engineering.com’s Post

NXP unveils industry-first ultra-wideband wireless BMS NXP Semiconductors’ Ultra-Wideband (UWB) wireless battery management system (BMS) simplifies EV assembly, enables higher energy density, and decouples mechanical and electrical development for faster time to market. Trimension UWB provides higher resistance to reflections and frequency-selective fading within the battery pack than existing narrow-band technologies, resulting in more robust and reliable data transfer. It uses high-bandwidth pulses instead of a modulated carrier frequency (sinusoidal signal) as used in 2.4 GHz narrowband technologies. The solution is part of NXP’s FlexCom chipset, which supports wired and wireless BMS configurations using common software architecture and safety libraries. Leveraging wireless solutions minimises the use of complex wiring harnesses in the battery pack, and reduces the need for error-prone manual effort during production, which makes the assembly of EVs more efficient and reduces lifecycle costs. The elimination of connectors and wiring between battery cells allows for increased energy density, which is a key parameter in EV design and performance to enable longer range. NXP’s UWD system is available for OEMs to start evaluation and development in Q2 2025. The solution is part of NXP’s FlexCom chipset, which supports wired and wireless technologies. Click here to access more news articles & deeper technical investigations into e-mobility ▶ https://lnkd.in/exVm22ce #batterymanagementsystems #bms #batteries #evbatteries #emobility #automotive

The increasing demand for #EV infrastructure has created a highly competitive market for #EVcharging systems, in which design engineers must differentiate their systems in terms of size, efficiency, and performance. ⚡️ Infineon meets this demand through their vast semiconductor portfolio for the whole system. 🚘 Read more in the full article below! 👇🏻

From power and sensing to connectivity and security - Infineon solution provide ease to your #EVcharging design needs.

Peter Matthews discusses the evolving landscape of electric vehicles (EVs) in this insightful article, highlighting key classifications and emerging trends that shape the future of design and performance. This includes the pivotal role of capacitors. From advancements in bidirectional charging and high-voltage architectures to integrating wide-bandgap semiconductors, capacitors have become essential in ensuring efficiency, reliability, and energy management. Learn about how these components support filtering, dc linking, snubbing, and resonant applications in high-power systems. Read the full article here: https://lnkd.in/gpRiS9cz #ElectricVehicles #EVs #Design #Manufacturing #HighVoltageArchitecture #Capacitors

Renesas Electronics has recently completed the acquisition of Transphorm, a significant move that has propelled the company into the forefront of GaN technology. This strategic acquisition has enabled Renesas to launch 15 GaN-based reference designs, marking a major milestone in the company's expansion into the power semiconductor market. The acquisition of Transphorm has intensified the competition in the GaN devices sector, particularly with Infineon, which acquired GaN Systems last year. Renesas' 15 newly launched reference designs span across various domains including embedded processing, power, connectivity, and analog portfolios. These designs incorporate Transphorm's automotive-grade GaN technology, offering solutions for on-board battery chargers and 3-in-1 powertrain solutions for electric vehicles. #electricalengineering #electronics #embedded #embeddedsystems #electrical #computerchips Follow us on LinkedIn to get daily news: HardwareBee - Electronic News and Vendor Directory

Hi folks! 🚗⚡ Power converters are leveling up for electric mobility! Here’s what’s new in e-mobility power electronics: • 🔋 𝗩𝗶𝗰𝗼𝗿'𝘀 𝟰𝟴𝗩 𝗧𝗿𝗶𝗼: New DC-DC converters for 48V zonal architectures reduce wiring, vehicle weight, and improve power density with up to 99.2% efficiency. • 🌟 𝗜𝗻𝗳𝗶𝗻𝗲𝗼𝗻’𝘀 𝗛𝘆𝗯𝗿𝗶𝗱𝗣𝗔𝗖𝗞 𝗚𝟮 𝗙𝘂𝘀𝗶𝗼𝗻: Combines silicon and SiC tech for efficient, cost-effective EV power modules, delivering up to 220 kW with excellent thermal performance. • 📉 𝗟𝗲𝘀𝘀 𝗶𝘀 𝗠𝗼𝗿𝗲: Compact designs mean smaller systems, lighter vehicles, and extended range. How do you see these innovations shaping the future of EVs? Read the full news below 👇: https://lnkd.in/gwb-F9Jv #EVs #PowerElectronics #SiC #48VInnovation

Panasonic Industry Europe unveils the new SXV, SXE, and SVPG series OS-CON #Capacitors, offering improved performance for surface mount and radial lead applications in industrial sectors. #IndustrialTech #Panasonic #Electronics #Innovation https://lnkd.in/gkreaxAK

🗞 Electronic News! 🗞 This IC can help protect high-voltage batteries from overcurrent by constantly monitoring the battery current and slope every eight microseconds NXP® Semiconductors today announced the MC33777, the world’s first battery junction box IC that integrates critical pack-level functions into a single device. Unlike conventional pack-level monitoring solutions that require multiple discrete components, external actuators and processing support, NXP’s MC33777 consolidates essential BMS functions. The IC significantly reduces design complexity, qualification and software development effort, and cost for OEMs, while enhancing the overall performance of the system. This state-of-the-art IC can help protect high-voltage batteries from overcurrent by constantly monitoring the battery current and slope every eight microseconds. It detects and reacts to a wide matrix of configurable events up to 10 times faster than conventional ICs, for example, without waiting for specific current thresholds to be exceeded. The MC33777‘s fuse-emulation technology also enables the removal of expensive and low-reliability melting fuses from the system, yielding significant cost savings for OEMs and Tier 1s, increasing reliability and enhancing safety for the vehicle occupants. Electric vehicles traditionally deploy melting fuses to disconnect power to the vehicle in the event of an overload, with reliability as a critical safety factor. #electricalengineering #electronics #embedded #embeddedsystems #electrical #computerchips Follow us on LinkedIn to get daily news: HardwareBee - Electronic News and Vendor Directory

Mouser Electronics, the leader in New Product Introduction (NPI), has teamed up with Analog Devices (ADI) and Bourns, Inc. to release an insightful eBook exploring the challenges and benefits of Gallium Nitride (GaN) technology. This collaboration delves into how GaN is driving advancements in efficiency, performance, and sustainability across various industries. #GaN #PowerElectronics #Innovation #Sustainability #TechAdvancement #electronicsnews #technologynews

Mouser Electronics, Analog Devices, and Bourns have teamed up to release an insightful new #eBook on the benefits of GaN-based #power_electronics. As power demands continue to rise, #Gallium_Nitride (GaN) technology is leading the way in delivering efficient, high-performance solutions for a range of industries, from #renewable_energy to automotive and consumer electronics. #powerelectronics #powermanagement #powersemiconductor