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Big news for U.S. semiconductor innovation! Arizona State University and Deca Technologies have been chosen to lead the $100 million SHIELD USA project, funded by the U.S. Department of Commerce’s CHIPS National Advanced Packaging Manufacturing Program. This initiative will transform the domestic semiconductor packaging ecosystem, focusing on critical materials and substrates for high-performance computing and national security. ASU’s Advanced Electronics and Photonics Core, located at MacroTechnology Works in the ASU Research Park, will be at the forefront of advancing wafer-level and panel-level manufacturing—technologies currently unavailable in the U.S. By collaborating with industry leaders like IBM and AMD, SHIELD USA aims to drive innovation, accelerate commercialization and position the U.S. as a leader in semiconductor packaging for AI, 5G and next-gen electronics. This project also prioritizes workforce development, introducing specialized training programs to upskill professionals and inspire the next generation of talent, ensuring a sustainable and competitive semiconductor ecosystem. Learn more about how ASU and its partners are shaping the future of U.S. semiconductor packaging: https://lnkd.in/gq-GQMFG #ASUCoreFacilites #ASUCores #ASUResearch #ASUEngineering #Semiconductors #CHIPSAct #SHIELDUSA #Innovation #NationalSecurity #WorkforceDevelopment #Packaging #SemiconductorPackaging ASU Knowledge Enterprise Ira A. Fulton Schools of Engineering at Arizona State University School of Electrical, Computer and Energy Engineering — ASU ECEE Southwest Advanced Prototyping (SWAP) Hub Jason Conrad
Industry Engagement, Faculty, and student, at Arizona State University, proud member of ASUSDMB. Retired CIA Directorate of Science & Technology, Senior Executive Expert
1moASU's presence as a major player in the future of MicroElectronics continues to grow.