Lebronze alloys’ Post

🌐 𝗜𝗻𝘁𝗲𝗿𝘃𝗶𝗲𝘄 𝘄𝗶𝘁𝗵 𝗣𝗖𝗕 𝗜𝗻𝗱𝘂𝘀𝘁𝗿𝘆 𝗘𝘅𝗽𝗲𝗿𝘁 𝗠𝗿. 𝗠𝗮𝗻𝗳𝗿𝗲𝗱 𝗛𝘂𝘀𝗰𝗵𝗸𝗮 𝗮𝘁 𝗘𝗹𝗲𝗰𝘁𝗿𝗼𝗻𝗶𝗰𝗮 𝟮𝟬𝟮𝟰! Yesterday, I had the pleasure of speaking with Mr. Manfred Huschka at the #Electronica show in Munich. With decades of experience in #PCB lamination, Mr. Manfred shared valuable #insights into the importance of Electronica for both Chinese and international companies in the electronics sector. 📈 Here’s a summary of our discussion: 🔷 How many times have you attended Electronica? 🔷 Do you believe Electronica is beneficial for Chinese companies? 🔷 Chinese companies in every hall – how does this impact business promotion? 🔷 Suggestions for the next Electronica? I put this video at our Youtube and please have look at below: https://lnkd.in/gmamD4bJ 🔍 𝗪𝗵𝗮𝘁 𝗮𝗿𝗲 𝘆𝗼𝘂𝗿 𝘁𝗵𝗼𝘂𝗴𝗵𝘁𝘀? Do you think large-scale industry events like Electronica significantly impact global business #dynamics? Share your perspective! #Electronica2024 #PCBIndustry #GlobalBusiness #Innovation #Networking #TradeShow

🌏 A Glimpse of WIN SOURCE's Journey at electronica Munich 2024 🌐 Take a look back at our experience at #electronica Munich! In this video, we've captured the real moments from the event - from interactions with customers and partners to the highlights at our booth, and the hard work of our team making it all happen. 🙌 🎥Watch the video now and get a closer look at our journey! 👇 Join us as we share the experiences and efforts that drive innovation in the electronics world! 💡 #WINSOURCE #electronica2024 #electronics #TechInnovation #Vlog #IndustryTrends #SupplyChain #TradeShow

As the market for automotive and industrial applications evolves, SiC semiconductors are taking center stage, driven by the need for smaller die areas, higher current densities and lower costs. This shift demands new packaging materials and advanced sintering and interconnection technologies. We will dive into the latest material developments for packaging SiC power devices, including metal ceramic substrates, cutting-edge sintering and soldering techniques, and innovative die top interconnection.   We'll explore how these innovations optimize performance, enhance reliability, and address the challenges posed by higher power density, elevated temperatures, and faster switching frequencies. If you're passionate about pioneering breakthroughs in power module technology, this tutorial is your opportunity to gain valuable insights and strategies to drive forward-thinking innovations.   Don't miss this chance to connect with us at the ECCE Conference and Expo. Dr. Habib Mustain is looking forward to meeting you in his tutorial on October 20th. https://lnkd.in/gaTdiYwP   #ECCEConference #PowerModuleInnovations #SiCPowerDevices #SemiconductorPackaging #Engineering #ScientificInnovation #Tutorial

At Electronica 2024 in Munich, I had the privilege of speaking with Alexander S. Gerfer, CTO of Wurth Elektronik, one of the leading companies in power electronics. As the industry embraces #electrification and #sustainability, Würth Elektronik continues to push the boundaries of innovation, showcasing groundbreaking technologies aimed at enhancing #energy #efficiency, such as low-loss molded inductors and coupled #inductors for advanced power designs. #powerdesign Video Interview: https://lnkd.in/gtSNFai6 #powerelectronics #electronica2024

Say goodbye to cumbersome workflows! Handheld industrial displays are here to transform our work operations, and some exciting developments are underway.  Watch out latest video for all the insights in 2025. #TransformWorkOps #FlexibleDisplays #ThinTech #IndustrialInnovation #FutureOfDisplay #Insights2025 Avnet Emerging Display Technologies, Corp USA Microsoft Ansys STMicroelectronics Winstar Display Co., LTD Planar

𝗠𝗶𝗰𝗿𝗼𝗲𝗹𝗲𝗰𝘁𝗿𝗼𝗻𝗶𝗰𝘀 𝗶𝘀 𝘁𝗵𝗲 𝗳𝘂𝘁𝘂𝗿𝗲 🚀 Today as well as 40 years ago. In the mid-1980s, semiconductors and integrated circuits in particular were conquering more and more areas of application in communications, data processing and industry. During this early growth phase, Dr. Heiner Flocke and Manfred Herz founded iC-Haus GmbH in Bodenheim near Mainz in 1984 as a manufacturer of iCs and microsystems.   𝗛𝗲𝗶𝗻𝗲𝗿 𝗙𝗹𝗼𝗰𝗸𝗲: “From the very beginning, we have opted for the greatest possible depth of vertical integration for a medium-sized company. With the exception of pure wafer production, we combine all development and production expertise for our own standard iCs and microsystems as well as solutions based on ASiCs, now including wafer processing, assembly and testing. This enables us to deliver chip-based solutions that are individually tailored to our customers’ applications and needs. These are unique miniaturized key components that offer a high degree of integration and are particularly economical and efficient.” #iCHaus #Microelectronics #IntegratedCircuits #ThrowbackThursday

SAVE THE DATE: TUESDAY FEB 25th 2025: Revolutionizing PIC Packaging: Optica Industry Meeting on Mass Manufacturing. Join industry leaders at the upcoming Optica Online Industry Meeting on Photonic Integrated Circuit (PIC) Packaging for Volume Production, taking place on February 25, 2025. We start at 10 AM EST, 3 PM UK, 4 PM Central Europe. We will continue the discussion around the transformation of PIC packaging to meet the demands of mass manufacturing, drawing parallels with the advancements seen in CMOS microelectronics. This business meeting will examine ways to accelerate the wider adoption of PIC Technology. Sign up FREE to be in the Zoom room to be able to interact with others. https://lnkd.in/dvXTsSKr The meeting will focus on the critical need to move from specialized, low-volume processes to high-throughput, high-yield methods. Discussions will revolve around key challenges and strategies, including ·     Precision Alignment: Achieving the extremely precise alignment of optical components necessary for optimal PIC performance. ·     Thermal Management: Implementing effective techniques to manage heat generated by PICs, ensuring reliable operation. ·     Wafer-Level Processing: Exploring the shift towards wafer-level processes to increase throughput and reduce costs. Featured speakers at this meeting include: ·     Jeroen Duis (Chief Technology Officer at PHIX Photonics Assembly), with expertise in optical interconnects and PIC packaging ·     Douwe Geuzebroek (Chief Technology Officer at Brilliance RGB) ·     Nikolaus Flöry (Chief Technology Officer at vario-optics) ·     Kees Propstra (VP Global Sales & Marketing, GM US at Quantifi Photonics) ·     Rolando Ferrini (Chief Regional Officer & Head of FEMTOprint Neuchâtel at FEMTOprint SA) ·     Leili Shiramin, imec. ·     Travis Scott (Business Development Manager at Finetech) The meeting will be moderated by Jon Pugh (Director, Photonic Integrated Circuits and Quantum Technologies at Optica) and me. Don't miss this opportunity to be part of the conversation shaping the future of PIC manufacturing! #PICpackaging #photonics #integratedcircuits #massmanufacturing #Optica #innovation #technology

Do you know how to track and predict design resources for complex chip design projects? Next Tuesday, Chouki Aktouf will present Innova's unique and innovative approach to provide eco-friendly/sustainability footprint metrics during an exclusive webinar organised with SemiWiki.com. With these new metrics, Innova will enable to enlarge the life cycle analysis by adding “design” phase to manufacturing. During this webinar, we will be presenting: - How these new metrics can be used in conjunction with other decision-making information related to the resources required for semiconductor, electronics or system design projects. - The 3 main stages to provide the maximum information to the user to take informed decisions. Register now: https://lnkd.in/dptThcKs

Here's an interesting perspective by Manfred Huschka on Electronica 2024. "Lessons to be learned from Electronica 2024 trade show in Munich (Germany) Although Europe’s biggest electronics trade show was a huge success (all halls sold out, record number of visitors, etc.), at least in the 3 halls for printed circuit boards (pcb). Here’s my takeaway: For European visitors: • The biggest number ever of Chinese exhibitors will continue to grow, having already outnumbered European and American exhibitors by a huge margin (Halls A1 and B1 were about 50:50, whereas Hall C6 was entirely Chinese. PRODUCTRONICA next year will probably see even more." Did YOU attend the show? If so, what is YOUR takeaway? #IPC hashtag #SMTA hashtag #IEEE hashtag #PCBs hashtag #PCEA hashtag #substrates hashtag #UltraHDI #UHDI

Curious about how KRÜSS - Advancing your Surface Science can support your development and production needs? Stop by to speak with Andrew Mellor and Jared Harkins and to receive a product demonstration.