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Who's Leading the Future: #EUV vs. #MBL In the world of semiconductor manufacturing, two technologies stand at the forefront of development: Extreme Ultraviolet Lithography (EUV) and Multi-Beam Lithography with Ultraviolet Light and Scalable Exposure (MBL). The main developers of both systems, ASML for EUV and Mapper Lithography for MBL, are actively working on improving their technologies and bringing them to market. The EUV system represents a mature technology that has already found wide application in semiconductor manufacturing. Its main advantages are high resolution and broad industry applicability. However, high equipment costs and the complexity of scaling production remain challenges. The MBL system promises a more flexible and adaptive production environment, as well as reduced mask costs. Its potential to achieve high resolution and ability to make changes to the production process may be attractive to some manufacturers. However, it is still in the early stages of development and requires additional improvements to compete with EUV. The question of who will emerge as the market leader in the future remains open for discussion. Both systems have their strengths and weaknesses, and the future may depend on which companies can overcome their challenges and better adapt to the changing demands of the semiconductor industry.

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