EX Student OF HIT : AN ORDINARY TECH ENTHUSIAST. " THE GOAL OF TECHNOLOGY IS TO CONQUER DEATH " - Martine Rothblatt
BASICS : #Fabrication and #Characterization of #Copper_Diffusion_Barrier_Layers for future #Interconnect applications Source : by : Conor Byrne : 2015 [https://lnkd.in/d_bwCGXW) : https://lnkd.in/d29jiNrj : 02/10/2022 #Intel #4nm Process : #Deep #Dive : Drops #Cobalt #Interconnect, Goes with Tried and Tested #Copper with #CobaltLiner/ #Cap Pete Singer https://lnkd.in/dw3zdTKx)] [ 39 Slides : https://lnkd.in/dVT-93CE) : 2018 Interconnect Tutorial: #Improving #BEOL for #Sub10nm #Nodes : Video : Jul 15, 2023 by Kevin Boyd : Deputy Director, BEOL Integration , Advanced Technology Development : Global Foundries : Video : Jul 15, 2023] [ https://lnkd.in/dDCVXKz3) #Scaling the #BEOL – a toolbox filled with new processes, boosters and conductors : https://lnkd.in/d6xPcAP5 : 30/06/2022 : https://lnkd.in/dzrCNdGm : 19/08/2019 : Extending #Interconnects towards the #3nm technology node and beyond requires several innovations. #Imec sees single-print EUV in #DualDamascene modules, #Supervia structures, #SemiDamascene modules and added functionality in the back-end-of-line (#BEOL) as the way forward. ] [https://lnkd.in/eWjy4f_f) Extending #Copper #Interconnects To #2nm : 17/03/2022 : https://lnkd.in/ejKTHGP6 : https://lnkd.in/dw3zdTKx) : From #LowResistance #Vias to #Buried #PowerRails, it takes multiple strategies to usher in #2nm chips. - By: Laura Peters] https://lnkd.in/dSFDNgFc) : 18/10/2022 Why do next-generation logic devices need a #Backside #Power #Distribution #Network (#BSPDN)? : : https://lnkd.in/d5QS4ySu : https://lnkd.in/eqGKzYx4 : #Imec demonstrates critical building blocks for a backside power delivery network. [ 9pgs PDF : https://lnkd.in/diWgw4ak) : 28 April 2023 #Physical_Design_Level #PPA #Evaluation of #Buried_Power_Rail at #2nm Node : by Giuliano Sisto (imec) &....] [ 10 Slides : https://lnkd.in/diYjA2vR) : 28/06/2023 #CXL Enablement with #HPCM (#High_Performance #Compute_Module) : by Allan Cantle - OCP HPC SubProject Technical Lead - Video : 10 Slides : https://lnkd.in/dFGXK_ab) : 27/03/2022 #Open #Memory #Interface (#OMI) Overview by Allan Cantle ] [ 172pgs : https://lnkd.in/gDVJ8j54) : : 12/2019 #POWER_DELIVERY AND #THERMAL_CONSIDERATIONS FOR 2.5-D AND 3-D #INTEGRATION_TECHNOLOGIES by : Md Obaidul Hossen] [ 3pgs : https://lnkd.in/gFPkxJTv) : 01/2023 imec : #CMP Challenges for #Buried_Power_Rail Integration by Kevin Vandersmissen] [ imec : https://lnkd.in/gfYFFjcK) : 2022 #Efficient #Backside_Power_Delivery for High-Performance Computing Systems ] [ imec : https://lnkd.in/gQX6sUYJ) : 25/11/2022 #Mitigating the #Thermal_Bottleneck in #Advanced_Interconnects : A #Modeling_Framework to accurately #Predict #Heat_Dissipation in the #Chip’s #Back_End_Of_Line]
