technology! We’re thrilled to announce that #TokyoElectron (#TEL) will be presenting at the event with a pivotal talk titled “Implications of Wafer Bonding for Advanced Logic Technology Development”! 🌟 What is wafer bonding? Wafer bonding technology, which involves stacking multiple semiconductors made through different processes for device implementation, is gaining attention as an advanced packaging technology such as hybrid bonding. It is expected to further enhance and evolve at the advanced device and system levels, necessitating plasma control technology, cleaning technology, and high-precision alignment technology that are on par with front-end processes. At TEL, we bring over 60 years of expertise to the table, providing equipment that integrates diverse product technologies and innovative eco-solutions to reduce environmental impact. Get ready to be inspired by TEL’s experts and discover the future of semiconductor technology! https://lnkd.in/gYz6_QYd #TechnologyEnablingLife #IEDM2024 #WaferBonding #AdvancedPackaging #3DIntegration

All important trends in the electronic components market in one magazine - this is our new RUTRONIKER 📖✨ The focus is on pioneering topics such as intelligent supply chains and the latest developments in the areas of passive and electromechanical components, semiconductors and wireless technologies. On more than 80 pages, the experts from Rutronik and our partners provide in-depth insights into the latest trends in electronics distribution. Enjoy your journey through the latest issue of RUTRONIKER 👉 https://brnw.ch/21wPeGw #Rutronik #Rutroniker #Technology #Trends #IndustryInsights #Electronics #Innovation

Exploring the World of N-Type Semiconductors: Properties, Applications, and Future Prospects     Lgesemi:    N-type semiconductors are a critical component in modern electronics, playing a vital role in various devices and systems. This article delves into the world of N-type semiconductors, exploring their unique properties, applications, and future prospects. From their basic characteristics to advanced manufacturing techniques and emerging applications, this article covers all the bases. #lgesemi #Diodes #TVSDiodes #ZenerDiodes #SchottkyDiodes #SiliconRectifiers #FastRecoveryRectifiers #DiscreteSemiconductors #Transistors #ElectronicComponents #Semiconductor #PowerElectronics #CircuitProtection #SemiconductorSolutions #PowerSemiconductorModules #MOSFETs #IGBTs https://lnkd.in/gNjYZRMi

💬WIN SOURCE spoke with WEKA at electronica Munich, sharing insights on how smart technology is transforming the electronic components supply chain and shaping the future of Industry 4.0. 👇📽️ Watch the video to discover how WIN SOURCE empowers the electronics industry to tackle complex market challenges with smart technology solutions. #WINSOURCE #electronics #Industry4.0 #Sustainability #SmartTechnology #electronica2024

Scientists, designers and engineers came together recently to attend the IEEE WiPDA conference, co-hosted by Compound Semiconductor Applications (CSA) Catapult and Cardiff University / Prifysgol Caerdydd, to meet, collaborate and share ideas with one another. At the conference, a range of speakers and exhibitors showcased the international opportunities in power electronics 🌍 CSA Catapult showcased its unique offering of cutting-edge technology, expertise and capability, used to design and develop high-performing power electronics modules and converters for automotive, energy and industrial applications. 💬 Ingo Lüdtke, head of power electronics at CSA Catapult said, “We have established a good power module design, test and validation capability and we are moving to power converters.  “To fully exploit the benefits of compound semiconductors we will need to use AI. We hope to convert new ideas and future collaboration.” #Compound #Semiconductors #PowerElectronics #NetZero #Energy #SolidStateTransformers #WideBandgap #Renewable #SmartGrids #Collaboration #Technology #SuperCluster #Automotive #Aerospace

Power Electronics Forum at #electronica (PF12-1) SiC and GaN power devices – key enabler for sustainable power electronics This Keynote is presented by Dr. Peter Friedrichs and Dr. Gerald Deboy. Both are Fellows at Infineon Technologies. Wide band gap power switches like #GaN HEMTs and #SiC transistors became key components for moder power conversion when efficiency and power density are in the focus of a new design. Furthermore, certain features of WBG components enable new solutions, e.g. bidirectional configurations in GaN or low loss circuit breaker switches based on SiC. The keynote will highlight most recent developments at component level as well as new application targets. Additional focus will be on the impact of the ecosystem of the power semiconductor itself, e.g. innovative packages solutions and smart driving. #powerelectronics The forum is located directly in the exhibition hall A5. The booth number is A5.351 (Power Efficiency Stage). All electronica visitors can attend the forum free of charge. https://lnkd.in/g_vCuXqq hashtag #agenda

Electronic Specifier Ltd's Harry Fowle wrote a great piece on gallium nitride (GaN) and how it offers significant advantages over traditional silicon-based semiconductors like increased switching speeds and faster charging. Although GaN design comes with some challenges, its potential is large enough that the GaN power electronics market could exceed $2B by 2025! Traditionally, compound #semiconductor materials like GaN are difficult to manufacture due to crystal defects, but recent experiments with our MST film have shown promising results. I’m hopeful our progress will help unlock GaN’s full potential! https://bit.ly/3V8fsLZ