Kopfsalat Medien reposted this
This is another milestone in power semiconductor technology: We are proud to unveil the world’s thinnest silicon power wafer! Sometimes, less is more. This is certainly true in silicon power wafer thickness: reducing it from standard 40-60 micrometers to an ultra-thin 20 micrometers boosts energy efficiency as it reduces power losses by more than 15 percent. For applications in AI data centers as well as consumer, motor control and computing applications, this is a real game-changer. It will help us leverage the full potential that #decarbonization and #digitalization offer. I am very proud of our great engineers at Infineon Technologies that developed this masterpiece on 300mm technology. Just after announcing the world’s first 300mm #GaN power wafer, this once again shows that we are the industry’s innovation leader, mastering all three relevant semiconductor materials.
I was very surprised by such interest in the technology of silicon wafers production. I’ve decided to make a small photo collage regarding to my previous comment on the posts (a week earlier) from Infineon. Their result is a really very impressive, not any doubt. My congratulations to the Infineon’s team, again. Probably, this information could be interesting to use IP in the existing and future projects in microelectronics as for curious young researchers (start-uppers), as for investors on that. A deep patent searching is a very important part for any relatively expensive R&D projects. Let me (from the first hands) present you some missed historical moments which defined the existed technologies for Si wafer production.
Congratulations to your team! It's a really big highlight. Is it Si or SiC wafer? I do hope it wasn't sawed. Is it? I've never held one in my hands, 300 mm wafer. Moreover, we couldn't assume that this thickness will be approached for this surface area. It was 1983-d year, when we invented and patented a method allowing to prepare ultra thin Si plates with gas ion implantation, without any sawing. It was thickness about 80-100 microns with fantastic planar surfaces and there were 6&8 inches Si and sapphire wafers only. 200 mm, it was a limit of our dreams 40 years ago. One more time my best wishes and congrats to your team!
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This is impressive! Congratulations on this amazing achievement! 👍 👍 👍
Congratulations on achieving an amazing milestone Jochen and Infineon Technologies!!
Congrats to Infineon Technologies on this unprecedented achievement in the power electronics field. We are proud as an official partner, to share this innovative solution within our valued customers.🚀💜
Congratulations Mr. Jochen Hanebeck on this remarkable milestone with the launch of the world’s thinnest silicon power wafer! Your leadership at Infineon Technologies is inspiring, as this innovation significantly enhances energy efficiency across critical applications like AI data centers and motor control systems. As you noted, "sometimes, less is more," and this achievement reduces power losses while positioning Infineon at the forefront of decarbonization and digitalization efforts. With projections indicating that the GaN market could reach several billion USD by 2030, your commitment to mastering silicon, SiC, and GaN demonstrates strategic foresight that will propel Infineon into pole positions within ESG initiatives and IoT advancements. Your team's dedication reflects a deep understanding of market demands and technological potential. As highlighted by McKinsey & Company, innovations like these are essential for achieving sustainable growth in our rapidly evolving digital landscape. I look forward to seeing how this breakthrough shapes not just Infineon’s future but also contributes significantly to global sustainability goals.
Congratulations to the teams for this outstanding achievement! 👏👏
Dear Mr. Hanebeck, Congratulations to the Infineon team on this impressive breakthrough! Reducing wafer thickness to 20 micrometers is a milestone that not only enhances energy efficiency but also elevates semiconductor technology to a new level. This innovation in ultra-thin wafers paves the way for a true revolution in data centers and high-energy-demand applications. Mastery over all three semiconductor materials truly defines visionary leadership capable of shaping the future of #digitalization and #decarbonization. Truly inspiring! 👏🏻👏🏻👏🏻
Director of Business Development at Vanguard International Semiconductor | Senior Executive in Semiconductor Foundry Leadership | 30+ Years Driving Global Business Growth, Strategic Partnerships & Technology Innovation
1mo💡 Thinner wafers have less thermal resistance, which helps in managing and dissipating heat more efficiently. This is especially valuable in power electronics where excessive heat generation is a major issue, impacting performance and lifespan. 💡 Thin wafers enable higher electron mobility and reduce electrical resistance, leading to faster and more efficient semiconductor devices. This is particularly beneficial in high-speed and high-frequency applications such as 5G and advanced computing. 💡 Parasitic losses are reduced with thinner wafers, as these wafers exhibit lower resistance and inductance. This improves overall power efficiency, which is crucial in energy-sensitive applications like electric vehicles, mobile devices, and renewable energy systems.