Empower Semiconductor has launched the Crescendo vertical power delivery platform to meet the rising power demands of artificial intelligence (AI) and high-performance computing (HPC) applications. Utilizing proprietary FinFast technology, it supports scalable vertical power delivery for domains exceeding 3,000A, enhancing system efficiency, current density, and response times in nanoseconds. Traditional power architectures struggle to meet modern data center workloads, making them inadequate for current applications.
The Crescendo platform overcomes these challenges by eliminating the need for large capacitor banks, which occupy PCB space and cause significant power losses. Instead, it delivers energy directly to the AI chip with increased speed and precision while fitting into a compact, thermally enhanced package beneath the processor. The FinFast technology employs high efficiency and speed, integrating advanced silicon, cutting-edge control architectures, and high-frequency magnetics, resulting in one of the most efficient AI power delivery solutions available.
Tim Phillips, founder and CEO of Empower Semiconductor, noted that the Crescendo platform allows future AI processors to achieve performance goals while preserving efficiency and cool operation. Key benefits include ultra-fast bandwidth—20 times greater than traditional converters—eliminating the need for PCB-mounted high-frequency decoupling capacitors. With a significant boost in power density, true vertical power delivery is achievable within 1mm or 2mm of height. The platform also provides over a 10% reduction in power losses compared to traditional architectures, equating to an 8-megawatt reduction in power loss for data centers with 100,000 CPU instances.
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