CROMA’s Post

Excited to share about the new project "Additive Green Electronics" (AGE), a joint venture between the Technische Hochschule Ingolstadt, #Germany and University of Southern Queensland, #Austrailia. We're testing the feasibility of using the bio-based, recyclable PA-4 (#Nylon) and #Copper sintering in #electronics #manufacturing for #sustainable & minimal environmental impact - reducing #ewaste. Our project targets to develop #particlefree copper inks and PA-4 #biopolymer, integrating them through #additive #manufacturing for formation of multi-layered circuits, and demonstrating a #recyclable health monitoring sensor. More details are in this link below. Join us in reimagining a greener future for electronics! Gordon Elger Matt Flynn Toan Dinh Pratheep K. A. Allan Manalo #AdditiveGreenElectronics #SustainableTech #AGE #green #sustainable https://lnkd.in/eJ5YPb9Y

The Through Glass Via | #TGV #Glass #Wafer is a topic of increasing relevance. Using glass in TGV #technology presents a multifaceted approach to reducing manufacturing costs, achieved by simplifying processes, enhancing yields, and taking advantage of glass's unique properties through advanced techniques. These benefits make glass an attractive option for next-generation electronic packaging solutions. However, there are also challenges to consider. Workshop of Photonics | WOP, having exceptional #expertise in #glass #micromachining, already has some to offer and keeps working on it - so let's discuss it further!

On May 14, Caterina Czibula, Technische Universität Graz, is presenting in the FibRe online seminar series. The seminar title is 'Shining light on fibres'. Welcome to the webinar that is starting at 13.00 CET.  Read more at https://lnkd.in/dnZyFjfn On the page, you can also find the previous seminars in the series. Read more about the Vinnova competence centre FibRe at https://lnkd.in/dEvCc8mm #FibRe #research #webinar

Engaging discussions at #eSummit2024! Venky Murthy and Kevin Cheong from Advanced United Refining are actively participating in conversations on sustainability in electronics. Let’s connect and exchange ideas on #BuildingElectronicsBetter. #eSummit2024 #Sustainability #Electronics

What exactly do we mean when we talk about ➡ Advanced Semiconductor Packaging? The Pack4EU initiative proudly announces the achievement of a major milestone: The Consortium agreed on an overarching definition of ➡ Advanced Semiconductor Packaging marking the content and setting the boundaries for what is meant when referring to the term of #AdvancedPackaging. The definition has been extensively discussed among the core partners BLUMORPHO, SEMI Europe, CEA SBEM, Sillicon Europe represented by High Tech NL, iMaps Europe, Delft University of Technology and VDI/VDE Innovation + Technik GmbH and with 43 associated partners and initiatives. First presented during the Chips Joint Undertaking Launch Event in December 2023, the definition has now been approved by all partners and the European Commission and is publicly available. ➡ Definition: "Advanced Semiconductor Packaging is considered any novel set or combination of technology bricks, design or manufacturing processes aiming at assembling, packaging, and testing of semiconductor-based integrated circuits, components and systems.” ➡ As part of the definition, along with the term, a ➡ set of objectives which #AdvancedPackaging serves has been identified: ▪ Higher and heterogeneous integration, ▪ Higher performance (any of electrical, mechanical, thermal, optical, quality, reliability, security), ▪ Novel functionalities or emerging applications, while at the same time aiming at higher cost efficiency (e.g. by design, manufacturability and automation) and more sustainable product (e.g. life cycle, use of green materials, environmental aspects, CO2 footprint, material usage and waste avoidance during manufacturing, water saving and green energy usage in manufacturing). Be invited to share our definition! Regis Hamelin | Steffen Kröhnert | Nadège Dumarché | Sanae Boulay | G.Q. (Kouchi) Zhang | Martin Martens | Ben van der Zon | Jean-Marc Yannou | Renaud de Langlade

Alice Guerrero, Ph.D., Principal Applications Engineer at Brewer Science will be co-presenting with imec, Multi-Tier Die Stacking Through Collective Die-to-Wafer Hybrid Bonding. You can attend the presentation on Thursday May 30th 9:30 AM – 12:35 PM at @IEEE 74th Electronic Components and Technology Conference (ECTC) to learn more. https://hubs.li/Q02yh_GN0 The presentation addresses three industry questions shaping this novel technology: ☑️ How can collective die-to-wafer bonding facilitate multi-tier die stacking in 3D IC technologies? ☑️ What are the key metrics such as transfer yields and bond yields achieved in multi-tier die stacking using collective die-to-wafer bonding? ☑️ How does die-to-target wafer alignment accuracy compare between different tiers of bonding in collective die-to-wafer hybrid bonding, and what implications does this have for the scalability and reliability of the process? IEEE #ECTC2024 #Semicondutor #SemiconductorMaterials #Innovation

I wanted to take a moment to share some insights on the challenges we face in the fascinating world of perovskite LED fabrication. As we all know, perovskite materials have emerged as a promising avenue for next-generation optoelectronic devices, and LEDs are no exception. However, like any cutting-edge technology, there are certain hurdles we must overcome to unlock their full potential. One of the primary challenges in perovskite LED fabrication lies in achieving consistent and reproducible device performance. The synthesis of high-quality perovskite films is critical, as variations in composition, crystal structure, and film morphology can greatly impact device efficiency and stability. Finding ways to precisely control these factors is a task that requires careful optimization and expertise. Another significant challenge is the stability of perovskite materials. While they exhibit remarkable optoelectronic properties, perovskite LEDs can suffer from degradation over time due to environmental factors such as moisture, oxygen, and light exposure. Developing robust encapsulation techniques and exploring new material compositions will be crucial in enhancing the lifespan and reliability of these devices. Furthermore, the scalability of perovskite LED fabrication processes is an area that demands attention. To realize their commercial viability, we must explore manufacturing methods that can be easily upscaled while maintaining the desired device performance. Balancing efficiency, cost-effectiveness, and large-scale production will be key to driving widespread adoption of perovskite LEDs. Collaboration and knowledge-sharing within our community will play a pivotal role in overcoming these challenges. By pooling our expertise, we can collectively address the technical hurdles and accelerate the development of perovskite LED technology. Sharing research findings, discussing best practices, and fostering collaborations will undoubtedly contribute to our collective success. As we continue to navigate the exciting landscape of perovskite LED fabrication, let us remain persistent and innovative. Together, we can push the boundaries of what is possible and pave the way for a greener, more efficient future of lighting and display technologies. I invite you all to share your experiences, insights, and solutions related to perovskite LED fabrication. Let's connect and unlock the true potential of these remarkable materials! #PerovskiteLEDs #Optoelectronics #ResearchCommunity #Innovation #Collaboration #NextGenerationTech

PFAS play a vital role in the semiconductor industry, but the EU wants to ban them, due to health concerns. How can we respond? Can they be easily replaced? And will EUV save us?   Per- and polyfluoroalkyl substances (PFAS) are essential for a wide range of applications including photoresist coatings, etchants, cleaning agents, and in the manufacture of semiconductor materials.   Sadly, PFAS are remarkably persistent in the environment, and are linked to cancer and other health issues. The semiconductor industry is defending the use of PFAS, and there is an ongoing debate about just how harmful various PFAS substances can be.   EU legislation banning PFAS could come into effect as early as 2026, so there is some urgency to find alternative materials and processes.   Susan Backhaus and Stefano Cazzani recently attended #ISSEurope in Vienna, where James Amano of SEMI gave an update on SEMI’s work on PFAS. We discussed the dilemma that on one hand the European Chips Act envisages doubling the EU’s current global market share from 8% to 20% by 2030, requiring a four-fold expansion of semiconductor manufacturing capacity in the EU, but on the other hand the current technological limitations do not allow the industry to manufacture semiconductors without PFAS.   The introduction of extreme ultraviolet lithography (EUV) can help, and has resulted in a 21.9% drop in use of PFAS, according to TechInsights. But this is likely only a temporary reprieve, as PFAS use will rise again as we move to smaller chip geometries of 2nm and beyond.   In the light of this, the semiconductor industry will probably have to take a two-headed approach to this: on one side further research into alternatives, and on the other ensuring the safe and sustainable use of PFAS in the long term.   What are your thoughts? Let us know in the comments below!   https://lnkd.in/eGfU-Fjw   #PFAS #semiconductor #EUV #lithography #semiconductorindustry

It is necessary to work strongly for applying the "well standardized process" label to the whole Photonics Manufacturing Process.

Ultrafast amplifiers are at the forefront of laser technology, enabling advancements in areas like scientific research and industrial processing. This comprehensive article examines how these systems function, their design, and their significance in various applications. Full analysis available here: https://lnkd.in/en_Yr4Jh #LaserEngineering