Heather George’s Post

Using HDI impacts your PCB’s power integrity. This includes different effects of mounted inductances of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pinouts, and the inherent plane-capacitance changes from using dielectrics of various thicknesses. This whitepaper examines and quantifies these effects, using numerous design examples, including a large conventional through-hole design board that was reduced using HDI. https://sie.ag/5cWi9G #PowerIntegrity #PCB #HDI

Using HDI impacts your PCB’s power integrity. This includes different effects of mounted inductances of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pinouts, and the inherent plane-capacitance changes from using dielectrics of various thicknesses. This whitepaper examines and quantifies these effects, using numerous design examples, including a large conventional through-hole design board that was reduced using HDI. https://sie.ag/5cWi9G #PowerIntegrity #PCB #HDI

Using HDI impacts your PCB’s power integrity. This includes different effects of mounted inductances of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pinouts, and the inherent plane-capacitance changes from using dielectrics of various thicknesses. This whitepaper examines and quantifies these effects, using numerous design examples, including a large conventional through-hole design board that was reduced using HDI. https://sie.ag/5cWi9G #PowerIntegrity #PCB #HDI

Using HDI impacts your PCB’s power integrity. This includes different effects of mounted inductances of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pinouts, and the inherent plane-capacitance changes from using dielectrics of various thicknesses. This whitepaper examines and quantifies these effects, using numerous design examples, including a large conventional through-hole design board that was reduced using HDI. https://sie.ag/5cWi9G #PowerIntegrity #PCB #HDI

Using HDI impacts your PCB’s power integrity. This includes different effects of mounted inductances of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pinouts, and the inherent plane-capacitance changes from using dielectrics of various thicknesses. This whitepaper examines and quantifies these effects, using numerous design examples, including a large conventional through-hole design board that was reduced using HDI. https://sie.ag/5cWi9G #PowerIntegrity #PCB #HDI

Using HDI impacts your PCB’s power integrity. This includes different effects of mounted inductances of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pinouts, and the inherent plane-capacitance changes from using dielectrics of various thicknesses. This whitepaper examines and quantifies these effects, using numerous design examples, including a large conventional through-hole design board that was reduced using HDI. https://sie.ag/5cWi9G #PowerIntegrity #PCB #HDI

Using HDI impacts your PCB’s power integrity. This includes different effects of mounted inductances of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pinouts, and the inherent plane-capacitance changes from using dielectrics of various thicknesses. This whitepaper examines and quantifies these effects, using numerous design examples, including a large conventional through-hole design board that was reduced using HDI. https://sie.ag/5JHpWg #PowerIntegrity #PCB #HDI

Using HDI impacts your PCB’s power integrity. This includes different effects of mounted inductances of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pinouts, and the inherent plane-capacitance changes from using dielectrics of various thicknesses. This whitepaper examines and quantifies these effects, using numerous design examples, including a large conventional through-hole design board that was reduced using HDI. #PowerIntegrity #PCB #HDI

Infineon Technologies innovative Q-DPAK top-side cooled package addresses the most demanding application requirements for increased power density and thermal handling. Q-DPAK is a compact SMD, able to handle high current and reach a thermal performance comparable to a TO-247. Infineon Technologies Q-DPAK allows leveraging the full advantages of an SMD, limiting the drawbacks like the heat spread through the PCB and enables high flexibility in PCB design. In today’s SMD-based designs, the output power is restricted by the thermal limit of the PCB material because the heat must be dissipated through the board. Thanks to the topside cooling concept of Q-DPAK, the thermal decoupling of board and #semiconductor is possible. This allows higher chip temperatures, higher power densities and improves system lifetime. Learn more about Q-DPAK here - https://lnkd.in/dtqEdDCd

The resistor power rating is the maximum amount of power a resistor can dissipate without damage. This rating is vital to PCB design as it affects the thermal management and reliability of the circuit. https://bit.ly/3xCjNiz #PCBdesign #OrCADX