JETCOOL Technologies Inc.’s Post

Exciting news from the Open Compute Project Foundation Global Summit! ❄️ Join us today at the Flex booth (#A11) as we unveil our groundbreaking cold plate for the NVIDIA GB200 Superchip—capable of cooling a staggering 2.8kW in real time! Then swing by JETCOOL Technologies Inc. at booth (#A21) to check out our brand-new in-rack CDU designed to cool up to 300kW racks. Need more power? Our row-level CDUs can handle up to 2.1MW, perfect for scaling AI deployments right now. We’re ready for AI at scale—are you? #Flex #JetCool #LiquidCooling #SustainableAI

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🚀 Ready to shape the future of open computing? Join us at the 2024 OCP Global Summit to explore our data center IT and power infrastructure solutions, including compute, vertically integrated racks, liquid cooling technology, critical and embedded power and more. Visit us at Booth A11 and attend our expo hall session to see how Flex is leading the way in open computing. #OCPSummit24 #FromIdeasToImpact #Datacenters 🔗 Event details here: https://brnw.ch/21wNd7C

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