imec’s Post

It is not only about developing cutting-edge technology for the future...🤖🌍 but doing it in a sustainable way!🤟😎 imec presents levers at the SPIE Litho/Patterning conference, to reduce the equivalent #co2footprint of lithography and etch for advanced #technology nodes. Discover the key knobs towards reduced emissions in the below press release. Check it out now! 🔽 💥😉👇 (and yes we use very cool suits👩🚀👨🚀) #nanotechnology #research #researchanddevelopment #semiconductors #semiconductorindustry #semiconductormanufacturing

Imagine squeezing more and more features onto a tiny chip. Finding defects becomes like searching for a needle in a haystack, delaying the release of new chips! That's where the eBeam inspection system comes in – it helps identify errors faster, just like a powerful microscope for tiny chips. The PrimeVision® 10 eBeam inspection system combines the next-generation Cold Field Emission (CFE) technology's imaging speed and scale with state-of-the-art Back-Scattered Electron (BSE) detection. This allows for identifying deep, yield-critical defects, down to a tiny speck of dust 😲 This combination of super sight and vision helps chipmakers build these advanced 3D chips faster and make greater use of eBeam technology in high-volume manufacturing. Learn more about PrimeVision® 10 eBeam Inspection here: https://lnkd.in/gvhpbTHt Follow us for more behind-the-scenes of #MakePossible innovations! #AppliedMaterials

Great ideas begin with people just like you. Join me at #Simulation World on May 14-16 for a chance to hear from innovators transforming industries — from life-saving improvements in healthcare, to meeting the challenges of space travel. Register today for Simulation World and get the power of innovation in your hands! #Ansys #simulation #engineeringdevelopment #prototyping #design #FEA #CFD #digitalmissions #STK #electronics #engineering

It was only about 5 years ago, when common believe in the #ALDep community was that plasma enhanced ALD is not good for conformal thin film deposition. But now we know, that plasma created radicals enable excellent conformal film growth in PE-ALD. Key elements in this finding is the deep plasma physics understanding of Erwin Kessels and his group, as well as novel, fast and accurate thin film conformality measurement method, enabled by #PillarHall metrology chips by Chipmetrics

#MPW are a great chance for start-ups to test ideas that may turn into products in the future. However, it also poses several challenges that can compromise the quality and functionality of the final chip. At #DATE2024, EUROPRACTICE experts will discuss the best practices and lessons learned from the MPW prototyping process, sharing practical tips and tricks on avoiding common errors.

Will be a nice workshop to learn about Multi-Project-Wafer flow

Entering a cleanroom without physically going inside? Yes, it's possible. 🧑🏭😎 We've been working with Purdue University to have a virtual experience of a cleanroom for the semiconductor manufacturing processes. 📱 Emmanuel Leroux explains in this video how simulation plays a role in it! #CFD #Simulation

Designing high-precision motion stages with optimal dynamic performance presents significant challenges. One critical aspect is achieving the ideal balance between stiffness and mass, which is vital for enhancing performance. On top of that, the pressure for faster time-to-market is ever-increasing—making efficiency in the design process more crucial than ever. In collaboration with industry leaders like ASML, Delft University of Technology, Nexperia, MI-Partners, Infinite Simulation Systems, and supported by NWO (Dutch Research Council), we showcase how combining #additivemanufacturing with topology optimization can drive significant advancements in the #hightech industry. 💡Learn more about our findings here: https://lnkd.in/eJkxZ_Yt #MetalAM #semiconductor #metal3dprinting #advancedmanufacturing

Missed Our Recent Webinar? Watch it Now on YouTube! We recently hosted a webinar discussing the challenges and advancements in photonic integrated circuit (PIC) design, particularly the need to account for manufacturing variations and imperfections. John Cary, Ph.D., CTO and co-founder of Tech-X Corporation, demonstrated how our latest simulation tool, XSim, addresses these challenges by leveraging advanced computational methods, distributed computing, and cloud platforms like AWS to accelerate PIC design and improve accuracy before Tape-Out. This session is ideal for scientists, engineers, and researchers in photonic device design, nanophotonics, and semiconductor applications who want to explore how computational solutions can enhance design workflows. View the full webinar recording here: https://lnkd.in/gwm9hS_K #Photonics #Simulation #FDTD #PICDesign #ScientificResearch #Engineering #TechXCorporation #Txcorp

Don’t miss tomorrow's webinar on using Automated AFM for the non-destructive, inline process control of hybrid bonding in the semiconductor industry. Register today 👉 https://lnkd.in/g7x-ghvW Automated AFM can be applied in the most current hybrid bonding technology nodes and wafer processing steps. This webinar will outline: • Key features for process control in high volume manufacturing of bonded wafers • High resolution imaging and analysis for critical bond pad metrology • Large-area scanning of areas of up to 100s of mm2 of wafer-to-wafer bonding • Automated bevel edge metrology for hybrid bonding • Patterned and bare/blanket wafer defect review Don’t miss the Q&A session with the team: Sean Hand and Ingo Schmitz! Bruker’s fully automated AFM solutions enable the highly accurate, nanoscale characterization of surfaces. It delivers high-throughput data for inline process control and actionable data for hybrid bonding yield enhancement, and is ideal for labs and fabs working on new bonding device design. #automation #semiconductorindustry #qualitycontrol #afm